Yeo; Swain Hong

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yeo; Swain Hong.The latest application filed is for "molded semiconductor package having a package-in-package structure and methods of manufacturing thereof".

Company Profile

2.5.5

Yeo; Swain Hong - Singapore SG
YEO; Swain Hong - US

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Molded semiconductor package having a package-in-package structure and methods of manufacturing thereof Grant 10,861,828 - Wang , et al. December 8, 2	2020-12-08
Molded Semiconductor Package Having a Package-in-Package Structure and Methods of Manufacturing Thereof App 20190348397 - Wang; Hui Teng ; et al.	2019-11-14
Package-in-package structure for semiconductor devices and methods of manufacture Grant 10,418,343 - Wang , et al. Sept	2019-09-17
Package-in-Package Structure for Semiconductor Devices and Methods of Manufacture App 20190172815 - Wang; Hui Teng ; et al.	2019-06-06
Integrated circuit package and a method for forming an integrated circuit package Grant 8,357,565 - Ofner , et al. January 22, 2	2013-01-22
Magnetically alignable integrated circuit device Grant 7,994,608 - Tan , et al. August 9, 2	2011-08-09
Integrated Circuit Package and a Method for Forming an Integrated Circuit Package App 20110020985 - OFNER; Gerald ; et al.	2011-01-27
Magnetically Alignable Integrated Circuit Device App 20080265367 - Tan; Ai Min ; et al.	2008-10-30
Integrated Circuit Package and a Method for Forming an Integrated Circuit Package App 20080122053 - Ofner; Gerald ; et al.	2008-05-29

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.