| Patent | Date |
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Low-k dielectric films
Grant 11,393,678 - Durand , et al. July 19, 2 | 2022-07-19 |
Systems And Methods For Forming Uv-cured Low-k Dielectric Films
App 20220108884 - Xie; Bo ; et al. | 2022-04-07 |
Low-k dielectric with self-forming barrier layer
Grant 11,289,369 - Ding , et al. March 29, 2 | 2022-03-29 |
Systems And Methods For Depositing Low-k Dielectric Films
App 20220084815 - Xie; Bo ; et al. | 2022-03-17 |
Systems And Methods For Cleaning Low-k Deposition Chambers
App 20220081765 - Xie; Bo ; et al. | 2022-03-17 |
Systems And Methods For Depositing Low-k Dielectric Films
App 20210272800 - Mukherjee; Shaunak ; et al. | 2021-09-02 |
Low-K Dielectric Films
App 20210050212 - Durand; William J. ; et al. | 2021-02-18 |
Low-K Dielectric With Self-Forming Barrier Layer
App 20200388532 - Ding; Yi ; et al. | 2020-12-10 |
Low Dielectric Constant Oxide And Low Resistance Op Stack For 3d Nand Application
App 20200126784 - HAN; Xinhai ; et al. | 2020-04-23 |
Non-uv High Hardness Low K Film Deposition
App 20200075321 - MUKHERJEE; Shaunak ; et al. | 2020-03-05 |
Low dielectric constant oxide and low resistance OP stack for 3D NAND application
Grant 10,553,427 - Han , et al. Fe | 2020-02-04 |
Low Dielectric Constant Oxide And Low Resistance Op Stack For 3d Nand Application
App 20180315592 - HAN; Xinhai ; et al. | 2018-11-01 |
UV assisted silylation for porous low-k film sealing
Grant 10,113,234 - Xie , et al. October 30, 2 | 2018-10-30 |
Forming a low-k dielectric layer with reduced dielectric constant and strengthened mechanical properties
Grant 9,850,574 - Kim , et al. December 26, 2 | 2017-12-26 |
Enhancement of modulus and hardness for UV-cured ultra low-k dielectric films
Grant 9,659,765 - Yim , et al. May 23, 2 | 2017-05-23 |
Low Temp Single Precursor Arc Hard Mask For Multilayer Patterning Application
App 20170125241 - MUKHERJEE; Shaunak ; et al. | 2017-05-04 |
Cobalt selectivity improvement in selective cobalt process sequence
Grant 9,478,460 - Shek , et al. October 25, 2 | 2016-10-25 |
Multi-layer dielectric stack for plasma damage protection
Grant 9,391,024 - Xie , et al. July 12, 2 | 2016-07-12 |
Cobalt Selectivity Improvement In Selective Cobalt Process Sequence
App 20160141203 - SHEK; MEI-YEE ; et al. | 2016-05-19 |
Post treatment for dielectric constant reduction with pore generation on low K dielectric films
Grant 9,324,571 - Yim , et al. April 26, 2 | 2016-04-26 |
Multi-layer Dielectric Stack For Plasma Damage Protection
App 20160111373 - XIE; Bo ; et al. | 2016-04-21 |
Air-gap structure formation with ultra low-k dielectric layer on PECVD low-k chamber
Grant 9,312,167 - Kim , et al. April 12, 2 | 2016-04-12 |
Air-gap Structure Formation With Ultra Low-k Dielectric Layer On Pecvd Low-k Chamber
App 20160099167 - KIM; Taewan ; et al. | 2016-04-07 |
Uv Assisted Silylation For Porous Low-k Film Sealing
App 20160017492 - XIE; Bo ; et al. | 2016-01-21 |
Enhancement Of Modulus And Hardness For Uv-cured Ultra Low-k Dielectric Films
App 20160020090 - YIM; Kang Sub ; et al. | 2016-01-21 |
Plasma-enhanced And Radical-based Cvd Of Porous Carbon-doped Oxide Films Assisted By Radical Curing
App 20160017495 - CHEN; Yihong ; et al. | 2016-01-21 |
Post Treatment For Dielectric Constant Reduction With Pore Generation On Low K Dielectric Films
App 20150380265 - YIM; Kang Sub ; et al. | 2015-12-31 |
Uv Curing Process To Improve Mechanical Strength And Throughput On Low-k Dielectric Films
App 20150368803 - YIM; Kang Sub ; et al. | 2015-12-24 |
Adhesion layer to minimize dielectric constant increase with good adhesion strength in a PECVD process
Grant 9,165,998 - Yim , et al. October 20, 2 | 2015-10-20 |
Low-k Films With Enhanced Crosslinking By Uv Curing
App 20150284849 - YIM; Kang Sub ; et al. | 2015-10-08 |
Low-k Dielectric Layer With Reduced Dielectric Constant And Strengthened Mechanical Properties
App 20150232992 - KIM; Taewan ; et al. | 2015-08-20 |
Cobalt selectivity improvement in selective cobalt process sequence
Grant 9,105,695 - Shek , et al. August 11, 2 | 2015-08-11 |
Method to reduce dielectric constant of a porous low-k film
Grant 8,993,444 - Chan , et al. March 31, 2 | 2015-03-31 |
Cobalt Selectivity Improvement In Selective Cobalt Process Sequence
App 20140349480 - SHEK; Mei-yee ; et al. | 2014-11-27 |
Adhesion Layer To Minimize Dielectric Constant Increase With Good Adhesion Strength In A Pecvd Process
App 20140264780 - YIM; Kang Sub ; et al. | 2014-09-18 |
Method To Reduce Dielectric Constant Of A Porous Low-k Film
App 20140017895 - CHAN; Kelvin ; et al. | 2014-01-16 |
UV assisted silylation for recovery and pore sealing of damaged low K films
Grant 8,492,170 - Xie , et al. July 23, 2 | 2013-07-23 |
Prevention and reduction of solvent and solution penetration into porous dielectrics using a thin barrier layer
Grant 8,481,422 - Chan , et al. July 9, 2 | 2013-07-09 |
Microelectronic structure including a low k dielectric and a method of controlling carbon distribution in the structure
Grant 8,349,746 - Xie , et al. January 8, 2 | 2013-01-08 |
Uv Assisted Silylation For Recovery And Pore Sealing Of Damaged Low K Films
App 20120270339 - Xie; Bo ; et al. | 2012-10-25 |
Prevention And Reduction Of Solvent And Solution Penetration Into Porous Dielectrics Using A Thin Barrier Layer
App 20120208366 - Chan; Kelvin ; et al. | 2012-08-16 |
Prevention and reduction of solvent and solution penetration into porous dielectrics using a thin barrier layer
Grant 8,236,684 - Chan , et al. August 7, 2 | 2012-08-07 |
Dielectric recovery of plasma damaged low-k films by UV-assisted photochemical deposition
Grant 8,216,861 - Yim , et al. July 10, 2 | 2012-07-10 |
In-situ Low-k Capping To Improve Integration Damage Resistance
App 20120156890 - YIM; KANG SUB ; et al. | 2012-06-21 |
Process For Lowering Adhesion Layer Thickness And Improving Damage Resistance For Thin Ultra Low-k Dielectric Film
App 20120121823 - CHHABRA; MAHENDRA ; et al. | 2012-05-17 |
Ultra Low Dielectric Materials Using Hybrid Precursors Containing Silicon With Organic Functional Groups By Plasma-enhanced Chemical Vapor Deposition
App 20110206857 - Yim; Kang Sub ; et al. | 2011-08-25 |
Microelectronic structure including a low K dielectric and a method of controlling carbon distribution in the structure
App 20110204492 - Xie; Bo ; et al. | 2011-08-25 |
Silicon precursors to make ultra low-K films of K<2.2 with high mechanical properties by plasma enhanced chemical vapor deposition
Grant 7,998,536 - Yim , et al. August 16, 2 | 2011-08-16 |
Silicon precursors to make ultra low-K films with high mechanical properties by plasma enhanced chemical vapor deposition
Grant 7,989,033 - Yim , et al. August 2, 2 | 2011-08-02 |
Methods And Apparatus Of Creating Airgap In Dielectric Layers For The Reduction Of Rc Delay
App 20110104891 - AL-BAYATI; AMIR ; et al. | 2011-05-05 |
Methods and apparatus of creating airgap in dielectric layers for the reduction of RC delay
Grant 7,879,683 - Al-Bayati , et al. February 1, 2 | 2011-02-01 |
Low dielectric (low k) barrier films with oxygen doping by plasma-enhanced chemical vapor deposition (PECVD)
Grant 7,745,328 - Yim , et al. June 29, 2 | 2010-06-29 |
Methods To Promote Adhesion Between Barrier Layer And Porous Low-k Film Deposited From Multiple Liquid Precursors
App 20100015816 - Chan; Kelvin ; et al. | 2010-01-21 |
STRUCTURE AND METHOD FOR SiCOH INTERFACES WITH INCREASED MECHANICAL STRENGTH
App 20100009161 - Edelstein; Daniel C. ; et al. | 2010-01-14 |
Prevention And Reduction Of Solvent And Solution Penetration Into Porous Dielectrics Using A Thin Barrier Layer
App 20090325381 - CHAN; KELVIN ; et al. | 2009-12-31 |
Structure and method for porous SiCOH dielectric layers and adhesion promoting or etch stop layers having increased interfacial and mechanical strength
Grant 7,615,482 - Edelstein , et al. November 10, 2 | 2009-11-10 |
Multi-stage curing of low K nano-porous films
Grant 7,611,996 - Schmitt , et al. November 3, 2 | 2009-11-03 |
Methods And Apparatus Of Creating Airgap In Dielectric Layers For The Reduction Of Rc Delay
App 20090093112 - AL-BAYATI; AMIR ; et al. | 2009-04-09 |
Low Dielectric (low K) Barrier Films With Oxygen Doping By Plasma-enhanced Chemical Vapor Deposition (pecvd)
App 20090053902 - Yim; Kang Sub ; et al. | 2009-02-26 |
NOVEL SILICON PRECURSORS TO MAKE ULTRA LOW-K FILMS OF K<2.2 WITH HIGH MECHANICAL PROPERTIES BY PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION
App 20090017639 - Yim; Kang Sub ; et al. | 2009-01-15 |
Novel Silicon Precursors To Make Ultra Low-k Films With High Mechanical Properties By Plasma Enhanced Chemical Vapor Deposition
App 20090017231 - Yim; Kang Sub ; et al. | 2009-01-15 |
Low dielectric (low k) barrier films with oxygen doping by plasma-enhanced chemical vapor deposition (PECVD)
Grant 7,465,659 - Yim , et al. December 16, 2 | 2008-12-16 |
STRUCTURE AND METHOD FOR SiCOH INTERFACES WITH INCREASED MECHANICAL STRENGTH
App 20080233366 - Edelstein; Daniel C. ; et al. | 2008-09-25 |
Method for forming ultra low k films using electron beam
Grant 7,422,774 - Zheng , et al. September 9, 2 | 2008-09-09 |
Low temperature process to produce low-K dielectrics with low stress by plasma-enhanced chemical vapor deposition (PECVD)
Grant 7,422,776 - Yim , et al. September 9, 2 | 2008-09-09 |
Hermetic cap layers formed on low-.kappa. films by plasma enhanced chemical vapor deposition
Grant 7,399,364 - Nguyen , et al. July 15, 2 | 2008-07-15 |
Multi-stage Curing Of Low K Nano-porous Films
App 20080099920 - Schmitt; Francimar ; et al. | 2008-05-01 |
Method to reduce gas-phase reactions in a PECVD process with silicon and organic precursors to deposit defect-free initial layers
Grant 7,297,376 - Yim , et al. November 20, 2 | 2007-11-20 |
Hermetic cap layers formed on low-k films by plasma enhanced chemical vapor deposition
Grant 7,285,503 - Nguyen , et al. October 23, 2 | 2007-10-23 |
Enhancement of remote plasma source clean for dielectric films
App 20070207275 - Nowak; Thomas ; et al. | 2007-09-06 |
Method for producing gate stack sidewall spacers
Grant 7,253,123 - Arghavani , et al. August 7, 2 | 2007-08-07 |
Low dielectric (low k) barrier films with oxygen doping by plasma-enhanced chemical vapor deposition (PECVD)
Grant 7,157,384 - Yim , et al. January 2, 2 | 2007-01-02 |
New Low Dielectric (low K) Barrier Films With Oxygen Doping By Plasma-enhanced Chemical Vapor Deposition (pecvd)
App 20060246737 - Yim; Kang Sub ; et al. | 2006-11-02 |
Hermetic Cap Layers Formed On Low-k Films By Plasma Enhanced Chemical Vapor Deposition
App 20060219174 - Nguyen; Vu Ngoc Tran ; et al. | 2006-10-05 |
Method for producing gate stack sidewall spacers
App 20060154493 - Arghavani; Reza ; et al. | 2006-07-13 |
Method and apparatus for deposition of low dielectric constant materials
App 20060144334 - Yim; Kang Sub ; et al. | 2006-07-06 |
Method for forming ultra low k films using electron beam
Grant 7,060,330 - Zheng , et al. June 13, 2 | 2006-06-13 |
Ultra low dielectric materials based on hybrid system of linear silicon precursor and organic porogen by plasma-enhanced chemical vapor deposition (PECVD)
Grant 7,056,560 - Yim , et al. June 6, 2 | 2006-06-06 |
Method and apparatus for deposition of low dielectric constant materials
Grant 7,008,484 - Yim , et al. March 7, 2 | 2006-03-07 |
Low temperature process to produce low-K dielectrics with low stress by plasma-enhanced chemical vapor deposition (PECVD)
App 20060043591 - Yim; Kang Sub ; et al. | 2006-03-02 |
Ultra low k plasma CVD nanotube/spin-on dielectrics with improved properties for advanced nanoelectronic device fabrication
Grant 6,984,579 - Nguyen , et al. January 10, 2 | 2006-01-10 |
Hermetic cap layers formed on low-k films by plasma enhanced chemical vapor deposition
App 20050282404 - Nguyen, Vu Ngoc Tran ; et al. | 2005-12-22 |
Multi-stage curing of low K nano-porous films
App 20050230834 - Schmitt, Francimar ; et al. | 2005-10-20 |
Method for forming ultra low k films using electron beam
App 20050153073 - Zheng, Yi ; et al. | 2005-07-14 |
Low dielectric (low k) barrier films with oxygen doping by plasma-enhanced chemical vapor deposition (PECVD)
App 20050130440 - Yim, Kang Sub ; et al. | 2005-06-16 |
Method for producing semiconductor including forming a layer containing at least silicon carbide and forming a second layer containing at least silicon oxygen carbide
Grant 6,838,393 - Yim , et al. January 4, 2 | 2005-01-04 |
Ultra low k plasma CVD nanotube/spin-on dielectrics with improved properties for advanced nanoelectronic device fabrication
App 20040169281 - Nguyen, Son Van ; et al. | 2004-09-02 |
Ultra low dielectric materials based on hybrid system of linear silicon precursor and organic porogen by plasma-enhanced chemical vapor deposition (PECVD)
App 20040156987 - Yim, Kang Sub ; et al. | 2004-08-12 |
Method for forming ultra low k films using electron beam
App 20040101633 - Zheng, Yi ; et al. | 2004-05-27 |
Method and apparatus for deposition of low dielectric constant materials
App 20030207033 - Yim, Kang Sub ; et al. | 2003-11-06 |
Low dielectric (low k) barrier films with oxygen doping by plasma-enhanced chemical vapor deposition (pecvd)
App 20030139035 - Yim, Kang Sub ; et al. | 2003-07-24 |
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