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Liquid lenses
Grant 11,346,984 - Karam , et al. May 31, 2 | 2022-05-31 |
Variable Volume Liquid Lenses
App 20220035079 - Karam; Raymond Miller ; et al. | 2022-02-03 |
Liquid Lens
App 20210389547 - KARAM; Raymond Miller ; et al. | 2021-12-16 |
Devices With Liquid Lenses And Test Methods And Assemblies For Testing Devices With Liquid Lenses
App 20210364384 - Gorelchenko; Petr ; et al. | 2021-11-25 |
Method Of Separating A Liquid Lens From An Array Of Liquid Lenses
App 20210086294 - Fiaz; Hasan ; et al. | 2021-03-25 |
Liquid Lenses
App 20200003934 - KARAM; RAYMOND MILLER ; et al. | 2020-01-02 |
Appendage mountable electronic devices conformable to surfaces
Grant 10,357,201 - Rogers , et al. July 23, 2 | 2019-07-23 |
Hyperphenylalaninemia and treatments thereof
Grant 10,265,303 - Martinez , et al. | 2019-04-23 |
Hyperphenylalaninemia And Treatments Thereof
App 20190008839 - Martinez; Aurora ; et al. | 2019-01-10 |
Appendage Mountable Electronic Devices Conformable To Surfaces
App 20180303418 - ROGERS; John A. ; et al. | 2018-10-25 |
Appendage mountable electronic devices conformable to surfaces
Grant 10,052,066 - Rogers , et al. August 21, 2 | 2018-08-21 |
Appendage Mountable Electronic Devices Conformable To Surfaces
App 20170181704 - ROGERS; John A. ; et al. | 2017-06-29 |
Appendage mountable electronic devices conformable to surfaces
Grant 9,554,484 - Rogers , et al. January 24, 2 | 2017-01-24 |
Method of screening drugs that promote LOXL1 expression
Grant 9,481,915 - Liu , et al. November 1, 2 | 2016-11-01 |
Stem cell culture medium and its applications as well as a stem cell culture method
Grant 9,321,995 - Liu , et al. April 26, 2 | 2016-04-26 |
Drug Screening Method, Drugs Promoting Extracellular Matrix Crosslinking And The Applications Thereof
App 20140302181 - Liu; Xiaoqing ; et al. | 2014-10-09 |
Stem cell culture medium and its applications as well as a stem cell culture method
App 20140178987 - Liu; Xiaoqing ; et al. | 2014-06-26 |
Appendage Mountable Electronic Devices COnformable to Surfaces
App 20130333094 - ROGERS; John A ; et al. | 2013-12-19 |
Integrated circuit protruding pad package system and method for manufacturing thereof
Grant 8,587,098 - Chow , et al. November 19, 2 | 2013-11-19 |
Compositions for the treatment of hyperphenylalaninemia
Grant 8,338,423 - Pey Rodriguez , et al. December 25, 2 | 2012-12-25 |
Integrated circuit package system with die and package combination
Grant 8,102,040 - Chow , et al. January 24, 2 | 2012-01-24 |
Integrated Circuit Protruding Pad Package System And Method For Manufacturing Thereof
App 20110233744 - Chow; Seng Guan ; et al. | 2011-09-29 |
Semiconductor package system with substrate having different bondable heights at lead finger tips
Grant 7,986,032 - Chow , et al. July 26, 2 | 2011-07-26 |
Integrated circuit protruding pad package system
Grant 7,968,377 - Chow , et al. June 28, 2 | 2011-06-28 |
Semiconductor package with passive device integration
Grant 7,960,816 - Chow , et al. June 14, 2 | 2011-06-14 |
Compositions For The Treatment Of Hyperphenylalaninemia
App 20100286166 - Pey Rodriguez; ngel ; et al. | 2010-11-11 |
Semiconductor Package System With Substrate Having Different Bondable Heights At Lead Finger Tips
App 20090309237 - Chow; Seng Guan ; et al. | 2009-12-17 |
Integrated Circuit Package System With Die And Package Combination
App 20090309207 - Chow; Seng Guan ; et al. | 2009-12-17 |
Semiconductor package system with substrate having different bondable heights at lead finger tips
Grant 7,598,599 - Chow , et al. October 6, 2 | 2009-10-06 |
Integrated circuit package system with die and package combination
Grant 7,598,606 - Chow , et al. October 6, 2 | 2009-10-06 |
Package stacking lead frame system
Grant 7,388,280 - Shim , et al. June 17, 2 | 2008-06-17 |
Semiconductor Package System With Substrate Having Different Bondable Heights At Lead Finger Tips
App 20070210422 - Chow; Seng Guan ; et al. | 2007-09-13 |
Integrated Circuit Protruding Pad Package System
App 20070063322 - Chow; Seng Guan ; et al. | 2007-03-22 |
Integrated Circuit Package System With Die And Package Combination
App 20060197207 - Chow; Seng Guan ; et al. | 2006-09-07 |
Semiconductor Package With Passive Device Integration
App 20060197198 - Chow; Seng Guan ; et al. | 2006-09-07 |
Package Stacking Lead Frame System
App 20060186514 - Shim; IL Kwon ; et al. | 2006-08-24 |
Stacked die packaging and fabrication method
Grant 7,064,430 - Chow , et al. June 20, 2 | 2006-06-20 |
Stacked die packaging and fabrication method
App 20060043559 - Chow; Seng Guan ; et al. | 2006-03-02 |
Semiconductor package with passive device integration
Grant 7,005,325 - Chow , et al. February 28, 2 | 2006-02-28 |
Semiconductor package with passive device integration
App 20050173783 - Chow, Seng Guan ; et al. | 2005-08-11 |
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