| Patent | Date |
|---|
Package With A Substrate Comprising Pad-on-pad Interconnects
App 20220310488 - FANG; Kun ; et al. | 2022-09-29 |
Package with substrate comprising variable thickness solder resist layer
Grant 11,439,008 - Fang , et al. September 6, 2 | 2022-09-06 |
Device comprising multi-directional antennas coupled through a flexible printed circuit board
Grant 11,399,435 - Yeon , et al. July 26, 2 | 2022-07-26 |
Sub-module L-shaped Millimeter Wave Antenna-in-package
App 20220131281 - SHAH; Milind ; et al. | 2022-04-28 |
Substrate Comprising Interconnects Embedded In A Solder Resist Layer
App 20220115312 - FANG; Kun ; et al. | 2022-04-14 |
Substrate Comprising Interconnects Embedded In A Solder Resist Layer
App 20220068662 - FANG; Kun ; et al. | 2022-03-03 |
Asymmetric antenna structure
Grant 11,258,165 - We , et al. February 22, 2 | 2022-02-22 |
Package With Substrate Comprising Variable Thickness Solder Resist Layer
App 20220053639 - FANG; Kun ; et al. | 2022-02-17 |
Sub-module L-shaped millimeter wave antenna-in-package
Grant 11,239,573 - Shah , et al. February 1, 2 | 2022-02-01 |
Sub-module L-shaped Millimeter Wave Antenna-in-package
App 20210376493 - SHAH; Milind ; et al. | 2021-12-02 |
X.5 layer substrate
Grant 11,183,446 - Yeon , et al. November 23, 2 | 2021-11-23 |
Multi-core Broadband Pcb Antenna
App 20210351488 - ZHANG; Chaoqi ; et al. | 2021-11-11 |
Device Comprising Multi-directional Antennas Coupled Through A Flexible Printed Circuit Board
App 20210345492 - YEON; Jaehyun ; et al. | 2021-11-04 |
Package comprising a substrate having a via wall configured as a shield
Grant 11,139,224 - Zhang , et al. October 5, 2 | 2021-10-05 |
Device Comprising Multi-directional Antennas In Substrates Coupled Through Flexible Interconnects
App 20210280959 - HAN; Jeahyeong ; et al. | 2021-09-09 |
Through-package partial via on package edge
Grant 11,101,220 - We , et al. August 24, 2 | 2021-08-24 |
Substrate comprising recessed interconnects and a surface mounted passive component
Grant 11,075,260 - Kang , et al. July 27, 2 | 2021-07-27 |
Enhanced antenna module with shield layer
Grant 11,043,740 - Hwang , et al. June 22, 2 | 2021-06-22 |
Package Comprising A Substrate Having A Via Wall Configured As A Shield
App 20210175152 - ZHANG; Chaoqi ; et al. | 2021-06-10 |
Package Comprising Discrete Antenna Device
App 20210091017 - YEON; Jaehyun ; et al. | 2021-03-25 |
Through-package Partial Via On Package Edge
App 20210066197A1 - | 2021-03-04 |
Enhanced Antenna Module with Flexible Portion
App 20210028539 - WE; Hong Bok ; et al. | 2021-01-28 |
Enhanced Antenna Module With Shield Layer
App 20200365983 - HWANG; Suhyung ; et al. | 2020-11-19 |
Uniform Via Pad Structure
App 20200219803 - KANG; Kuiwon ; et al. | 2020-07-09 |
Asymmetric Antenna Structure
App 20200212545 - WE; Hong Bok ; et al. | 2020-07-02 |
Substrate Comprising Recessed Interconnects And A Surface Mounted Passive Component
App 20200135839 - KANG; Kuiwon ; et al. | 2020-04-30 |
Integrated Circuit Cavity Formation With Multiple Interconnection Pads
App 20200091062 - YEON; Jaehyun ; et al. | 2020-03-19 |
Integrated Circuit Chip Package Having Reduced Contact Pad Size
App 20190371652 - WE; Hong Bok ; et al. | 2019-12-05 |
Tapered Corner Package For Emi Shield
App 20190341352 - WE; Hong Bok ; et al. | 2019-11-07 |
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