Yih; Wei-Chi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yih; Wei-Chi.The latest application filed is for "wafer-level semiconductor device packages with electromagnetic interference shielding".

Company Profile

0.6.6

Yih; Wei-Chi - Taichung N/A TW
Yih; Wei-Chi - Taichung City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Wafer-level semiconductor device packages with electromagnetic interference shielding Grant 8,378,466 - Chiu , et al. February 19, 2	2013-02-19
Wafer and semiconductor package Grant 8,110,931 - Chang , et al. February 7, 2	2012-02-07
Semiconductor package and method for packaging a semiconductor package Grant 8,076,786 - Hung , et al. December 13, 2	2011-12-13
Semiconductor package and method for processing and bonding a wire Grant 8,053,906 - Chang , et al. November 8, 2	2011-11-08
Semiconductor package, method for enhancing the bond of a bonding wire, and method for manufacturing a semiconductor package Grant 8,018,075 - Chang , et al. September 13, 2	2011-09-13
Wafer-Level Semiconductor Device Packages with Electromagnetic Interference Shielding App 20110115060 - Chiu; Chi-Tsung ; et al.	2011-05-19
Manufacturing Method For Package Structure App 20100184255 - LIU; Chien ; et al.	2010-07-22
Semiconductor Package And Method For Packaging A Semiconductor Package App 20100007011 - HUNG; Chang Ying ; et al.	2010-01-14
Semiconductor Package And Method For Processing And Bonding A Wire App 20100007009 - CHANG; Hsiao Chuan ; et al.	2010-01-14
Semiconductor Package, Method For Enhancing The Bond Of A Bonding Wire, And Method For Manufacturing A Semiconductor Package App 20100007010 - CHANG; Hsiao Chuan ; et al.	2010-01-14
Wafer And Semiconductor Package App 20100007004 - CHANG; Hsiao Chuan ; et al.	2010-01-14

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