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Patent applications and USPTO patent grants for Yeung; Max M..The latest application filed is for "laterally interconnecting structures".
Patent | Date |
---|---|
Construction of an optimized SEC-DED code and logic for soft errors in semiconductor memories Grant 7,117,420 - Yeung , et al. October 3, 2 | 2006-10-03 |
Direct alignment of contacts Grant 6,815,812 - Ali , et al. November 9, 2 | 2004-11-09 |
Laterally interconnecting structures Grant 6,784,102 - Yeung , et al. August 31, 2 | 2004-08-31 |
Circuit component placement Grant 6,768,142 - Ali , et al. July 27, 2 | 2004-07-27 |
Laterally interconnecting structures App 20040072421 - Yeung, Max M. ;   et al. | 2004-04-15 |
Contact ring architecture Grant 6,683,476 - Ali , et al. January 27, 2 | 2004-01-27 |
Direct alignment of contacts App 20030209797 - Ali, Anwar ;   et al. | 2003-11-13 |
Circuit component placement App 20030209731 - Ali, Anwar ;   et al. | 2003-11-13 |
Contact ring architecture App 20030210076 - Ali, Anwar ;   et al. | 2003-11-13 |
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