YIEH; Ellie

Patent Applications and Registrations

Patent applications and USPTO patent grants for YIEH; Ellie.The latest application filed is for "integrated platform for tin pvd and high-k ald for beol mim capacitor".

Company Profile

8.82.80

YIEH; Ellie - San Jose CA
Yieh; Ellie - Sunnyvale CA
Yieh; Ellie - Millbrae CA
Yieh, Ellie - Milbrae CA
Yieh; Ellie - Santa Clara CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Integrated Platform For Tin Pvd And High-k Ald For Beol Mim Capacitor App 20220310776 - WONG; Keith Tatseun ; et al.	2022-09-29
Methods And Apparatus For Processing A Substrate App 20220298636 - ASRANI; Soham Sunjay ; et al.	2022-09-22
Methods And Apparatus For Processing A Substrate App 20220301867 - TANNOS; Jethro ; et al.	2022-09-22
Process chamber for etching low k and other dielectric films Grant 11,410,860 - Lubomirsky , et al. August 9, 2	2022-08-09
Methods And Apparatus For Processing A Substrate App 20220230887 - SHEK; Meiyee ; et al.	2022-07-21
Multi-source ion beam etch system Grant 11,387,071 - Liang , et al. July 12, 2	2022-07-12
Methods and apparatuses for forming interconnection structures Grant 11,205,589 - Ren , et al. December 21, 2	2021-12-21
Process Chamber For Etching Low K And Other Dielectric Films App 20210134618 - Lubomirsky; Dmitry ; et al.	2021-05-06
PROCESS TO IMPROVE INTERFACE STATE DENSITY Dit ON DEEP TRENCH ISOLATION (DTI) FOR CMOS IMAGE SENSOR App 20210111222 - Li; Philip Hsin-hua ; et al.	2021-04-15
Methods And Apparatuses For Forming Interconnection Structures App 20210104434 - Ren; He ; et al.	2021-04-08
Multi-source Ion Beam Etch System App 20210104374 - Liang; Qiwei ; et al.	2021-04-08
Residual removal Grant 10,964,527 - Kim , et al. March 30, 2	2021-03-30
Method and system for three-dimensional (3D) structure fill Grant 10,943,779 - Yieh , et al. March 9, 2	2021-03-09
Process chamber for etching low K and other dielectric films Grant 10,923,367 - Lubomirsky , et al. February 16, 2	2021-02-16
Methods of patterning nickel silicide layers on a semiconductor device Grant 10,692,734 - Kim , et al.	2020-06-23
Methods Of Patterning Nickel Silicide Layers On A Semiconductor Device App 20200135492 - KIM; JONG MUN ; et al.	2020-04-30
Residual Removal App 20190393024 - KIM; Jong Mun ; et al.	2019-12-26
Selective deposition of metal silicides Grant 10,475,655 - Hung , et al. Nov	2019-11-12
Process Chamber For Etching Low K And Other Dielectric Films App 20180358244 - LUBOMIRSKY; Dmitry ; et al.	2018-12-13
Selective Deposition Of Metal Silicides App 20180342395 - HUNG; Raymond ; et al.	2018-11-29
Process chamber for etching low K and other dielectric films Grant 10,096,496 - Lubomirsky , et al. October 9, 2	2018-10-09
Low-temperature Atomic Layer Deposition Of Boron Nitride And Bn Structures App 20180040476 - WOLF; Steven ; et al.	2018-02-08
Process Chamber For Etching Low K And Other Dielectric Films App 20170229325 - LUBOMIRSKY; Dmitry ; et al.	2017-08-10
Process Chamber For Dielectric Gapfill App 20170226637 - Lubomirsky; Dmitry ; et al.	2017-08-10
Process chamber for etching low k and other dielectric films Grant 9,666,414 - Lubomirsky , et al. May 30, 2	2017-05-30
Method And System For Three-dimensional (3d) Structure Fill App 20170069488 - Yieh; Ellie ; et al.	2017-03-09
Method and system for three-dimensional (3D) structure fill Grant 9,530,674 - Yieh , et al. December 27, 2	2016-12-27
Method And System For Three-dimensional (3d) Structure Fill App 20150093907 - YIEH; Ellie ; et al.	2015-04-02
Method Of Depositing Thin Metal-organic Films App 20150079301 - NEMANI; Srinivas ; et al.	2015-03-19
Method of multiple patterning of a low-K dielectric film Grant 8,940,642 - Nemani , et al. January 27, 2	2015-01-27
Post etch treatment (PET) of a low-K dielectric film Grant 8,871,650 - Nemani , et al. October 28, 2	2014-10-28
Method of patterning a low-K dielectric film Grant 8,741,775 - Nemani , et al. June 3, 2	2014-06-03
Process Chamber For Dielectric Gapfill App 20140083362 - LUBOMIRSKY; Dmitry ; et al.	2014-03-27
Process Chamber For Etching Low K And Other Dielectric Films App 20130105303 - LUBOMIRSKY; Dmitry ; et al.	2013-05-02
Post Etch Treatment (pet) Of A Low-k Dielectric Film App 20130109187 - Nemani; Srinivas D. ; et al.	2013-05-02
Method Of Patterning A Low-k Dielectric Film App 20130023124 - Nemani; Srinivas D. ; et al.	2013-01-24
Method Of Multiple Patterning Of A Low-k Dielectric Film App 20130023122 - Nemani; Srinivas D. ; et al.	2013-01-24
High quality silicon oxide films by remote plasma CVD from disilane precursors Grant 8,242,031 - Mallick , et al. August 14, 2	2012-08-14
Dielectric deposition and etch back processes for bottom up gapfill Grant 8,232,176 - Lubomirsky , et al. July 31, 2	2012-07-31
Process Chamber For Dielectric Gapfill App 20120073501 - Lubomirsky; Dmitry ; et al.	2012-03-29
Post-deposition treatment to enhance properties of Si-O-C low K films Grant 8,143,174 - Xia , et al. March 27, 2	2012-03-27
High Quality Silicon Oxide Films By Remote Plasma Cvd From Disilane Precursors App 20110014798 - Mallick; Abhijit Basu ; et al.	2011-01-20
High quality silicon oxide films by remote plasma CVD from disilane precursors Grant 7,867,923 - Mallick , et al. January 11, 2	2011-01-11
Memory cell having stressed layers Grant 7,678,662 - Arghavani , et al. March 16, 2	2010-03-16
High Quality Silicon Oxide Films By Remote Plasma Cvd From Disilane Precursors App 20090104755 - Mallick; Abhijit Basu ; et al.	2009-04-23
Accelerated plasma clean Grant 7,506,654 - Chandran , et al. March 24, 2	2009-03-24
Method of forming a low-K dual damascene interconnect structure Grant 7,435,685 - Delgadino , et al. October 14, 2	2008-10-14
Method Of Forming A Low-k Dual Damascene Interconnect Structure App 20080145998 - DELGADINO; GERARDO A. ; et al.	2008-06-19
Post-deposition Treatment To Enhance Properties Of Si-o-c Low K Films App 20080132087 - Xia; Li-Qun ; et al.	2008-06-05
Post-deposition treatment to enhance properties of Si-O-C low k films Grant 7,326,657 - Xia , et al. February 5, 2	2008-02-05
Dielectric Deposition And Etch Back Processes For Bottom Up Gapfill App 20070298585 - Lubomirsky; Dmitry ; et al.	2007-12-27
Process Chamber For Dielectric Gapfill App 20070289534 - Lubomirsky; Dmitry ; et al.	2007-12-20
Process Chamber For Dielectric Gapfill App 20070281106 - Lubomirsky; Dmitry ; et al.	2007-12-06
Process Chamber For Dielectric Gapfill App 20070277734 - Lubomirsky; Dmitry ; et al.	2007-12-06
Gap-fill Depositions In The Formation Of Silicon Containing Dielectric Materials App 20070212850 - Ingle; Nitin K. ; et al.	2007-09-13
Memory Cell Having Stressed Layers App 20070132054 - Arghavani; Reza ; et al.	2007-06-14
Method of depositing low k films Grant 7,160,821 - Huang , et al. January 9, 2	2007-01-09
CVD plasma assisted lower dielectric constant SICOH film Grant 7,153,787 - Cho , et al. December 26, 2	2006-12-26
Method of depositing dielectric materials including oxygen-doped silicon carbide in damascene applications Grant 7,151,053 - Lee , et al. December 19, 2	2006-12-19
Method of forming a low-K dual damascene interconnect structure Grant 7,132,369 - Delgadino , et al. November 7, 2	2006-11-07
Method of depositing dielectric films Grant 7,117,064 - Nemani , et al. October 3, 2	2006-10-03
Method of decreasing the k value in sioc layer deposited by chemical vapor deposition Grant 7,074,708 - Gaillard , et al. July 11, 2	2006-07-11
Method and apparatus for deposition of low dielectric constant materials App 20060144334 - Yim; Kang Sub ; et al.	2006-07-06
Method of depositing dielectric films App 20060141805 - Nemani; Srinivas D. ; et al.	2006-06-29
Method and apparatus for deposition of low dielectric constant materials Grant 7,008,484 - Yim , et al. March 7, 2	2006-03-07
Method of depositing dielectric films Grant 7,001,850 - Nemani , et al. February 21, 2	2006-02-21
Method of depositing low k films App 20050260864 - Huang, Tzu-Fang ; et al.	2005-11-24
Method of depositing dielectric materials in damascene applications App 20050233576 - Lee, Ju-Hyung ; et al.	2005-10-20
CVD plasma assisted lower dielectric constant SICOH film Grant 6,943,127 - Cho , et al. September 13, 2	2005-09-13
Hardness improvement of silicon carboxy films Grant 6,936,309 - Li , et al. August 30, 2	2005-08-30
Solvent free photoresist strip and residue removal processing for post etching of low-k films App 20050158667 - Nguyen, Huong Thanh ; et al.	2005-07-21
CVD plasma assisted lower dielectric constant sicoh film App 20050153572 - Cho, Seon-Mee ; et al.	2005-07-14
Accelerated plasma clean App 20050103266 - Chandran, Shankar N. ; et al.	2005-05-19
Method of depositing dielectric materials in damascene applications Grant 6,890,850 - Lee , et al. May 10, 2	2005-05-10
Post-deposition treatment to enhance properties of Si-O-C low K films App 20050070128 - Xia, Li-Qun ; et al.	2005-03-31
Post-deposition treatment to enhance properties of Si-O-C low films Grant 6,858,923 - Xia , et al. February 22, 2	2005-02-22
Method of depositing dielectric films App 20050020048 - Nemani, Srinivas D. ; et al.	2005-01-27
Use of cyclic siloxanes for hardness improvement App 20040234688 - Singh, Vinita ; et al.	2004-11-25
Use of cyclic siloxanes for hardness improvement of low k dielectric films Grant 6,815,373 - Singh , et al. November 9, 2	2004-11-09
Accelerated plasma clean Grant 6,814,087 - Chandran , et al. November 9, 2	2004-11-09
Method of depositing low K films Grant 6,806,207 - Huang , et al. October 19, 2	2004-10-19
Method of decreasing the K value in SIOC layer deposited by chemical vapor deposition Grant 6,784,119 - Gaillard , et al. August 31, 2	2004-08-31
Method of decreasing the K value in SIOC layer deposited by chemical vapor deposition App 20040166665 - Gaillard, Frederic ; et al.	2004-08-26
Method of forming a low-K dual damascene interconnect structure App 20040157453 - Delgadino, Gerardo A. ; et al.	2004-08-12
Method of depositing dielectric films Grant 6,764,958 - Nemani , et al. July 20, 2	2004-07-20
Integration scheme for dual damascene structure Grant 6,753,258 - Gaillard , et al. June 22, 2	2004-06-22
Silicon carbide cap layers for low dielectric constant silicon oxide layers Grant 6,750,141 - Xia , et al. June 15, 2	2004-06-15
Purge heater design and process development for the improvement of low k film properties Grant 6,709,721 - Rocha-Alvarez , et al. March 23, 2	2004-03-23
Method of decreasing the K value in SIOC layer deposited by chemical vapor deposition App 20040029400 - Gaillard, Frederic ; et al.	2004-02-12
Solvent free photoresist strip and residue removal processing for post etching of low-k films Grant 6,680,164 - Nguyen , et al. January 20, 2	2004-01-20
Method and apparatus for processing semiconductor substrates with hydroxyl radicals App 20030221621 - Pokharna, Himanshu ; et al.	2003-12-04
Method and apparatus for deposition of low dielectric constant materials App 20030207033 - Yim, Kang Sub ; et al.	2003-11-06
Methods and apparatus to enhance properties of Si-O-C low K films Grant 6,635,575 - Xia , et al. October 21, 2	2003-10-21
Use of cyclic siloxanes for hardness improvement App 20030194880 - Singh, Vinita ; et al.	2003-10-16
Crosslink cyclo-siloxane compound with linear bridging group to form ultra low k dielectric App 20030194495 - Li, Lihua ; et al.	2003-10-16
Process for forming a low dielectric constant carbon-containing film Grant 6,632,478 - Gaillard , et al. October 14, 2	2003-10-14
Hardness improvement of silicon carboxy films App 20030186000 - Li, Lihua ; et al.	2003-10-02
Method of decreasing the K value in SiOC layer deposited by chemical vapor deposition Grant 6,627,532 - Gaillard , et al. September 30, 2	2003-09-30
Method of depositing low K films App 20030162410 - Huang, Tzu-Fang ; et al.	2003-08-28
Thermal CVD process for depositing a low dielectric constant carbon-doped silicon oxide film Grant 6,602,806 - Xia , et al. August 5, 2	2003-08-05
Method and apparatus for forming a dielectric film using helium as a carrier gas Grant 6,599,574 - Yieh , et al. July 29, 2	2003-07-29
Method of depositing low k films using an oxidizing plasma Grant 6,593,247 - Huang , et al. July 15, 2	2003-07-15
Method of depositing dielectric materials in damascene applications App 20030129827 - Lee, Ju-Hyung ; et al.	2003-07-10
Surface treatment of c-doped SiO2 film to enhance film stability during O2 ashing Grant 6,583,497 - Xia , et al. June 24, 2	2003-06-24
CVD plasma assisted lower dielectric constant sicoh film App 20030104708 - Cho, Seon-Mee ; et al.	2003-06-05
Solvent free photoresist strip and residue removal processing for post etching of low-k films App 20030104320 - Nguyen, Huong Thanh ; et al.	2003-06-05
Method of depositing organosilicate layers Grant 6,573,196 - Gaillard , et al. June 3, 2	2003-06-03
Method for cleaning a process chamber Grant 6,569,257 - Nguyen , et al. May 27, 2	2003-05-27
Post-deposition treatment to enhance properties of SI-O-C low films App 20030077857 - Xia, Li-Qun ; et al.	2003-04-24
Method of depositing organosillicate layers Grant 6,531,398 - Gaillard , et al. March 11, 2	2003-03-11
Silicon carbide cap layers for low dielectric constant silicon oxide layers App 20030013295 - Xia, Li-Qun ; et al.	2003-01-16
Surface treatment of c-doped SiO2 film to enhance film stability during 02 ashing App 20030008528 - Xia, Li-Qun ; et al.	2003-01-09
Dual frequency plasma enhanced chemical vapor deposition of silicon carbide layers App 20030008069 - Nemani, Srinivas ; et al.	2003-01-09
Multistep chamber cleaning and film deposition process using a remote plasma that also enhances film gap fill Grant 6,503,843 - Xia , et al. January 7, 2	2003-01-07
Cvd Plasma Assisted Lower Dielectric Constant Sicoh Film App 20030003768 - Cho, Seon-Mee ; et al.	2003-01-02
Method of depositing organosilicate layers Grant 6,500,773 - Gaillard , et al. December 31, 2	2002-12-31
Optical Marker Layer For Etch Endpoint Determination App 20020192845 - Nguyen, Huong Thanh ; et al.	2002-12-19
Purge heater design and process development for the improvement of low k film properties App 20020187262 - Rocha-Alvarez, Juan Carlos ; et al.	2002-12-12
Post-deposition treatment to enhance properties of Si-O-C low K films Grant 6,486,061 - Xia , et al. November 26, 2	2002-11-26
CVD plasma assisted lower dielectric constant sicoh film Grant 6,486,082 - Cho , et al. November 26, 2	2002-11-26
Two-step flourinated-borophosophosilicate glass deposition process App 20020173169 - Campana, Francimar ; et al.	2002-11-21
Methods for forming a low dielectric constant carbon-containing film, and films produced thereby App 20020164429 - Gaillard, Frederic ; et al.	2002-11-07
Method for planarizing organosilicate layers App 20020160692 - Rivoire, Maurice ; et al.	2002-10-31
Silicon carbide cap layers for low dielectric constant silicon oxide layers Grant 6,472,333 - Xia , et al. October 29, 2	2002-10-29
Surface treatment of C-doped SiO2 film to enhance film stability during O2 ashing Grant 6,465,372 - Xia , et al. October 15, 2	2002-10-15
Dual frequency plasma enhanced chemical vapor deposition of silicon carbide layers Grant 6,465,366 - Nemani , et al. October 15, 2	2002-10-15
Plasma treatment of organosilicate layers App 20020142104 - Nemani, Srinivas ; et al.	2002-10-03
Silicon Carbide Cap Layers For Low Dielectric Constant Silicon Oxide Layers App 20020142578 - Xia, Li-Qun ; et al.	2002-10-03
Method and apparatus for forming material layers from atomic gasses App 20020119673 - Yieh, Ellie ; et al.	2002-08-29
Accelerated plasma clean App 20020104467 - Chandran, Shankar N. ; et al.	2002-08-08
Interface with dielectric layer and method of making App 20020102856 - Xia, Li-Qun ; et al.	2002-08-01
Method of reducing undesired etching of insulation due to elevated boron concentrations Grant 6,426,015 - Xia , et al. July 30, 2	2002-07-30
Formation of a liquid-like silica layer by reaction of an organosilicon compound and a hydroxyl forming compound Grant 6,413,583 - Moghadam , et al. July 2, 2	2002-07-02
Accelerated plasma clean Grant 6,374,831 - Chandran , et al. April 23, 2	2002-04-23
Sub-atmospheric chemical vapor deposition system with dopant bypass Grant 6,360,685 - Xia , et al. March 26, 2	2002-03-26
Methods and apparatus for depositing premetal dielectric layer at sub-atmospheric and high temperature conditions Grant 6,348,099 - Xia , et al. February 19, 2	2002-02-19
Methods and apparatus for gettering fluorine from chamber material surfaces Grant 6,347,636 - Xia , et al. February 19, 2	2002-02-19
Method And Apparatus For Forming Material Layers From Atomic Gasses App 20010052323 - YIEH, ELLIE ; et al.	2001-12-20
Dielectric film deposition employing a bistertiarybutylaminesilane precursor App 20010000476 - Xia, Li-Qun ; et al.	2001-04-26
Two-step borophosphosilicate glass deposition process and related devices and apparatus Grant 6,218,268 - Xia , et al. April 17, 2	2001-04-17
Cleaning process end point determination using throttle valve position Grant 6,170,492 - Ueda , et al. January 9, 2	2001-01-09
Method for forming low compressive stress fluorinated ozone/TEOS oxide film Grant 6,121,164 - Yieh , et al. September 19, 2	2000-09-19
Deposition resistant lining for CVD chamber Grant 6,117,244 - Bang , et al. September 12, 2	2000-09-12
Methods for shallow trench isolation Grant 6,114,216 - Yieh , et al. September 5, 2	2000-09-05
Lid assembly for a process chamber employing asymmetric flow geometries Grant 6,110,556 - Bang , et al. August 29, 2	2000-08-29
Methods and apparatus for forming ultra-shallow doped regions using doped silicon oxide films Grant 6,099,647 - Yieh , et al. August 8, 2	2000-08-08
Methods and apparatus for forming ultra-shallow doped regions using doped silicon oxide films Grant 5,994,209 - Yieh , et al. November 30, 1	1999-11-30
Methods for depositing premetal dielectric layer at sub-atmospheric and high temperature conditions Grant 5,963,840 - Xia , et al. October 5, 1	1999-10-05
Method and apparatus for gettering fluorine from chamber material surfaces Grant 5,935,340 - Xia , et al. August 10, 1	1999-08-10
Methods and apparatus for cleaning surfaces in a substrate processing system Grant 5,812,403 - Fong , et al. September 22, 1	1998-09-22
Method for depositing ozone/TEOS silicon oxide films of reduced surface sensitivity Grant 5,356,722 - Nguyen , et al. October 18, 1	1994-10-18

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