| Patent | Date |
|---|
Semiconductor Package With Embedded Optical Die
App 20210405306 - RAGHUNATHAN; Vivek ; et al. | 2021-12-30 |
Semiconductor package with embedded optical die
Grant 11,156,788 - Raghunathan , et al. October 26, 2 | 2021-10-26 |
Molding compound including a carbon nano-tube dispersion
Grant 10,953,593 - Yim , et al. March 23, 2 | 2021-03-23 |
Optoelectronic device module having a silicon interposer
Grant 10,727,368 - Yim , et al. | 2020-07-28 |
Co-packaging With Silicon Photonics Hybrid Planar Lightwave Circuit
App 20200200987 - Kim; Sang Yup ; et al. | 2020-06-25 |
Photonic Engine Platform Utilizing Embedded Wafer Level Packaging Integration
App 20190324223 - Yim; Myung Jin ; et al. | 2019-10-24 |
Semiconductor Package With Embedded Optical Die
App 20190302379 - RAGHUNATHAN; Vivek ; et al. | 2019-10-03 |
Method of fabricating an optical module that includes an electronic package
Grant 10,347,615 - Yim , et al. July 9, 2 | 2019-07-09 |
In-package Photonics Integration And Assembly Architecture
App 20190172821 - Yim; Myung Jin | 2019-06-06 |
Optoelectronic Device Module Having A Silicon Interposer
App 20190006549 - YIM; Myung Jin ; et al. | 2019-01-03 |
Photonic Die Package With Edge Lens
App 20180348434 - Yim; Myung Jin ; et al. | 2018-12-06 |
Molding Compound Including A Carbon Nano-tube Dispersion
App 20180229421 - Yim; Myung Jin ; et al. | 2018-08-16 |
In-package Photonics Integration And Assembly Architecture
App 20180188448 - Yim; Myung Jin | 2018-07-05 |
Optoelectronic packaging assemblies
Grant 10,014,654 - Yim , et al. July 3, 2 | 2018-07-03 |
Forming a carbon nano-tube dispersion
Grant 9,950,464 - Yim , et al. April 24, 2 | 2018-04-24 |
Integrated circuit with chip-on-chip and chip-on-substrate configuration
Grant 9,900,102 - Dosunmu , et al. February 20, 2 | 2018-02-20 |
Method Of Fabricating An Optical Module That Includes An Electronic Package
App 20180047713 - Yim; Myung Jin ; et al. | 2018-02-15 |
Dynamic beam steering optoelectronic packages
Grant 9,893,816 - Kim , et al. February 13, 2 | 2018-02-13 |
Chip On Chip (coc) Package With Interposer
App 20180041003 - Dominguez; Juan E. ; et al. | 2018-02-08 |
Optoelectronic Transceiver Assemblies
App 20170288780 - Yim; Myung Jin ; et al. | 2017-10-05 |
Dynamic Beam Steering Optoelectronic Packages
App 20170279537 - Kim; Woosung ; et al. | 2017-09-28 |
Integrated Circuit With Chip-on-chip And Chip-on-substrate Configuration
App 20170155450 - Dosunmu; Olufemi I. ; et al. | 2017-06-01 |
Optoelectronic Packaging Assemblies
App 20170005453 - YIM; Myung Jin ; et al. | 2017-01-05 |
Package including an underfill material in a portion of an area between the package and a substrate or another package
Grant 9,374,902 - Yim , et al. June 21, 2 | 2016-06-21 |
Forming a carbon nano-tube dispersion
App 20150246479 - Yim; Myung, Jin ; et al. | 2015-09-03 |
Molding compound including a carbon nano-tube dispersion
Grant 9,041,228 - Yim , et al. May 26, 2 | 2015-05-26 |
Package including at least one topological feature on an encapsulant material to resist out-of-plane deformation
Grant 8,653,675 - Zhang , et al. February 18, 2 | 2014-02-18 |
Package Including An Underfill Material In A Portion Of An Area Between The Package And A Substrate Or Another Package
App 20130258578 - Yim; Myung Jin ; et al. | 2013-10-03 |
Package including an underfill material in a portion of an area between the package and a substrate or another package
Grant 8,451,620 - Yim , et al. May 28, 2 | 2013-05-28 |
Methods for fabricating integrated circuit systems including high reliability die under-fill
Grant 8,409,927 - Yim April 2, 2 | 2013-04-02 |
Methods For Fabricating Integrated Circuit Systems Including High Reliability Die Under-fill
App 20130078767 - Yim; Myung Jin | 2013-03-28 |
Method for fabricating through substrate vias in semiconductor substrate
Grant 8,383,460 - Yim February 26, 2 | 2013-02-26 |
Multi-die building block for stacked-die package
Grant 8,344,491 - Adimula , et al. January 1, 2 | 2013-01-01 |
Package Including At Least One Topological Feature On An Encapsulant Material To Resist Out-of-plane Deformation
App 20110127642 - Zhang; James Jian ; et al. | 2011-06-02 |
Package Including An Underfill Material In A Portion Of An Area Between The Package And A Substrate Or Another Package
App 20110128711 - Yim; Myung Jin ; et al. | 2011-06-02 |
Multi-die Building Block For Stacked-die Package
App 20100164085 - Adimula; Ravikumar ; et al. | 2010-07-01 |
Protective Thin Film Coating In Chip Packaging
App 20100164083 - Yim; Myung Jin | 2010-07-01 |
Semiconductor Package Substrate With Metal Bumps
App 20100167466 - Adimula; Ravikumar ; et al. | 2010-07-01 |
Molding Compound Including A Carbon Nano-tube Dispersion
App 20100155934 - Yim; Myung Jin ; et al. | 2010-06-24 |
Package on Package Assembly using Electrically Conductive Adhesive Material
App 20100148359 - Quevedo; Nanette ; et al. | 2010-06-17 |
Low Temperature Board Level Assembly Using Anisotropically Conductive Materials
App 20100123258 - Yim; Myung Jin ; et al. | 2010-05-20 |
CMOS image sensor module with wafers
Grant 7,446,384 - Paik , et al. November 4, 2 | 2008-11-04 |
Wafer level chip size package for CMOS image sensor module and manufacturing method thereof
App 20070054419 - Paik; Kyung-Wook ; et al. | 2007-03-08 |
Image sensor module and method thereof
App 20060252246 - Paik; Kyung-Wook ; et al. | 2006-11-09 |
Multilayered anisotropic conductive adhesive for fine pitch
Grant 7,081,675 - Yim , et al. July 25, 2 | 2006-07-25 |
Multilayered anisotropic conductive adhesive for fine pitch
App 20060033213 - Yim; Myung Jin ; et al. | 2006-02-16 |
Anisotropic conductive adhesive for fine pitch and COG packaged LCD module
App 20060035036 - Yim; Myung Jin ; et al. | 2006-02-16 |
High reliability non-conductive adhesives for non-solder flip chip bondings and flip chip bonding method using the same
Grant 6,930,399 - Paik , et al. August 16, 2 | 2005-08-16 |
High adhesion triple layered anisotropic conductive adhesive film
Grant 6,878,435 - Paik , et al. April 12, 2 | 2005-04-12 |
High reliability non-conductive adhesives for non-solder flip chip bondings and flip chip bonding method using the same
App 20030143797 - Paik, Kyung-Wook ; et al. | 2003-07-31 |
Method for fabricating wafer-level flip chip package using pre-coated anisotropic conductive adhesive
Grant 6,518,097 - Yim , et al. February 11, 2 | 2003-02-11 |
High adhesion triple layered anisotropic conductive adhesive film
App 20030017327 - Paik, Kyung Wook ; et al. | 2003-01-23 |
Anisotropic conductive film and method of fabricating the same for ultra-fine pitch COG application
App 20030008133 - Paik, Kyung wook ; et al. | 2003-01-09 |
Method for manufacturing conductive adhesive for high frequency flip chip package application
App 20020111423 - Paik, Kyung wook ; et al. | 2002-08-15 |
Method for forming flip chip bump and UBM for high speed copper interconnect chip using electroless plating method
Grant 6,362,090 - Paik , et al. March 26, 2 | 2002-03-26 |
Preparation method of anisotropic conductive adhesive for flip chip interconnection on organic substrate
Grant 6,238,597 - Yim , et al. May 29, 2 | 2001-05-29 |
| 