Yin; Meng-Song

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yin; Meng-Song.The latest application filed is for "oligomer, composition and composite material employing the same".

Company Profile

2.9.13

Yin; Meng-Song - Hsinchu TW
Yin; Meng-Song - Hsinchu City TW
Yin; Meng-Song - Hsinchu County TW
Yin; Meng-Song - Taoyuan County TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Oligomer, composition and composite material employing the same Grant 10,844,164 - Yang , et al. November 24, 2	2020-11-24
Magnetic and thermally conductive material and thermally conductive and dielectric layer Grant 10,494,556 - Wu , et al. De	2019-12-03
Physiological signal measuring method and physiological signal measuring device Grant 10,383,537 - Li , et al. A	2019-08-20
Oligomer, composition and composite material employing the same Grant 10,179,833 - Hong , et al. Ja	2019-01-15
Oligomer, Composition And Composite Material Employing The Same App 20180171068 - Yang; Wei-Ta ; et al.	2018-06-21
Physiological Signal Measuring Method And Physiological Signal Measuring Device App 20180168474 - LI; Szu-Ju ; et al.	2018-06-21
Oligomer, Composition And Composite Material Employing The Same App 20170342199 - YANG; Wei-Ta ; et al.	2017-11-30
Oligomer, Composition And Composite Material Employing The Same App 20170342200 - HONG; Ming-Tsung ; et al.	2017-11-30
Sensing device Grant 9,823,141 - Li , et al. November 21, 2	2017-11-21
Magnetic And Thermally Conductive Material And Thermally Conductive And Dielectric Layer App 20170158933 - WU; Chun-Pin ; et al.	2017-06-08
Sensing Device App 20160363489 - Li; Szu-Ju ; et al.	2016-12-15
Low dielectric materials Grant 9,455,067 - Yin , et al. September 27, 2	2016-09-27
Low Dielectric Materials App 20160148719 - YIN; MENG-SONG ; et al.	2016-05-26
Dielectric material with low dielectric loss Grant 9,257,212 - Yin , et al. February 9, 2	2016-02-09
Circuit board Grant 9,245,667 - Yin , et al. January 26, 2	2016-01-26
Prepreg And Method For Manufacturing The Same App 20150191574 - LEE; Wen-Chin ; et al.	2015-07-09
Circuit Board App 20140275335 - YIN; Meng-Song ; et al.	2014-09-18
Dielectric Material With Low Dielectric Loss App 20140275377 - YIN; Meng-Song ; et al.	2014-09-18
Process for preparing epoxy group-containing curable polyphenylene ether resin using high-molecular-weight polyphenylene resin Grant 6,693,149 - Yin , et al. February 17, 2	2004-02-17
Modified layered clay material and epoxy/clay nanocomposite containing the same App 20030039835 - Tsai, Tsung-Yen ; et al.	2003-02-27
Process for preparing epoxy group-containing curable polyphenylene ether resin using high-molecular-weight polyphenylene resin App 20020161117 - Yin, Meng-Song ; et al.	2002-10-31
PPE derivatives and resin composition having the same App 20020072585 - Chiu, Chingchen S. ; et al.	2002-06-13

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