Yim; Soon Gyu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yim; Soon Gyu.The latest application filed is for "mems device package".

Company Profile

0.18.29

Yim; Soon Gyu - Seongnam-si KR
Yim; Soon Gyu - Suwon-Si KR
Yim; Soon Gyu - Suwon KR
Yim; Soon Gyu - Gyunggi-do N/A KR
Yim; Soon Gyu - Seongnam KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Wafer level package having cylindrical capacitor and method of fabricating the same Grant 9,153,641 - Lee , et al. October 6, 2	2015-10-06
Mems Device Package App 20150128697 - Kim; Jong Man ; et al.	2015-05-14
Semiconductor package Grant 8,866,288 - Kim , et al. October 21, 2	2014-10-21
Semiconductor package and method for manufacturing the same and semiconductor package module having the same Grant 8,786,064 - Kim , et al. July 22, 2	2014-07-22
Semiconductor Package App 20140110830 - Kim; Jong Man ; et al.	2014-04-24
Method of attaching die using self-assembling monolayer and package substrate including die attached thereto using self-assembling monolayer Grant 8,656,582 - Lee , et al. February 25, 2	2014-02-25
Apparatus and method for inspecting defects in circuit pattern of substrate Grant 8,471,581 - Lee , et al. June 25, 2	2013-06-25
Wafer Level Package Having Cylindrical Capacitor and Method Of Fabrication The Same App 20130147014 - Lee; Seung Seoup ; et al.	2013-06-13
Semiconductor Package And Method For Manufacturing The Same And Semiconductor Package Module Having The Same App 20130105955 - Kim; Jin Su ; et al.	2013-05-02
Semiconductor package with a metal post and manufacturing method thereof Grant 8,409,981 - Kim , et al. April 2, 2	2013-04-02
Wafer level package having cylindrical capacitor and method of fabricating the same Grant 8,378,452 - Lee , et al. February 19, 2	2013-02-19
Radio frequency identification tag, and method of manufacturing the same Grant 8,366,008 - Kim , et al. February 5, 2	2013-02-05
Method of manufacturing a printed circuit board with an embedded electronic component Grant 8,266,792 - Kim , et al. September 18, 2	2012-09-18
Semiconductor Package With A Metal Post And Manufacturing Method Thereof App 20120164825 - KIM; Woon-Chun ; et al.	2012-06-28
Electronic Component Embedded Printed Circuit Board And Manufacturing Method Thereof App 20120124828 - KIM; Woon-Chun ; et al.	2012-05-24
Semiconductor package with a metal post Grant 8,159,071 - Kim , et al. April 17, 2	2012-04-17
Electronic component embedded printed circuit board and manufacturing method thereof Grant 8,130,508 - Kim , et al. March 6, 2	2012-03-06
Manufacturing method of printed circuit board embedded chip App 20120042513 - KIM; Woon Chun ; et al.	2012-02-23
Semiconductor chip package and printed circuit board Grant 8,064,215 - Chung , et al. November 22, 2	2011-11-22
Display array substrate and method of manufacturing display substrate App 20110128709 - Kim; Woon Chun ; et al.	2011-06-02
Mobile Phone App 20110124382 - Kim; Woon-Chun ; et al.	2011-05-26
Apparatus And Method For Inspecting Defects In Circuit Pattern Of Substrate App 20110115516 - Lee; Seung Seoup ; et al.	2011-05-19
Dye-sensitized Solar Cells And Mobile Device Including The Same App 20110061727 - KIM; Woon-Chun ; et al.	2011-03-17
Dye-sensitized Solar Cells And Mobile Device Including The Same App 20110061707 - KIM; Woon-Chun ; et al.	2011-03-17
Display array substrate and method of manufacturing display substrate App 20110061904 - Kim; Woon Chun ; et al.	2011-03-17
Radio Frequency Identification Tag, And Method Of Manufacturing The Same App 20110042466 - KIM; Woon Chun ; et al.	2011-02-24
Radio Frequency Identification Tag, And Method And Mold For Manufacturing The Same App 20110043363 - Kim; Woon Chun ; et al.	2011-02-24
Wafer Level Package Having Cylindrical Capacitor And Method Of Fabricating The Same App 20110037145 - LEE; Seung Seoup ; et al.	2011-02-17
Laser Processing Device App 20100288739 - Lee; Jae-Kwang ; et al.	2010-11-18
Capacitor And Method Of Manufacturing The Same App 20100214719 - Kim; Woon Chun ; et al.	2010-08-26
Method Of Attaching Die Using Self-assembling Monolayer And Package Substrate Including Die Attached Thereto Using Self-assembling Monolayer App 20100187002 - Lee; Seung Seoup ; et al.	2010-07-29
Manufacturing Method Of Printed Circuit Board App 20100140100 - KIM; Woon-Chun ; et al.	2010-06-10
Capacitor App 20100142116 - KIM; Woon-Chun ; et al.	2010-06-10
Electronic Component Embedded Printed Circuit Board And Manufacturing Method Thereof App 20100101847 - KIM; Woon-Chun ; et al.	2010-04-29
Semiconductor Package And Manufacturing Method Thereof App 20100096749 - KIM; Woon-Chun ; et al.	2010-04-22
Semiconductor Package And Method Of Manufacturing The Same App 20100059881 - Kim; Woon-Chun ; et al.	2010-03-11
Printed Circuit Board And Manufacturing Method App 20100051322 - KIM; Woon-Chun ; et al.	2010-03-04
Printed circuit board embedded chip and manufacturing method thereof App 20090321118 - Kim; Woon Chun ; et al.	2009-12-31
Semiconductor chip package and printed circuit board App 20090073667 - Chung; Yul-Kyo ; et al.	2009-03-19

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