Yip; Ka Ming
Patent Applications and Registrations
Patent applications and USPTO patent grants for Yip; Ka Ming.The latest application filed is for "shielding coating for selective metallization".
- Yip; Ka Ming - Tai Wai HK
- Yip; Ka-Ming - Fanling CN
| Patent | Date |
|---|---|
| Shielding coating for selective metallization Grant 9,970,114 - Chan , et al. May 15, 2 | 2018-05-15 |
| Shielding Coating For Selective Metallization App 20180073149 - Chan; Hung Tat ; et al. | 2018-03-15 |
| Shielding coating for selective metallization Grant 9,850,578 - Chan , et al. December 26, 2 | 2017-12-26 |
| Shielding coating for selective metallization Grant 9,797,043 - Chan , et al. October 24, 2 | 2017-10-24 |
| Process for electroless plating and a solution used for the same Grant 9,783,890 - Yee , et al. October 10, 2 | 2017-10-10 |
| Process for electroless plating and a solution used for the same Grant 9,499,910 - Yee , et al. November 22, 2 | 2016-11-22 |
| Process For Electroless Plating And A Solution Used For The Same App 20150322574 - YEE; Dennis Kwok-Wai ; et al. | 2015-11-12 |
| Process For Electroless Plating And A Solution Used For The Same App 20140120263 - YEE; Dennis Kwok-Wai ; et al. | 2014-05-01 |
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