loadpatents
name:-0.0045549869537354
name:-0.004425048828125
name:-0.00054502487182617
Yeung; Betty H. Patent Filings

Yeung; Betty H.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yeung; Betty H..The latest application filed is for "electronic device and method of packaging an electronic device".

Company Profile
0.4.4
  • Yeung; Betty H. - Chandler AZ US
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Electronic device and method of packaging an electronic device
Grant 9,054,111 - Xu , et al. June 9, 2
2015-06-09
Die assemblies
Grant 7,989,951 - Yeung , et al. August 2, 2
2011-08-02
Method for controlling warpage in redistributed chip packaging panels
Grant 7,950,144 - Ramanathan , et al. May 31, 2
2011-05-31
Electronic Device And Method Of Packaging An Electronic Device
App 20100252919 - Xu; Jianwen ;   et al.
2010-10-07
Die Assemblies
App 20100142168 - Yeung; Betty H. ;   et al.
2010-06-10
Method For Controlling Warpage In Redistributed Chip Packaging Panels
App 20090271980 - Ramanathan; Lakshmi N. ;   et al.
2009-11-05
Warpage-reducing packaging design
App 20070175660 - Yeung; Betty H. ;   et al.
2007-08-02

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