loadpatents
Patent applications and USPTO patent grants for Yin; Li-Wei.The latest application filed is for "cut-fin isolation regions and method forming same".
Patent | Date |
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Cut-Fin Isolation Regions and Method Forming Same App 20220059685 - Wang; Shiang-Bau ;   et al. | 2022-02-24 |
Semiconductor Device And Method App 20210351084 - Wang; Shiang-Bau ;   et al. | 2021-11-11 |
Cut-fin isolation regions and method forming same Grant 11,171,236 - Wang , et al. November 9, 2 | 2021-11-09 |
Semiconductor Structure Cutting Process and Structures Formed Thereby App 20210280695 - Chen; Ryan Chia-Jen ;   et al. | 2021-09-09 |
Semiconductor structure cutting process and structures formed thereby Grant 11,114,549 - Chen , et al. September 7, 2 | 2021-09-07 |
Semiconductor device and method Grant 11,069,579 - Wang , et al. July 20, 2 | 2021-07-20 |
Cutting metal gates in fin field effect transistors Grant 10,872,897 - Yin , et al. December 22, 2 | 2020-12-22 |
Cutting Metal Gates in Fin Field Effect Transistors App 20200279854 - Yin; Li-Wei ;   et al. | 2020-09-03 |
Cutting metal gates in fin field effect transistors Grant 10,658,372 - Yin , et al. | 2020-05-19 |
Semiconductor Device and Method App 20200126868 - Wang; Shiang-Bau ;   et al. | 2020-04-23 |
Cut-Fin Isolation Regions and Method Forming Same App 20200044070 - Wang; Shiang-Bau ;   et al. | 2020-02-06 |
Cutting Metal Gates in Fin Field Effect Transistors App 20200020701 - Yin; Li-Wei ;   et al. | 2020-01-16 |
Cutting metal gates in fin field effect transistors Grant 10,424,588 - Yin , et al. Sept | 2019-09-24 |
Semiconductor structure cutting process and structures formed thereby Grant 10,325,912 - Chen , et al. | 2019-06-18 |
Semiconductor Structure Cutting Process and Structures Formed Thereby App 20190165137 - CHEN; Ryan Chia-Jen ;   et al. | 2019-05-30 |
Cutting Metal Gates in Fin Field Effect Transistors App 20190139969 - Yin; Li-Wei ;   et al. | 2019-05-09 |
Semiconductor Structure Cutting Process and Structures Formed Thereby App 20190131298 - Chen; Ryan Chia-Jen ;   et al. | 2019-05-02 |
Semiconductor Structure Cutting Process and Structures Formed Thereby App 20190131297 - CHEN; RYAN CHIA-JEN ;   et al. | 2019-05-02 |
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