Yin; Heyun

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yin; Heyun.The latest application filed is for "sputter etch material selectivity".

Company Profile

0.8.7

Yin; Heyun - Saugus MA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Sputter Etch Material Selectivity App 20180174843 - Anglin; Kevin ; et al.	2018-06-21
Sputter etch material selectivity Grant 10,002,764 - Anglin , et al. June 19, 2	2018-06-19
Technique for processing a substrate having a non-planar surface Grant 8,679,960 - Papasouliotis , et al. March 25, 2	2014-03-25
Method for processing a substrate having a non-planar substrate surface Grant 8,507,372 - Papasouliotis , et al. August 13, 2	2013-08-13
Method For Processing A Substrate Having A Non-planar Substrate Surface App 20120295430 - Papasouliotis; George D. ; et al.	2012-11-22
Method of processing a substrate having a non-planar surface Grant 8,202,792 - Papasouliotis , et al. June 19, 2	2012-06-19
Technique for Processing a Substrate Having a Non-Planar Surface App 20110086501 - Papasouliotis; George D. ; et al.	2011-04-14
Implantation of multiple species to address copper reliability Grant 7,863,194 - Yin , et al. January 4, 2	2011-01-04
Method Of Processing A Substrate Having A Non-planar Surface App 20100273322 - Papasouliotis; George D. ; et al.	2010-10-28
Implantation Of Multiple Species To Address Copper Reliability App 20100240201 - YIN; Heyun ; et al.	2010-09-23
Implantation of multiple species to address copper reliability Grant 7,737,013 - Yin , et al. June 15, 2	2010-06-15
Doped Layers for Reducing Electromigration App 20100048018 - Gupta; Atul ; et al.	2010-02-25
Implantation Of Multiple Species To Address Copper Reliability App 20090117735 - YIN; Heyun ; et al.	2009-05-07

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