Patent | Date |
---|
MEMS device, liquid ejecting head, liquid ejecting apparatus, and MEMS device manufacturing method Grant 10,377,134 - Takabe , et al. A | 2019-08-13 |
Method for manufacturing a liquid discharging head or portion thereof Grant 10,121,957 - Hamaguchi , et al. November 6, 2 | 2018-11-06 |
Electronic Device App 20180250935 - Tanaka; Shuichi ;   et al. | 2018-09-06 |
Liquid ejecting head, and manufacturing method of liquid ejecting head Grant 9,902,150 - Matsumoto , et al. February 27, 2 | 2018-02-27 |
Mems Device, Liquid Ejecting Head, Liquid Ejecting Apparatus, And Mems Device Manufacturing Method App 20170368826 - TAKABE; Motoki ;   et al. | 2017-12-28 |
Conduction structure, method of manufacturing conduction structure, droplet ejecting head, and printing apparatus Grant 9,822,452 - Yoda , et al. November 21, 2 | 2017-11-21 |
Conduction structure, method of manufacturing conduction structure, droplet ejecting head, and printing apparatus Grant 9,708,715 - Yoda , et al. July 18, 2 | 2017-07-18 |
Liquid Ejecting Head, And Manufacturing Method Of Liquid Ejecting Head App 20170106653 - MATSUMOTO; Yasuyuki ;   et al. | 2017-04-20 |
Wiring structure, method of manufacturing wiring structure, liquid droplet ejecting head, and liquid droplet ejecting apparatus Grant 9,579,892 - Yoda February 28, 2 | 2017-02-28 |
Wiring mounting structure and method of manufacturing the same, and liquid ejecting head and liquid ejecting apparatus Grant 9,517,624 - Yoda December 13, 2 | 2016-12-13 |
Method of manufacturing a wiring substrate Grant 9,437,489 - Yoda September 6, 2 | 2016-09-06 |
Substrate, method of manufacturing substrate, semiconductor device, and electronic apparatus Grant 9,349,673 - Yoda May 24, 2 | 2016-05-24 |
Semiconductor device, having through electrodes, a manufacturing method thereof, and an electronic apparatus Grant 9,257,404 - Yoda , et al. February 9, 2 | 2016-02-09 |
Wiring structure, method of manufacturing wiring structure, liquid droplet ejecting head, and liquid droplet ejecting apparatus Grant 9,254,653 - Yoda February 9, 2 | 2016-02-09 |
Manufacturing Method Of Piezoelectric Element, Manufacturing Method Of Liquid Discharging Head, And Manufacturing Method Of Liquid Discharging Apparatus App 20160035966 - Hamaguchi; Toshiaki ;   et al. | 2016-02-04 |
Wiring Structure, Method Of Manufacturing Wiring Structure, Liquid Droplet Ejecting Head, And Liquid Droplet Ejecting Apparatus App 20150343769 - YODA; Tsuyoshi | 2015-12-03 |
Wiring Structure, Method Of Manufacturing Wiring Structure, Liquid Droplet Ejecting Head, And Liquid Droplet Ejecting Apparatus App 20150343768 - YODA; Tsuyoshi | 2015-12-03 |
Wiring Mounting Structure And Method Of Manufacturing The Same, And Liquid Ejecting Head And Liquid Ejecting Apparatus App 20150231882 - YODA; Tsuyoshi | 2015-08-20 |
Conduction Structure, Method Of Manufacturing Conduction Structure, Droplet Ejecting Head, And Printing Apparatus App 20150230333 - YODA; Tsuyoshi ;   et al. | 2015-08-13 |
Conduction Structure, Method Of Manufacturing Conduction Structure, Droplet Ejecting Head, And Printing Apparatus App 20150224772 - YODA; Tsuyoshi ;   et al. | 2015-08-13 |
Device-mounted substrate, infrared light sensor and through electrode forming method Grant 9,070,637 - Yoda , et al. June 30, 2 | 2015-06-30 |
Liquid droplet ejecting head, printing apparatus and method of manufacturing liquid droplet ejecting head Grant 8,960,861 - Yoda , et al. February 24, 2 | 2015-02-24 |
Semiconductor Device, Having Through Electrodes, A Manufacturing Method Thereof, And An Electronic Apparatus App 20140306342 - YODA; Tsuyoshi ;   et al. | 2014-10-16 |
Mounted structure, liquid droplet ejection head, liquid droplet ejection apparatus and manufacturing method Grant 8,839,520 - Yoda September 23, 2 | 2014-09-23 |
Semiconductor device having through electrodes, a manufacturing method thereof, and an electronic apparatus Grant 8,796,823 - Yoda , et al. August 5, 2 | 2014-08-05 |
Method Of Manufacturing A Wiring Substrate App 20140082936 - YODA; Tsuyoshi | 2014-03-27 |
Liquid Droplet Ejecting Head, Printing Apparatus And Method Of Manufacturing Liquid Droplet Ejecting Head App 20140085383 - Yoda; Tsuyoshi ;   et al. | 2014-03-27 |
Substrate, Method Of Manufacturing Substrate, Semiconductor Device, And Electronic Apparatus App 20140008816 - Yoda; Tsuyoshi | 2014-01-09 |
Wiring substrate, piezoelectric oscillator and gyrosensor Grant 8,621,926 - Yoda January 7, 2 | 2014-01-07 |
Semiconductor Device, Manufacturing Method Thereof, And Electronic Apparatus App 20130075896 - YODA; Tsuyoshi ;   et al. | 2013-03-28 |
Semiconductor device having through electrodes, a manufacturing method thereof, and an electronic apparatus Grant 8,330,256 - Yoda , et al. December 11, 2 | 2012-12-11 |
Device-mounted Substrate, Infrared Light Sensor And Through Electrode Forming Method App 20120235261 - YODA; Tsuyoshi ;   et al. | 2012-09-20 |
Wiring Substrate, Piezoelectric Oscillator, Gyrosensor And Manufacturing Method Of Wiring Substrate App 20110271757 - YODA; Tsuyoshi | 2011-11-10 |
Mounted Structure, Liquid Droplet Ejection Head, Liquid Droplet Ejection Apparatus And Manufacturing Method App 20100291715 - YODA; Tsuyoshi | 2010-11-18 |
Mounted structure, liquid droplet ejection head, liquid droplet ejection apparatus and manufacturing method Grant 7,784,913 - Yoda August 31, 2 | 2010-08-31 |
Semiconductor Device, Manufacturing Method Thereof, And Electronic Apparatus App 20100123256 - YODA; Tsuyoshi ;   et al. | 2010-05-20 |
Method of manufacturing substrate joint body, substrate joint body and electrooptical device Grant 7,521,797 - Yoda , et al. April 21, 2 | 2009-04-21 |
Device mounting structure, device mounting method, electronic apparatus, liquid droplet ejection head, and liquid droplet ejection apparatus Grant 7,390,079 - Yoda June 24, 2 | 2008-06-24 |
Method for manufacturing a semiconductor substrate and method for manufacturing an electro-optical device with electroless plating Grant 7,326,639 - Akagawa , et al. February 5, 2 | 2008-02-05 |
Device mounting structure, device mounting method, electronic apparatus, liquid droplet ejection head, and liquid droplet ejection apparatus App 20070042613 - Yoda; Tsuyoshi | 2007-02-22 |
Mounted structure, liquid droplet ejection head, liquid droplet ejection apparatus and manufacturing method App 20060164468 - Yoda; Tsuyoshi | 2006-07-27 |
Film forming method, electronic device and electronic apparatus App 20060062978 - Yotsuya; Shinichi ;   et al. | 2006-03-23 |
Method for manufacturing a semiconductor substrate and method for manufacturing an electro-optical device App 20050250306 - Akagawa, Suguru ;   et al. | 2005-11-10 |
Method of manufacturing substrate joint body, substrate joint body and electrooptical device App 20050205992 - Yoda, Tsuyoshi ;   et al. | 2005-09-22 |
Method of fabricating bumps utilizing a resist layer having photosensitive agent and resin Grant 6,900,117 - Yoda May 31, 2 | 2005-05-31 |
Bump forming method, semiconductor device and method of manufacturing the same, circuit board, and electronic instrument App 20020061641 - Yoda, Tsuyoshi | 2002-05-23 |