YOKOCHI; Tomohiro

Patent Applications and Registrations

Patent applications and USPTO patent grants for YOKOCHI; Tomohiro.The latest application filed is for "semiconductor package, electronic device, and method for manufacturing semiconductor package".

Company Profile

2.14.17

YOKOCHI; Tomohiro - Kariya-city JP
Yokochi; Tomohiro - Kariya JP
Yokochi; Tomohiro - Kariya-shi JP
Yokochi; Tomohiro - Obu JP
Yokochi, Tomohiro - Obu-city JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor Package, Electronic Device, And Method For Manufacturing Semiconductor Package App 20220115283 - YAMAGUCHI; Akihiro ; et al.	2022-04-14
Electronic Component Module Provided With Substrate On Which Electronic Components Are Mounted And Heat Sink And Manufacturing M App 20200258805 - A1	2020-08-13
Multilayer Substrate And Method For Manufacturing The Same App 20180242464 - HASEGAWA; Kenichiro ; et al.	2018-08-23
Package substrate for a semiconductor device having thermoplastic resin layers and conductive patterns Grant 7,378,745 - Hayashi , et al. May 27, 2	2008-05-27
Printed circuit board having colored outer layer Grant 7,323,238 - Kondo , et al. January 29, 2	2008-01-29
Method for manufacturing printed wiring board Grant 7,188,412 - Yazaki , et al. March 13, 2	2007-03-13
Method for manufacturing printed wiring board with embedded electric device Grant 7,165,321 - Kondo , et al. January 23, 2	2007-01-23
Protective film for base substrates of multi-layered board and method and apparatus for inspecting base substrates Grant 7,061,599 - Yokochi , et al. June 13, 2	2006-06-13
Manufacturing method of rigid-flexible printed circuit board and structure thereof Grant 7,036,214 - Kondo , et al. May 2, 2	2006-05-02
Printed board and manufacturing method thereof App 20060068180 - Kondo; Koji ; et al.	2006-03-30
Package substrate for a semiconductor device, a fabrication method for same, and a semiconductor device App 20060044735 - Hayashi; Akimori ; et al.	2006-03-02
Method of manufacturing a printed wiring board Grant 6,972,070 - Yazaki , et al. December 6, 2	2005-12-06
Connecting structure of printed circuit boards Grant 6,966,482 - Totani , et al. November 22, 2	2005-11-22
Manufacturing method of multilayer substrate Grant 6,855,625 - Kondo , et al. February 15, 2	2005-02-15
Method for manufacturing printed wiring board with embedded electric device App 20040091687 - Kondo, Koji ; et al.	2004-05-13
Method for manufacturing printed wiring board App 20040066633 - Yazaki, Yoshitarou ; et al.	2004-04-08
Printed wiring board and method for manufacturing printed wiring board Grant 6,713,687 - Yazaki , et al. March 30, 2	2004-03-30
Method of manufacturing a printed wiring board App 20040052932 - Yazaki, Yoshitaro ; et al.	2004-03-18
Protective film for base substrates of multi-layered board and method and apparatus for inspecting base substrates App 20040037966 - Yokochi, Tomohiro ; et al.	2004-02-26
Printed wiring board with embedded electric device and method for manufacturing printed wiring board with embedded electric device Grant 6,680,441 - Kondo , et al. January 20, 2	2004-01-20
Manufacturing method of multilayer substrate and multilayer substrate produced by the manufacturing method Grant 6,667,443 - Kondo , et al. December 23, 2	2003-12-23
Manufacturing method of multilayer substrate App 20030209796 - Kondo, Koji ; et al.	2003-11-13
Printed wiring board and method of manufacturing a printed wiring board Grant 6,641,898 - Yazaki , et al. November 4, 2	2003-11-04
Manufacturing method of rigid-flexible printed circuit board and structure thereof App 20030173105 - Kondo, Koji ; et al.	2003-09-18
Connecting structure of printed circuit boards App 20030098339 - Totani, Makoto ; et al.	2003-05-29
Printed wiring board with embedded electric device and method for manufacturing printed wiring board with embedded electric device App 20020192442 - Kondo, Koji ; et al.	2002-12-19
Method for interconnecting printed circuit boards and interconnection structure Grant 6,449,836 - Miyake , et al. September 17, 2	2002-09-17
Printed wiring board and method of manufacturing a printed wiring board App 20020086145 - Yazaki, Yoshitaro ; et al.	2002-07-04
Printed wiring board and method for manufacturing printed wiring board App 20020079135 - Yazaki, Yoshitarou ; et al.	2002-06-27
Manufacturing method of multilayer substrate and multilayer substrate produced by the manufacturing method App 20020076903 - Kondo, Koji ; et al.	2002-06-20
Connecting method and connecting structure of printed circuit boards App 20020014518 - Totani, Makoto ; et al.	2002-02-07

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