Yin; Fayou
Patent Applications and Registrations
Patent applications and USPTO patent grants for Yin; Fayou.The latest application filed is for "semiconductor device with copper migration stopping of a redistribution layer".
- Yin; Fayou - Chengdu CN
| Patent | Date |
|---|---|
| Semiconductor Device With Copper Migration Stopping Of A Redistribution Layer App 20180174992 - Yin; Fayou ; et al. | 2018-06-21 |
| Semiconductor Device Having Redistribution Layer With Copper Migration Stopping App 20180019199 - Xiao; Ming ; et al. | 2018-01-18 |
| Semiconductor device having conductive bump with improved reliability Grant 9,768,135 - Yao , et al. September 19, 2 | 2017-09-19 |
| Semiconductor Device Having Conductive Bump With Improved Reliability App 20170179059 - Yao; Ze-Qiang ; et al. | 2017-06-22 |
| Semiconductor Device Having Esd Protection Structure And Associated Method For Manufacturing App 20140103416 - Ma; Rongyao ; et al. | 2014-04-17 |
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