| Patent | Date |
|---|
Carbon Fiber Composite Artificial Bone And Preparation Method Thereof
App 20200188117 - TAN; Zhoujian ; et al. | 2020-06-18 |
Optoelectronic modules including optoelectronic device subassemblies and methods of manufacturing the same
Grant 10,510,932 - Rudmann , et al. Dec | 2019-12-17 |
Dispatching Method And Device, And Non-transitory Readable Storage Medium
App 20190240834 - YI; Xu | 2019-08-08 |
Order re-check system
Grant 10,360,770 - Ning , et al. | 2019-07-23 |
Optoelectronic Modules Including Optoelectronic Device Subassemblies And Methods Of Manufacturing The Same
App 20190214533 - Rudmann; Hartmut ; et al. | 2019-07-11 |
Optoelectronic device subassemblies and methods of manufacturing the same
Grant 10,243,111 - Rudmann , et al. | 2019-03-26 |
Optoelectronic modules that have shielding to reduce light leakage or stray light, and fabrication methods for such modules
Grant 10,199,426 - Rudmann , et al. Fe | 2019-02-05 |
Optoelectronic modules that have shielding to reduce light leakage or stray light
Grant 10,186,540 - Rudmann , et al. Ja | 2019-01-22 |
Stabilized microwave-frequency source
Grant 10,009,103 - Vahala , et al. June 26, 2 | 2018-06-26 |
Optoelectronic Modules That Have Shielding To Reduce Light Leakage Or Stray Light, And Fabrication Methods For Such Modules
App 20180102394 - Rudmann; Hartmut ; et al. | 2018-04-12 |
Optoelectronic Modules Including Optoelectronic Device Subassemblies And Methods Of Manufacturing The Same
App 20180006192 - Rudmann; Hartmut ; et al. | 2018-01-04 |
Optoelectronic modules that have shielding to reduce light leakage or stray light, and fabrication methods for such modules
Grant 9,859,327 - Rudmann , et al. January 2, 2 | 2018-01-02 |
Order Re-check System
App 20170270754 - NING; Runsu ; et al. | 2017-09-21 |
Optoelectronic Modules That Have Shielding To Reduce Light Leakage Or Stray Light, And Fabrication Methods For Such Modules
App 20170084663 - Rudmann; Hartmut ; et al. | 2017-03-23 |
Stabilized Microwave-frequency Source
App 20170012705 - VAHALA; Kerry ; et al. | 2017-01-12 |
Optoelectronic modules that have shielding to reduce light leakage or stray light, and fabrication methods for such modules
Grant 9,543,354 - Rudmann , et al. January 10, 2 | 2017-01-10 |
Stabilized microwave-frequency source
Grant 9,450,673 - Vahala , et al. September 20, 2 | 2016-09-20 |
Optoelectronic Modules That Have Shielding To Reduce Light Leakage Or Stray Light, And Fabrication Methods For Such Modules
App 20150325613 - Rudmann; Hartmut ; et al. | 2015-11-12 |
Stabilized Microwave-frequency Source
App 20150236784 - Vahala; Kerry ; et al. | 2015-08-20 |
Optoelectronic modules that have shielding to reduce light leakage or stray light, and fabrication methods for such modules
Grant 9,094,593 - Rudmann , et al. July 28, 2 | 2015-07-28 |
Optoelectronic Modules That Have Shielding To Reduce Light Leakage Or Stray Light, And Fabrication Methods For Such Modules
App 20150036046 - Rudmann; Hartmut ; et al. | 2015-02-05 |
Optoelectronic Modules That Have Shielding To Reduce Light Leakage Or Stray Light, And Fabrication Methods For Such Modules
App 20150034975 - Rudmann; Hartmut ; et al. | 2015-02-05 |
Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding
Grant 7,060,613 - Chooi , et al. June 13, 2 | 2006-06-13 |
Apparatus and methods to clean copper contamination on wafer edge
Grant 6,813,796 - Roy , et al. November 9, 2 | 2004-11-09 |
Method of using silicon rich carbide as a barrier material for fluorinated materials
Grant 6,730,591 - Han , et al. May 4, 2 | 2004-05-04 |
Apparatus and methods to clean copper contamination on wafer edge
App 20030140943 - Roy, Sudipto Ranendra ; et al. | 2003-07-31 |
Method and apparatus for removing contaminants from the perimeter of a semiconductor substrate
Grant 6,540,841 - Roy , et al. April 1, 2 | 2003-04-01 |
Method of using silicon rich carbide as a barrier material for fluorinated materials
App 20020164872 - Han, Licheng ; et al. | 2002-11-07 |
Method of using silicon rich carbide as a barrier material for fluorinated materials
Grant 6,429,129 - Han , et al. August 6, 2 | 2002-08-06 |
Use of boron carbide as an etch-stop and barrier layer for copper dual damascene metallization
Grant 6,424,044 - Han , et al. July 23, 2 | 2002-07-23 |
Method of copper transport prevention by a sputtered gettering layer on backside of wafer
Grant 6,358,821 - Gupta , et al. March 19, 2 | 2002-03-19 |
Method of fabricating copper metal bumps for flip-chip or chip-on-board IC bonding on terminating copper pads
Grant 6,340,608 - Chooi , et al. January 22, 2 | 2002-01-22 |
Post treatment of via opening by N-containing plasma or H-containing plasma for elimination of fluorine species in the FSG near the surfaces of the via opening
Grant 6,232,217 - Ang , et al. May 15, 2 | 2001-05-15 |
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