Yoda; Toshihisa
Patent Applications and Registrations
Patent applications and USPTO patent grants for Yoda; Toshihisa.The latest application filed is for "wiring substrate and method for manufacturing wiring substrate".
- Yoda; Toshihisa - Nagano JP
- YODA; Toshihisa - Nagano-shi JP
| Patent | Date |
|---|---|
| Wiring substrate and method for manufacturing wiring substrate Grant 9,516,753 - Hara , et al. December 6, 2 | 2016-12-06 |
| Wiring Substrate And Method For Manufacturing Wiring Substrate App 20140097013 - Hara; Koichi ; et al. | 2014-04-10 |
| Wiring board, method for manufacturing the same, and semiconductor package Grant 8,119,927 - Yoda , et al. February 21, 2 | 2012-02-21 |
| Wiring Board, Method For Manufacturing The Same, And Semiconductor Package App 20090284943 - YODA; Toshihisa ; et al. | 2009-11-19 |
| Optical parts cap and method of manufacturing the same App 20070069356 - Yoda; Toshihisa ; et al. | 2007-03-29 |
| Optical semiconductor device Grant 7,090,413 - Oda , et al. August 15, 2 | 2006-08-15 |
| Optical cap for semiconductor device Grant 6,984,849 - Nishizawa , et al. January 10, 2 | 2006-01-10 |
| Optical semiconductor device App 20050238296 - Oda, Takuya ; et al. | 2005-10-27 |
| Optical cap for semiconductor device App 20040195580 - Nishizawa, Hironori ; et al. | 2004-10-07 |
| Method for producing a semiconductor package Grant 6,074,567 - Kuraishi , et al. June 13, 2 | 2000-06-13 |
| Nickel or nickel alloy electroplating bath and plating process using the same Grant 5,985,124 - Yoda , et al. November 16, 1 | 1999-11-16 |
| Process for producing a semiconductor package Grant 5,804,422 - Shimizu , et al. September 8, 1 | 1998-09-08 |
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