loadpatents
name:-0.029474973678589
name:-0.027161836624146
name:-0.00042986869812012
Yoda; Tsuyoshi Patent Filings

Yoda; Tsuyoshi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yoda; Tsuyoshi.The latest application filed is for "electronic device".

Company Profile
0.25.24
  • Yoda; Tsuyoshi - Matsumoto JP
  • YODA; Tsuyoshi - Matsumoto-shi JP
  • Yoda; Tsuyoshi - Nagano JP
  • Yoda, Tsuyoshi - Suwa JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
MEMS device, liquid ejecting head, liquid ejecting apparatus, and MEMS device manufacturing method
Grant 10,377,134 - Takabe , et al. A
2019-08-13
Method for manufacturing a liquid discharging head or portion thereof
Grant 10,121,957 - Hamaguchi , et al. November 6, 2
2018-11-06
Electronic Device
App 20180250935 - Tanaka; Shuichi ;   et al.
2018-09-06
Liquid ejecting head, and manufacturing method of liquid ejecting head
Grant 9,902,150 - Matsumoto , et al. February 27, 2
2018-02-27
Mems Device, Liquid Ejecting Head, Liquid Ejecting Apparatus, And Mems Device Manufacturing Method
App 20170368826 - TAKABE; Motoki ;   et al.
2017-12-28
Conduction structure, method of manufacturing conduction structure, droplet ejecting head, and printing apparatus
Grant 9,822,452 - Yoda , et al. November 21, 2
2017-11-21
Conduction structure, method of manufacturing conduction structure, droplet ejecting head, and printing apparatus
Grant 9,708,715 - Yoda , et al. July 18, 2
2017-07-18
Liquid Ejecting Head, And Manufacturing Method Of Liquid Ejecting Head
App 20170106653 - MATSUMOTO; Yasuyuki ;   et al.
2017-04-20
Wiring structure, method of manufacturing wiring structure, liquid droplet ejecting head, and liquid droplet ejecting apparatus
Grant 9,579,892 - Yoda February 28, 2
2017-02-28
Wiring mounting structure and method of manufacturing the same, and liquid ejecting head and liquid ejecting apparatus
Grant 9,517,624 - Yoda December 13, 2
2016-12-13
Method of manufacturing a wiring substrate
Grant 9,437,489 - Yoda September 6, 2
2016-09-06
Substrate, method of manufacturing substrate, semiconductor device, and electronic apparatus
Grant 9,349,673 - Yoda May 24, 2
2016-05-24
Semiconductor device, having through electrodes, a manufacturing method thereof, and an electronic apparatus
Grant 9,257,404 - Yoda , et al. February 9, 2
2016-02-09
Wiring structure, method of manufacturing wiring structure, liquid droplet ejecting head, and liquid droplet ejecting apparatus
Grant 9,254,653 - Yoda February 9, 2
2016-02-09
Manufacturing Method Of Piezoelectric Element, Manufacturing Method Of Liquid Discharging Head, And Manufacturing Method Of Liquid Discharging Apparatus
App 20160035966 - Hamaguchi; Toshiaki ;   et al.
2016-02-04
Wiring Structure, Method Of Manufacturing Wiring Structure, Liquid Droplet Ejecting Head, And Liquid Droplet Ejecting Apparatus
App 20150343769 - YODA; Tsuyoshi
2015-12-03
Wiring Structure, Method Of Manufacturing Wiring Structure, Liquid Droplet Ejecting Head, And Liquid Droplet Ejecting Apparatus
App 20150343768 - YODA; Tsuyoshi
2015-12-03
Wiring Mounting Structure And Method Of Manufacturing The Same, And Liquid Ejecting Head And Liquid Ejecting Apparatus
App 20150231882 - YODA; Tsuyoshi
2015-08-20
Conduction Structure, Method Of Manufacturing Conduction Structure, Droplet Ejecting Head, And Printing Apparatus
App 20150230333 - YODA; Tsuyoshi ;   et al.
2015-08-13
Conduction Structure, Method Of Manufacturing Conduction Structure, Droplet Ejecting Head, And Printing Apparatus
App 20150224772 - YODA; Tsuyoshi ;   et al.
2015-08-13
Device-mounted substrate, infrared light sensor and through electrode forming method
Grant 9,070,637 - Yoda , et al. June 30, 2
2015-06-30
Liquid droplet ejecting head, printing apparatus and method of manufacturing liquid droplet ejecting head
Grant 8,960,861 - Yoda , et al. February 24, 2
2015-02-24
Semiconductor Device, Having Through Electrodes, A Manufacturing Method Thereof, And An Electronic Apparatus
App 20140306342 - YODA; Tsuyoshi ;   et al.
2014-10-16
Mounted structure, liquid droplet ejection head, liquid droplet ejection apparatus and manufacturing method
Grant 8,839,520 - Yoda September 23, 2
2014-09-23
Semiconductor device having through electrodes, a manufacturing method thereof, and an electronic apparatus
Grant 8,796,823 - Yoda , et al. August 5, 2
2014-08-05
Method Of Manufacturing A Wiring Substrate
App 20140082936 - YODA; Tsuyoshi
2014-03-27
Liquid Droplet Ejecting Head, Printing Apparatus And Method Of Manufacturing Liquid Droplet Ejecting Head
App 20140085383 - Yoda; Tsuyoshi ;   et al.
2014-03-27
Substrate, Method Of Manufacturing Substrate, Semiconductor Device, And Electronic Apparatus
App 20140008816 - Yoda; Tsuyoshi
2014-01-09
Wiring substrate, piezoelectric oscillator and gyrosensor
Grant 8,621,926 - Yoda January 7, 2
2014-01-07
Semiconductor Device, Manufacturing Method Thereof, And Electronic Apparatus
App 20130075896 - YODA; Tsuyoshi ;   et al.
2013-03-28
Semiconductor device having through electrodes, a manufacturing method thereof, and an electronic apparatus
Grant 8,330,256 - Yoda , et al. December 11, 2
2012-12-11
Device-mounted Substrate, Infrared Light Sensor And Through Electrode Forming Method
App 20120235261 - YODA; Tsuyoshi ;   et al.
2012-09-20
Wiring Substrate, Piezoelectric Oscillator, Gyrosensor And Manufacturing Method Of Wiring Substrate
App 20110271757 - YODA; Tsuyoshi
2011-11-10
Mounted Structure, Liquid Droplet Ejection Head, Liquid Droplet Ejection Apparatus And Manufacturing Method
App 20100291715 - YODA; Tsuyoshi
2010-11-18
Mounted structure, liquid droplet ejection head, liquid droplet ejection apparatus and manufacturing method
Grant 7,784,913 - Yoda August 31, 2
2010-08-31
Semiconductor Device, Manufacturing Method Thereof, And Electronic Apparatus
App 20100123256 - YODA; Tsuyoshi ;   et al.
2010-05-20
Method of manufacturing substrate joint body, substrate joint body and electrooptical device
Grant 7,521,797 - Yoda , et al. April 21, 2
2009-04-21
Device mounting structure, device mounting method, electronic apparatus, liquid droplet ejection head, and liquid droplet ejection apparatus
Grant 7,390,079 - Yoda June 24, 2
2008-06-24
Method for manufacturing a semiconductor substrate and method for manufacturing an electro-optical device with electroless plating
Grant 7,326,639 - Akagawa , et al. February 5, 2
2008-02-05
Device mounting structure, device mounting method, electronic apparatus, liquid droplet ejection head, and liquid droplet ejection apparatus
App 20070042613 - Yoda; Tsuyoshi
2007-02-22
Mounted structure, liquid droplet ejection head, liquid droplet ejection apparatus and manufacturing method
App 20060164468 - Yoda; Tsuyoshi
2006-07-27
Film forming method, electronic device and electronic apparatus
App 20060062978 - Yotsuya; Shinichi ;   et al.
2006-03-23
Method for manufacturing a semiconductor substrate and method for manufacturing an electro-optical device
App 20050250306 - Akagawa, Suguru ;   et al.
2005-11-10
Method of manufacturing substrate joint body, substrate joint body and electrooptical device
App 20050205992 - Yoda, Tsuyoshi ;   et al.
2005-09-22
Method of fabricating bumps utilizing a resist layer having photosensitive agent and resin
Grant 6,900,117 - Yoda May 31, 2
2005-05-31
Bump forming method, semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
App 20020061641 - Yoda, Tsuyoshi
2002-05-23

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