Yeo; Alfred
Patent Applications and Registrations
Patent applications and USPTO patent grants for Yeo; Alfred.The latest application filed is for "crack stop structure enhancement of the integrated circuit seal ring".
- Yeo; Alfred - Singapore N/A SG
| Patent | Date |
|---|---|
| Integrated circuit packaging system with core region and bond pad and method of manufacture thereof Grant 8,603,909 - Yeo , et al. December 10, 2 | 2013-12-10 |
| Crack Stop Structure Enhancement Of The Integrated Circuit Seal Ring App 20120074519 - Yeo; Alfred ; et al. | 2012-03-29 |
| Fabricating method for crack stop structure enhancement of integrated circuit seal ring Grant 8,048,761 - Yeo , et al. November 1, 2 | 2011-11-01 |
| Integrated Circuit Packaging System With Bond Pad And Method Of Manufacture Thereof App 20110101545 - Yeo; Alfred ; et al. | 2011-05-05 |
| Integrated circuit packaging system and method of manufacture thereof Grant 7,892,963 - Yeo , et al. February 22, 2 | 2011-02-22 |
| Integrated Circuit Packaging System And Method Of Manufacture Thereof App 20100270670 - Yeo; Alfred ; et al. | 2010-10-28 |
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