Yeou; Long-Sheng
Patent Applications and Registrations
Patent applications and USPTO patent grants for Yeou; Long-Sheng.The latest application filed is for "chip package and method for forming the same".
- Yeou; Long-Sheng - Hsinchu TW
- Yeou; Long-Sheng - Jhongli TW
- YEOU; Long-Sheng - Hsinchu City TW
- Yeou; Long-Sheng - Jhongli City TW
- Yeou; Long-Sheng - Hsinchu County TW
- Yeou; Long-Sheng - Hsin Chu TW
| Patent | Date |
|---|---|
| Chip package and method for forming the same Grant 9,559,001 - Yen , et al. January 31, 2 | 2017-01-31 |
| Chip package and method for forming the same Grant 9,184,092 - Yen , et al. November 10, 2 | 2015-11-10 |
| Semiconductor stack structure and fabrication method thereof Grant 9,177,862 - Ho , et al. November 3, 2 | 2015-11-03 |
| Fabrication method for a chip package Grant 9,064,950 - Tsai , et al. June 23, 2 | 2015-06-23 |
| Chip package and method for forming the same Grant 8,951,836 - Yen , et al. February 10, 2 | 2015-02-10 |
| Chip Package And Method For Forming The Same App 20140199835 - YEN; Yu-Lin ; et al. | 2014-07-17 |
| Chip Package And Method For Forming The Same App 20140199830 - YEN; Yu-Lin ; et al. | 2014-07-17 |
| Chip Package And Fabrication Method Thereof App 20140113412 - TSAI; Chia-Lun ; et al. | 2014-04-24 |
| Chip package Grant 8,698,316 - Yen , et al. April 15, 2 | 2014-04-15 |
| Chip package Grant 8,692,382 - Yen , et al. April 8, 2 | 2014-04-08 |
| Chip package and fabrication method thereof Grant 8,637,970 - Tsai , et al. January 28, 2 | 2014-01-28 |
| Chip package and method for forming the same Grant 8,552,565 - Yen , et al. October 8, 2 | 2013-10-08 |
| Chip package and method for forming the same Grant 8,525,345 - Yen , et al. September 3, 2 | 2013-09-03 |
| Semiconductor Stack Structure And Fabrication Method Thereof App 20130168868 - Ho; Yeh-Shih ; et al. | 2013-07-04 |
| Chip package and method for fabricating the same Grant 8,207,615 - Lou , et al. June 26, 2 | 2012-06-26 |
| Chip Submount, Chip Package, And Fabrication Method Thereof App 20110291153 - Yang; Ming-Kun ; et al. | 2011-12-01 |
| Chip Package And Method For Forming The Same App 20110285032 - YEN; Yu-Lin ; et al. | 2011-11-24 |
| Chip Package And Method For Forming The Same App 20110278734 - YEN; Yu-Lin ; et al. | 2011-11-17 |
| Chip Package And Method For Forming The Same App 20110278735 - YEN; Yu-Lin ; et al. | 2011-11-17 |
| Chip Package And Method For Forming The Same App 20110221070 - Yen; Yu-Lin ; et al. | 2011-09-15 |
| Chip Package And Method For Forming The Same App 20110193241 - YEN; Yu-Lin ; et al. | 2011-08-11 |
| Chip Package And Method For Fabricating The Same App 20110175236 - LOU; Bai-Yao ; et al. | 2011-07-21 |
| Chip Package And Fabrication Method Thereof App 20110127666 - TSAI; Chia-Lun ; et al. | 2011-06-02 |
| Storage container for detecting presence of checmical elements Grant 7,815,856 - Wu , et al. October 19, 2 | 2010-10-19 |
| Production and packaging control for repaired integrated circuits Grant 7,521,266 - Tseng , et al. April 21, 2 | 2009-04-21 |
| Storage Container For Detecting Presence Of Checmical Elements App 20070275468 - Wu; Kwang-Chen ; et al. | 2007-11-29 |
| Production and packaging control for repaired integrated circuits App 20070111402 - Tseng; Shu-Jung ; et al. | 2007-05-17 |
| Method of forming undoped/in-situ doped/undoped polysilicon sandwich for floating gate application Grant 5,840,607 - Yeh , et al. November 24, 1 | 1998-11-24 |
| Two-step planarization process using chemical-mechanical polishing and reactive-ion-etching Grant 5,747,382 - Huang , et al. May 5, 1 | 1998-05-05 |
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