Yiu; Ho-Yin
Patent Applications and Registrations
Patent applications and USPTO patent grants for Yiu; Ho-Yin.The latest application filed is for "chip package having chip connected to sensing device with redistribution layer in insulator layer".
Company Profile
0.27.28
- Yiu; Ho-Yin - Hong Kong CN
- Yiu; Ho-Yin - Kln HK
- Yiu; Ho-Yin - Hsinchu TW
- YIU; Ho-Yin - Hsinchu City TW
- YIU; Ho-Yin - Kowloon CN
- Yiu; Ho-Yin - Jhongli N/A TW
- Yiu; Ho-Yin - Jhongli City TW
Patent Activity
| Patent | Date |
|---|---|
| Chip package and method for forming the same Grant 10,157,875 - Yiu , et al. Dec | 2018-12-18 |
| Chip package having chip connected to sensing device with redistribution layer in insulator layer Grant 10,056,419 - Yiu , et al. August 21, 2 | 2018-08-21 |
| Chip Package Having Chip Connected To Sensing Device With Redistribution Layer In Insulator Layer App 20180175092 - YIU; Ho-Yin ; et al. | 2018-06-21 |
| Chip package Grant 9,966,358 - Yiu , et al. May 8, 2 | 2018-05-08 |
| Method for forming chip package having chip connected to sensing device with redistribution layer in insulator layer Grant 9,935,148 - Yiu , et al. April 3, 2 | 2018-04-03 |
| Chip scale sensing chip package Grant 9,853,074 - Yiu , et al. December 26, 2 | 2017-12-26 |
| Chip package and fabrication method thereof Grant 9,831,185 - Lee , et al. November 28, 2 | 2017-11-28 |
| Chip module and method for forming the same Grant 9,812,413 - Yiu , et al. November 7, 2 | 2017-11-07 |
| Method of fabricating chip package with laser Grant 9,780,050 - Wen , et al. October 3, 2 | 2017-10-03 |
| Chip package and manufacturing method thereof Grant 9,768,067 - Liu , et al. September 19, 2 | 2017-09-19 |
| Chip package and manufacturing method thereof Grant 9,721,911 - Yiu , et al. August 1, 2 | 2017-08-01 |
| Chip Scale Sensing Chip Package App 20170213865 - YIU; Ho-Yin ; et al. | 2017-07-27 |
| Chip package having a laser stop structure Grant 9,640,405 - Wen , et al. May 2, 2 | 2017-05-02 |
| Chip Package And Manufacturing Method Thereof App 20170076981 - LIU; Chien-Hung ; et al. | 2017-03-16 |
| Chip Package And Fabrication Method Thereof App 20170047300 - WEN; Ying-Nan ; et al. | 2017-02-16 |
| Sensing Chip Package And A Manufacturing Method Thereof App 20170047455 - YIU; Ho-Yin ; et al. | 2017-02-16 |
| Chip Package And Method For Forming The Same App 20170018590 - YIU; Ho-Yin ; et al. | 2017-01-19 |
| Chip package having a dual through hole redistribution layer structure Grant 9,543,233 - Liu , et al. January 10, 2 | 2017-01-10 |
| Chip Package And Method For Forming The Same App 20160372445 - YIU; Ho-Yin ; et al. | 2016-12-22 |
| Chip Package And Fabrication Method Thereof App 20160322305 - LEE; Shih-Yi ; et al. | 2016-11-03 |
| Chip package and method for forming the same Grant 9,437,478 - Ho , et al. September 6, 2 | 2016-09-06 |
| Chip Package And Method For Forming The Same App 20160233260 - YIU; Ho-Yin ; et al. | 2016-08-11 |
| Chip Package And Fabrication Method Thereof App 20160229687 - WEN; Ying-Nan ; et al. | 2016-08-11 |
| Chip package having extended depression for electrical connection and method of manufacturing the same Grant 9,406,578 - Wen , et al. August 2, 2 | 2016-08-02 |
| Chip Module And Method For Forming The Same App 20160211233 - YIU; Ho-Yin ; et al. | 2016-07-21 |
| Chip Package And Fabrication Method Thereof App 20160204061 - YIU; Ho-Yin ; et al. | 2016-07-14 |
| Chip Package And Fabrication Method Thereof App 20160190063 - WEN; Ying-Nan ; et al. | 2016-06-30 |
| Chip Package And Manufacturing Method Thereof App 20160133544 - LIU; Chien-Hung ; et al. | 2016-05-12 |
| Chip Package And Manufacturing Method Thereof App 20160133588 - YIU; Ho-Yin ; et al. | 2016-05-12 |
| Chip Package And Method For Forming The Same App 20150325557 - YIU; Ho-Yin ; et al. | 2015-11-12 |
| Chip Package And Method Of Manufacturing The Same App 20150255358 - WEN; Ying-Nan ; et al. | 2015-09-10 |
| Power module and the method of packaging the same Grant 9,088,206 - Yiu , et al. July 21, 2 | 2015-07-21 |
| Chip package structure and method for forming the same Grant 8,981,497 - Yiu , et al. March 17, 2 | 2015-03-17 |
| Chip Package And Method For Forming The Same App 20140332908 - HO; Yen-Shih ; et al. | 2014-11-13 |
| Capacitive coupler packaging structure Grant 8,791,768 - Yiu , et al. July 29, 2 | 2014-07-29 |
| Chip package and method for forming the same Grant 8,643,070 - Chang , et al. February 4, 2 | 2014-02-04 |
| Chip package and method for forming the same Grant 8,614,488 - Wen , et al. December 24, 2 | 2013-12-24 |
| Chip Package Structure And Method For Forming The Same App 20130020693 - Yiu; Ho-Yin ; et al. | 2013-01-24 |
| Capacitive Coupler Packaging Structure App 20120194301 - YIU; Ho-Yin ; et al. | 2012-08-02 |
| Power Module And The Method Of Packaging The Same App 20120194148 - YIU; Ho-Yin ; et al. | 2012-08-02 |
| Chip Package And Method For Forming The Same App 20120146153 - WEN; Ying-Nan ; et al. | 2012-06-14 |
| Chip Package And Manufacturing Method Thereof App 20120146111 - CHANG; Shu-Ming ; et al. | 2012-06-14 |
| Chip Package And Method For Forming The Same App 20120146108 - CHANG; Shu-Ming ; et al. | 2012-06-14 |
| Top via pattern for bond pad structure Grant 7,323,784 - Yiu , et al. January 29, 2 | 2008-01-29 |
| Top via pattern for bond pad structure App 20060208360 - Yiu; Ho-Yin ; et al. | 2006-09-21 |
| Optical sensor by using tunneling diode Grant 6,693,317 - Yiu , et al. February 17, 2 | 2004-02-17 |
| Novel optical sensor by using tunneling diode App 20030203525 - Yiu, Ho-Yin ; et al. | 2003-10-30 |
| Novel optical sensor by using tunneling diode App 20010039067 - Yiu, Ho-Yin ; et al. | 2001-11-08 |
| Stress buffered bond pad and method of making Grant 5,942,800 - Yiu , et al. August 24, 1 | 1999-08-24 |
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