YEON; Seunghoon

Patent Applications and Registrations

Patent applications and USPTO patent grants for YEON; Seunghoon.The latest application filed is for "chip-stacked semiconductor package and method of manufacturing same".

Company Profile

8.6.13

YEON; Seunghoon - Suwon-si KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Chip-stacked Semiconductor Package And Method Of Manufacturing Same App 20220262689 - KIM; Hyoeun ; et al.	2022-08-18
Chip-stacked semiconductor package and method of manufacturing same Grant 11,328,966 - Kim , et al. May 10, 2	2022-05-10
Semiconductor Package And Method Of Fabricating The Same App 20220045033 - KIM; HYOEUN ; et al.	2022-02-10
Image Sensor Package With Underfill And Image Sensor Module Including The Same App 20220045111 - JO; Chajea ; et al.	2022-02-10
Semiconductor packages Grant 11,244,894 - Yeon , et al. February 8, 2	2022-02-08
Semiconductor Package App 20220037279 - KIM; NAMHOON ; et al.	2022-02-03
Semiconductor Package App 20220013501 - KIM; NAMHOON ; et al.	2022-01-13
Integrated Circuit Device And Semiconductor Package Including The Same App 20210407890 - JO; Chajea ; et al.	2021-12-30
Semiconductor Package And Method Of Manufacturing The Same App 20210398929 - KIM; HYOEUN ; et al.	2021-12-23
Semiconductor package and method of fabricating the same Grant 11,158,603 - Kim , et al. October 26, 2	2021-10-26
Semiconductor Packages App 20210028102 - Yeon; Seunghoon ; et al.	2021-01-28
Chip-stacked Semiconductor Package And Method Of Manufacturing Same App 20200411393 - Kim; Hyoeun ; et al.	2020-12-31
Methods of forming redistribution lines and methods of manufacturing semiconductor devices using the same Grant 10,748,953 - Cho , et al. A	2020-08-18
Methods Of Forming Redistribution Lines And Methods Of Manufacturing Semiconductor Devices Using The Same App 20200203414 - CHO; YONGHOE ; et al.	2020-06-25
Semiconductor packages Grant 10,636,760 - Yeon , et al.	2020-04-28
Methods of forming redistribution lines and methods of manufacturing semiconductor devices using the same Grant 10,615,213 - Cho , et al.	2020-04-07
Semiconductor Package And Method Of Fabricating The Same App 20200051954 - KIM; HYOEUN ; et al.	2020-02-13
Semiconductor Packages App 20190214359 - YEON; Seunghoon ; et al.	2019-07-11
Methods Of Forming Redistribution Lines And Methods Of Manufacturing Semiconductor Devices Using The Same App 20190172865 - CHO; YONGHOE ; et al.	2019-06-06

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