| Patent | Date |
|---|
Plugs for interconnect lines for advanced integrated circuit structure fabrication
Grant 11,404,559 - Yeoh , et al. August 2, 2 | 2022-08-02 |
Multi Version Library Cell Handling And Integrated Circuit Structures Fabricated Therefrom
App 20220149075 - KUMAR; Ranjith ; et al. | 2022-05-12 |
Multi version library cell handling and integrated circuit structures fabricated therefrom
Grant 11,271,010 - Kumar , et al. March 8, 2 | 2022-03-08 |
Contact Over Active Gate Structures For Advanced Integrated Circuit Structure Fabrication
App 20210234022 - YEOH; Andrew W. ; et al. | 2021-07-29 |
Contact over active gate structures for advanced integrated circuit structure fabrication
Grant 11,031,487 - Yeoh , et al. June 8, 2 | 2021-06-08 |
Etch-stop layer topography for advanced integrated circuit structure fabrication
Grant 10,943,817 - Yeoh , et al. March 9, 2 | 2021-03-09 |
Heterogeneous Metal Line Compositions For Advanced Integrated Circuit Structure Fabrication
App 20210066475 - YEOH; Andrew W. ; et al. | 2021-03-04 |
Plugs For Interconnect Lines For Advanced Integrated Circuit Structure Fabrication
App 20210013323 - YEOH; Andrew W. ; et al. | 2021-01-14 |
Heterogeneous metal line compositions for advanced integrated circuit structure fabrication
Grant 10,854,731 - Yeoh , et al. December 1, 2 | 2020-12-01 |
Multi Version Library Cell Handling And Integrated Circuit Structures Fabricated Therefrom
App 20200357823 - KUMAR; Ranjith ; et al. | 2020-11-12 |
Plugs for interconnect lines for advanced integrated circuit structure fabrication
Grant 10,818,774 - Yeoh , et al. October 27, 2 | 2020-10-27 |
Etch-stop layer topography for advanced integrated circuit structure fabrication
Grant 10,796,951 - Yeoh , et al. October 6, 2 | 2020-10-06 |
Heterogeneous metal line compositions for advanced integrated circuit structure fabrication
Grant 10,777,655 - Yeoh , et al. Sept | 2020-09-15 |
Contact Over Active Gate Structures For Advanced Integrated Circuit Structure Fabrication
App 20200105906 - YEOH; Andrew W. ; et al. | 2020-04-02 |
Pitch-divided Interconnects For Advanced Integrated Circuit Structure Fabrication
App 20200043850 - YEOH; Andrew W. ; et al. | 2020-02-06 |
Heterogeneous Metal Line Compositions For Advanced Integrated Circuit Structure Fabrication
App 20200044049 - YEOH; Andrew W. ; et al. | 2020-02-06 |
Etch-stop Layer Topography For Advanced Integrated Circuit Structure Fabrication
App 20200027781 - YEOH; Andrew W. ; et al. | 2020-01-23 |
Contact over active gate structures for advanced integrated circuit structure fabrication
Grant 10,541,316 - Yeoh , et al. Ja | 2020-01-21 |
Pitch-divided Interconnects For Advanced Integrated Circuit Structure Fabrication
App 20190164890 - YEOH; Andrew W. ; et al. | 2019-05-30 |
Etch-stop Layer Topography For Advanced Integrated Circuit Structure Fabrication
App 20190164818 - YEOH; Andrew W. ; et al. | 2019-05-30 |
Contact Over Active Gate Structures For Advanced Integrated Circuit Structure Fabrication
App 20190164765 - Yeoh; Andrew W. ; et al. | 2019-05-30 |
Plugs For Interconnect Lines For Advanced Integrated Circuit Structure Fabrication
App 20190164814 - YEOH; Andrew W. ; et al. | 2019-05-30 |
Heterogeneous Metal Line Compositions For Advanced Integrated Circuit Structure Fabrication
App 20190164897 - YEOH; Andrew W. ; et al. | 2019-05-30 |
Thickened stress relief and power distribution layer
Grant 10,229,879 - Fischer , et al. | 2019-03-12 |
Anchored interconnect
Grant 9,818,710 - Kang , et al. November 14, 2 | 2017-11-14 |
Necked interconnect fuse structure for integrated circuits
Grant 9,679,845 - Chen , et al. June 13, 2 | 2017-06-13 |
Anchored Interconnect
App 20170069589 - KANG; JIHO ; et al. | 2017-03-09 |
Necked Interconnect Fuse Structure For Integrated Circuits
App 20170018499 - Chen; Zhanping ; et al. | 2017-01-19 |
Thickened Stress Relief and Power Distribution Layer
App 20170011997 - Fischer; Kevin J. ; et al. | 2017-01-12 |
3D interconnect structure comprising through-silicon vias combined with fine pitch backside metal redistribution lines fabricated using a dual damascene type approach
Grant 9,530,740 - Lee , et al. December 27, 2 | 2016-12-27 |
Thickened stress relief and power distribution layer
Grant 9,496,173 - Fischer , et al. November 15, 2 | 2016-11-15 |
3D interconnect structure comprising fine pitch single damascene backside metal redistribution lines combined with through-silicon vias
Grant 9,449,913 - Lee , et al. September 20, 2 | 2016-09-20 |
3D integrated circuit package with window interposer
Grant 9,391,013 - Mallik , et al. July 12, 2 | 2016-07-12 |
3d Interconnect Structure Comprising Through-silicon Vias Combined With Fine Pitch Backside Metal Redistribution Lines Fabricated Using A Dual Damascene Type Approach
App 20150364425 - Lee; Kevin J. ; et al. | 2015-12-17 |
3d Integrated Circuit Package With Window Interposer
App 20150332994 - MALLIK; Debendra ; et al. | 2015-11-19 |
3D interconnect structure comprising through-silicon vias combined with fine pitch backside metal redistribution lines fabricated using a dual damascene type approach
Grant 9,142,510 - Lee , et al. September 22, 2 | 2015-09-22 |
3D integrated circuit package with window interposer
Grant 9,129,958 - Mallik , et al. September 8, 2 | 2015-09-08 |
Thickened Stress Relief And Power Distribution Layer
App 20150179562 - Fischer; Kevin J. ; et al. | 2015-06-25 |
3d Integrated Circuit Package With Window Interposer
App 20140191419 - Mallik; Debendra ; et al. | 2014-07-10 |
3d Interconnect Structure Comprising Through-silicon Vias Combined With Fine Pitch Backside Metal Redistribution Lines Fabricated Using A Dual Damascene Type Approach
App 20130285257 - Lee; Kevin J. ; et al. | 2013-10-31 |
3d Interconnect Structure Comprising Fine Pitch Single Damascene Backside Metal Redistribution Lines Combined With Through-silicon Vias
App 20130256910 - Lee; Kevin J. ; et al. | 2013-10-03 |
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