Yeong; Shee Min
Patent Applications and Registrations
Patent applications and USPTO patent grants for Yeong; Shee Min.The latest application filed is for "methods and systems for packaging integrated circuits".
- Yeong; Shee Min - Melaka Tengah MY
- Yeong; Shee Min - Melaka MY
| Patent | Date |
|---|---|
| Methods and systems of packaging integrated circuits Grant 8,030,138 - How , et al. October 4, 2 | 2011-10-04 |
| Integrated circuit package with integrated heat sink Grant 8,018,050 - How , et al. September 13, 2 | 2011-09-13 |
| Panel level methods and systems for packaging integrated circuits with integrated heat sinks Grant 7,998,791 - Chong , et al. August 16, 2 | 2011-08-16 |
| Low stress cavity package Grant 7,868,433 - Lim , et al. January 11, 2 | 2011-01-11 |
| Methods and systems for packaging integrated circuits Grant 7,863,757 - How , et al. January 4, 2 | 2011-01-04 |
| Methods And Systems For Packaging Integrated Circuits App 20100237487 - How; You Chye ; et al. | 2010-09-23 |
| Methods and systems for packaging integrated circuits Grant 7,749,809 - How , et al. July 6, 2 | 2010-07-06 |
| Low Stress Cavity Package App 20100052123 - LIM; Peng Soon ; et al. | 2010-03-04 |
| Optical leadless leadframe package Grant 7,582,954 - Lim , et al. September 1, 2 | 2009-09-01 |
| Optical Leadless Leadframe Package App 20090212382 - LIM; Peng Soon ; et al. | 2009-08-27 |
| Panel Level Methods And Systems For Packaging Integrated Circuits With Integrated Heat Sinks App 20090194868 - CHONG; Sek Hoi ; et al. | 2009-08-06 |
| Methods And Systems For Packaging Integrated Circuits App 20090152707 - HOW; You Chye ; et al. | 2009-06-18 |
| Integrated Circuit Package With Integrated Heat Sink App 20090115037 - HOW; You Chye ; et al. | 2009-05-07 |
| Integrated Circuit Devices With Integral Heat Sinks App 20080242003 - HOW; You Chye ; et al. | 2008-10-02 |
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