Yi; Kuk Hwea
Patent Applications and Registrations
Patent applications and USPTO patent grants for Yi; Kuk Hwea.The latest application filed is for "method for separating sapphire wafer into chips".
- Yi; Kuk Hwea - Seoul KR
| Patent | Date |
|---|---|
| Method for separating sapphire wafer into chips Grant 7,074,652 - Yoon , et al. July 11, 2 | 2006-07-11 |
| Method for separating sapphire wafer into chips App 20050079687 - Yoon, Jeong Goo ; et al. | 2005-04-14 |
| Method for cutting semiconductor wafer using laser scribing process App 20040198024 - Yoon, Jeong Goo ; et al. | 2004-10-07 |
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