Yeo; Kok Leong
Patent Applications and Registrations
Patent applications and USPTO patent grants for Yeo; Kok Leong.The latest application filed is for "method of minimizing mold flash during dambar cut".
- Yeo; Kok Leong - Melaka MY
| Patent | Date |
|---|---|
| Method Of Minimizing Mold Flash During Dambar Cut App 20150144389 - Lee; Lee Han Meng @Eugene ; et al. | 2015-05-28 |
| Exposed die package that helps protect the exposed die from damage Grant 8,847,370 - Lee , et al. September 30, 2 | 2014-09-30 |
| Design For Exposed Die Package App 20130087901 - LEE; Lee Han Meng @ Eugene ; et al. | 2013-04-11 |
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