Yeoh; Andrew

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yeoh; Andrew.The latest application filed is for "thermal sensor using a vibrating mems resonator of a chip interconnect layer".

Company Profile

0.6.5

Yeoh; Andrew - Portland OR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Thermal sensor using a vibrating MEMS resonator of a chip interconnect layer Grant 8,827,550 - Abdelmoneum , et al. September 9, 2	2014-09-09
Thermal Sensor Using A Vibrating Mems Resonator Of A Chip Interconnect Layer App 20110150031 - Abdelmoneum; Mohamed A. ; et al.	2011-06-23
Hardening of copper to improve copper CMP performance Grant 7,285,496 - Yeoh October 23, 2	2007-10-23
Hardening of copper to improve copper CMP performance Grant 7,145,244 - Yeoh December 5, 2	2006-12-05
Hardening of copper to improve copper CMP performance App 20060246725 - Yeoh; Andrew	2006-11-02
Hardening of copper to improve copper CMP performance Grant 6,979,646 - Yeoh December 27, 2	2005-12-27
Hardening of copper to improve copper CMP performance App 20050255694 - Yeoh, Andrew	2005-11-17
Hardening of copper to improve copper CMP performance Grant 6,909,192 - Yeoh June 21, 2	2005-06-21
Hardening of copper to improve copper CMP performance App 20020090821 - Yeoh, Andrew	2002-07-11
Hardening of copper to improve copper CMP performance App 20020084527 - Yeoh, Andrew	2002-07-04

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