Yiang; Kok Yong

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yiang; Kok Yong.The latest application filed is for "capacitors positioned at the device level in an integrated circuit product and methods of making such capacitors".

Company Profile

0.8.7

Yiang; Kok Yong - Santa Barbara CA
Yiang; Kok Yong - Santa Clara CA US
Yiang; Kok-Yong - Sunnyvale CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Capacitors positioned at the device level in an integrated circuit product and methods of making such capacitors Grant 9,275,989 - Yiang , et al. March 1, 2	2016-03-01
Capacitors Positioned At The Device Level In An Integrated Circuit Product And Methods Of Making Such Capacitors App 20150123181 - Yiang; Kok Yong ; et al.	2015-05-07
Capacitors positioned at the device level in an integrated circuit product and methods of making such capacitors Grant 8,975,133 - Yiang , et al. March 10, 2	2015-03-10
Copper interconnects with improved electromigration lifetime Grant 8,723,321 - Woo , et al. May 13, 2	2014-05-13
Capacitors Positioned At The Device Level In An Integrated Circuit Product And Methods Of Making Such Capacitors App 20140042510 - Yiang; Kok Yong ; et al.	2014-02-13
Method and system for non-destructive determination of dielectric breakdown voltage in a semiconductor wafer Grant 8,501,504 - Yiang , et al. August 6, 2	2013-08-06
Dielectric breakdown lifetime enhancement using alternating current (AC) capacitance Grant 8,022,716 - Yiang , et al. September 20, 2	2011-09-20
Dielectric Breakdown Lifetime Enhancement Using Alternating Current (ac) Capacitance App 20110018565 - Yiang; Kok Yong ; et al.	2011-01-27
Method and system for non-destructive determination of dielectric breakdown voltage in a semiconductor wafer App 20100117676 - Yiang; Kok Yong ; et al.	2010-05-13
Method Of Forming Vias In A Semiconductor Device App 20080182407 - Zhai; Jun ; et al.	2008-07-31
Copper interconnects with improved electromigration lifetime App 20070284748 - Woo; Christy ; et al.	2007-12-13

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