Yi; Sang-Hyun

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yi; Sang-Hyun.The latest application filed is for "bulk acoustic wave resonator".

Company Profile

3.16.24

Yi; Sang-Hyun - Suwon-si KR
Yi; Sang-Hyun - Ansan-si KR
YI; Sang Hyun - Suwon KR
Yi; Sang Hyun - Gyeonggi-do KR
Yi; Sang Hyun - Suwon-city KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electronic device and electronic device manufacturing method Grant 11,430,617 - Choi , et al. August 30, 2	2022-08-30
Bulk Acoustic Wave Resonator App 20220149806 - LEE; Tae Kyung ; et al.	2022-05-12
Bulk-acoustic Wave Resonator App 20220085791 - KIM; Tae Yoon ; et al.	2022-03-17
Bulk Acoustic Resonator App 20210313955 - LIM; Chang Hyun ; et al.	2021-10-07
Electronic Device And Electronic Device Manufacturing Method App 20210142962 - CHOI; Jong-Min ; et al.	2021-05-13
Bulk acoustic wave resonator and method of manufacturing the same Grant 10,992,281 - Kim , et al. April 27, 2	2021-04-27
Electronic device and electronic device manufacturing method Grant 10,910,170 - Choi , et al. February 2, 2	2021-02-02
Acoustic resonator and method for manufacturing the same Grant 10,790,798 - Yang , et al. September 29, 2	2020-09-29
Bulk acoustic wave resonator and method for manufacturing the same Grant 10,715,099 - Kyoung , et al.	2020-07-14
Bulk Acoustic Wave Resonator And Method Of Manufacturing The Same App 20190356293 - KIM; Yong Suk ; et al.	2019-11-21
Bulk acoustic wave filter Grant 10,340,882 - Yi	2019-07-02
Electronic Device And Electronic Device Manufacturing Method App 20190080860 - CHOI; Jong-Min ; et al.	2019-03-14
Bulk Acoustic Wave Resonator And Method For Manufacturing The Same App 20180123554 - KYOUNG; Je Hong ; et al.	2018-05-03
Bulk Acoustic Wave Filter App 20180006632 - YI; Sang Hyun	2018-01-04
Acoustic Resonator And Method For Manufacturing The Same App 20170244379 - YANG; Jeong Suong ; et al.	2017-08-24
Biochip And Device For Measuring Biochip App 20160077043 - YI; Sang Hyun	2016-03-17
Frame structure for preventing deformation, and electronic device including the same Grant 9,232,680 - Yi , et al. January 5, 2	2016-01-05
Semiconductor Device Having Metal Lines with Slits App 20150187706 - YI; Sang-Hyun ; et al.	2015-07-02
Semiconductor device having metal lines with slits Grant 8,946,897 - Yi , et al. February 3, 2	2015-02-03
Droplet Forming Device And Method Of Forming Droplet Using The Same App 20140360288 - YI; Sang Hyun ; et al.	2014-12-11
Frame Structure For Preventing Deformation, And Electronic Device Including The Same App 20140198464 - YI; Sang-Hyun ; et al.	2014-07-17
Gel-forming Device App 20140141504 - YI; Sang Hyun ; et al.	2014-05-22
Cell chip and method for manufacturing the same Grant 8,673,622 - Lee , et al. March 18, 2	2014-03-18
Semiconductor Device Having Metal Lines With Slits App 20130193583 - YI; Sang-Hyun ; et al.	2013-08-01
Incubating Container And Sample Injection Method Therefor App 20130133778 - YI; Sang Hyun ; et al.	2013-05-30
Semiconductor device having metal lines with slits Grant 8,421,229 - Yi , et al. April 16, 2	2013-04-16
Cell Chip And Method For Manufacturing The Same App 20120309649 - LEE; Dong Woo ; et al.	2012-12-06
Semiconductor Device Having Metal Lines With Slits App 20110068474 - YI; SANG-HYUN ; et al.	2011-03-24
Semiconductor device having metal lines with slits Grant 7,863,746 - Yi , et al. January 4, 2	2011-01-04
Semiconductor device having no cracks in one or more layers underlying a metal line layer Grant 7,847,403 - Yi , et al. December 7, 2	2010-12-07
Semiconductor device having no cracks in one or more layers underlying a metal line layer and method of manufacturing the same App 20070284749 - Yi; Sang Hyun ; et al.	2007-12-13
Semiconductor device having metal lines with slits App 20070273030 - Yi; Sang-Hyun ; et al.	2007-11-29
Semiconductor device having no cracks in one or more layers underlying a metal line layer and method of manufacturing the same Grant 7,233,070 - Yi , et al. June 19, 2	2007-06-19
Semiconductor device having no cracks in one or more layers underlying a metal line layer and method of manufacturing the same App 20040245646 - Yi, Sang Hyun ; et al.	2004-12-09
Semiconductor device having no cracks in one or more layers underlying a metal line layer and method of manufacturing the same Grant 6,777,806 - Yi , et al. August 17, 2	2004-08-17
Semiconductor device having no cracks in one or more layers underlying a metal line layer and method of manufacturing the same App 20020125572 - Yi, Sang Hyun ; et al.	2002-09-12

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