loadpatents
name:-0.021471977233887
name:-0.015625953674316
name:-0.00054383277893066
Yi; Robert H. Patent Filings

Yi; Robert H.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yi; Robert H..The latest application filed is for "passive alignment using elastic averaging in optoelectronics applications".

Company Profile
0.8.9
  • Yi; Robert H. - San Jose CA
  • Yi; Robert H. - Palo Alto CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Passive alignment using elastic averaging in optoelectronics applications
Grant 8,244,081 - Yi , et al. August 14, 2
2012-08-14
Passive Alignment Using Elastic Averaging In Optoelectronics Applications
App 20100247034 - Yi; Robert H. ;   et al.
2010-09-30
Passive alignment using elastic averaging in optoelectronics applications
Grant 7,764,853 - Yi , et al. July 27, 2
2010-07-27
Passive Alignment Using Elastic Averaging In Optoelectronics Applications
App 20090028506 - Yi; Robert H. ;   et al.
2009-01-29
Axis translation installation mechanism for optoelectronics modules and method
Grant 7,473,039 - Yi , et al. January 6, 2
2009-01-06
Passive alignment using elastic averaging in optoelectronics applications
Grant 7,454,105 - Yi , et al. November 18, 2
2008-11-18
Axis Translation Installation Mechanism For Optoelectronics Modules And Method
App 20080025673 - Yi; Robert H. ;   et al.
2008-01-31
Axis translation installation mechanism for optoelectronic modules
Grant 7,255,495 - Yi , et al. August 14, 2
2007-08-14
Optoelectronic assembly with coupling features for alignment
Grant 7,233,723 - Williams , et al. June 19, 2
2007-06-19
Semi-disposable optoelectronic rapid diagnostic test system
App 20070081920 - Murphy; R. Sean ;   et al.
2007-04-12
Wafer bonding using reactive foils for massively parallel micro-electromechanical systems packaging
Grant 7,202,553 - Snyder , et al. April 10, 2
2007-04-10
Wafer bonding using reactive foils for massively parallel micro-electromechanical systems packaging
Grant 7,176,106 - Snyder , et al. February 13, 2
2007-02-13
Optical turn system for optoelectronic modules
App 20060110110 - Yi; Robert H. ;   et al.
2006-05-25
Axis translation installation mechanism for optoelectronic modules
App 20060104572 - Yi; Robert H. ;   et al.
2006-05-18
Optoelectronic assembly with coupling features for alignment
App 20060023998 - Williams; James Howard ;   et al.
2006-02-02
Wafer bonding using reactive foils for massively parallel micro-electromechanical systems packaging
App 20040251524 - Snyder, Tanya Jegeris ;   et al.
2004-12-16
Wafer bonding using reactive foils for massively parallel micro-electromechanical systems packaging
App 20040253765 - Snyder, Tanya Jegeris ;   et al.
2004-12-16

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