| Patent | Date |
|---|
Very low leakage inductance, single-laminate transformer
Grant 5,570,074 - Steigerwald , et al. October 29, 1 | 1996-10-29 |
High-frequency, low-profile inductor
Grant 5,414,401 - Roshen , et al. May 9, 1 | 1995-05-09 |
Z-foldable secondary winding for a low-profile, multi-pole transformer
Grant 5,291,173 - Yerman , et al. March 1, 1 | 1994-03-01 |
Barrel-wound conductive film transformer
Grant 5,206,621 - Yerman April 27, 1 | 1993-04-27 |
Gate drive for synchronous rectifiers in resonant converters
Grant 5,179,512 - Fisher , et al. January 12, 1 | 1993-01-12 |
Half bridge device package, packaged devices and circuits
Grant 5,043,859 - Korman , et al. August 27, 1 | 1991-08-27 |
Conductive film magnetic components
Grant 5,017,902 - Yerman , et al. May 21, 1 | 1991-05-21 |
High-frequency transformer
Grant 4,959,630 - Yerman , et al. September 25, 1 | 1990-09-25 |
Hermetic semiconductor enclosure
Grant 4,905,075 - Temple , et al. February 27, 1 | 1990-02-27 |
Impermeable encapsulation system for integrated circuits
Grant 4,824,716 - Yerman April 25, 1 | 1989-04-25 |
Chip carrier and method of fabrication
Grant 4,809,135 - Yerman February 28, 1 | 1989-02-28 |
Method for producing via holes in polymer dielectrics
Grant 4,764,485 - Loughran , et al. August 16, 1 | 1988-08-16 |
Tape automated manufacture of power semiconductor devices
Grant 4,716,124 - Yerman , et al. December 29, 1 | 1987-12-29 |
Hermetic power chip packages
Grant 4,646,129 - Yerman , et al. February 24, 1 | 1987-02-24 |
Tape automated manufacture of power semiconductor devices
Grant 4,635,092 - Yerman , et al. January 6, 1 | 1987-01-06 |
Power chip package
Grant 4,538,170 - Yerman August 27, 1 | 1985-08-27 |
Use of dispersed solids as fillers in polymeric materials to provide material for semiconductor junction passivation
Grant 4,331,970 - Yerman May 25, 1 | 1982-05-25 |
Method for providing substantially hermetic sealing means for electronic components
Grant 4,198,444 - Yerman * April 15, 1 | 1980-04-15 |
Semiconductor element having a polymeric protective coating and glass coating overlay
Grant 4,040,874 - Yerman August 9, 1 | 1977-08-09 |
Dielectrically isolated integral silicon diaphram or other semiconductor product
Grant 3,922,705 - Yerman November 25, 1 | 1975-11-25 |
Bonding process for dielectric isolation of single crystal semiconductor structures
Grant 3,909,332 - Yerman September 30, 1 | 1975-09-30 |
Integral Silicon Diaphragms For Low Pressure Measurements
Grant 3,772,628 - Underwood , et al. November 13, 1 | 1973-11-13 |
Linearization Of Differential Pressure Integral Silicon Transducer
Grant 3,739,644 - Underwood , et al. June 19, 1 | 1973-06-19 |
Silicon Diaphragm Pressure Sensor Having Improved Configuration Of Integral Strain Gage Elements
Grant 3,697,918 - Orth , et al. October 10, 1 | 1972-10-10 |
Semiconductor Strain Gage Pressure Transducer
Grant 3,697,917 - Orth , et al. October 10, 1 | 1972-10-10 |
Tunnel Diode Oscillator Fm Temperature Sensor
Grant 3,679,992 - Yerman July 25, 1 | 1972-07-25 |
Semiconductor Strain Sensor With Controlled Sensitivity
Grant 3,582,690 - Yerman June 1, 1 | 1971-06-01 |
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