Yen; Yu-Lin
Patent Applications and Registrations
Patent applications and USPTO patent grants for Yen; Yu-Lin.The latest application filed is for "semiconductor structure and manufacturing method thereof".
Company Profile
0.37.25
- Yen; Yu-Lin - Taipei TW
- Yen; Yu-Lin - Jhongli TW
- YEN; Yu-Lin - Taipei City TW
- Yen; Yu-Lin - Taoyuan N/A TW
- Yen; Yu-Lin - Jhongli City TW
- Yen; Yu-Lin - Zhongli N/A TW
- YEN; Yu-Lin - Zhongli City TW
- Yen; Yu-Lin - Hsinchu TW
Patent Activity
| Patent | Date |
|---|---|
| Chip package and method for forming the same Grant 9,559,001 - Yen , et al. January 31, 2 | 2017-01-31 |
| Semiconductor structure and manufacturing method thereof Grant 9,236,429 - Yen , et al. January 12, 2 | 2016-01-12 |
| Stacked wafer structure and method for stacking a wafer Grant 9,196,589 - Yen , et al. November 24, 2 | 2015-11-24 |
| Chip package and method for forming the same Grant 9,184,092 - Yen , et al. November 10, 2 | 2015-11-10 |
| Semiconductor Structure And Manufacturing Method Thereof App 20150318348 - YEN; Yu-Lin ; et al. | 2015-11-05 |
| Chip package and manufacturing method thereof Grant 9,136,241 - Yen , et al. September 15, 2 | 2015-09-15 |
| Chip package and method for forming the same Grant 9,024,437 - Yen , et al. May 5, 2 | 2015-05-05 |
| Chip package and method for forming the same Grant 8,951,836 - Yen , et al. February 10, 2 | 2015-02-10 |
| Chip Package And Method For Forming The Same App 20140199830 - YEN; Yu-Lin ; et al. | 2014-07-17 |
| Chip Package And Method For Forming The Same App 20140199835 - YEN; Yu-Lin ; et al. | 2014-07-17 |
| Chip package Grant 8,698,316 - Yen , et al. April 15, 2 | 2014-04-15 |
| Chip package Grant 8,692,382 - Yen , et al. April 8, 2 | 2014-04-08 |
| Integrated circuit package and method for fabrication thereof Grant 8,624,383 - Yen , et al. January 7, 2 | 2014-01-07 |
| Chip package Grant 8,581,386 - Yen , et al. November 12, 2 | 2013-11-12 |
| Chip package and method for fabricating the same Grant 8,575,634 - Liu , et al. November 5, 2 | 2013-11-05 |
| Stacked Wafer Structure And Method For Stacking A Wafer App 20130285215 - Yen; Yu-Lin ; et al. | 2013-10-31 |
| Chip package and method for forming the same Grant 8,552,565 - Yen , et al. October 8, 2 | 2013-10-08 |
| Chip package Grant 8,536,671 - Liu , et al. September 17, 2 | 2013-09-17 |
| Chip package and method for forming the same Grant 8,525,345 - Yen , et al. September 3, 2 | 2013-09-03 |
| Method for forming a material layer Grant 8,415,088 - Yen April 9, 2 | 2013-04-09 |
| Chip Package And Method For Forming The Same App 20120319297 - YEN; Yu-Lin ; et al. | 2012-12-20 |
| Chip Package And Manufacturing Method Thereof App 20120261809 - YEN; Yu-Lin ; et al. | 2012-10-18 |
| Chip Package App 20120112329 - YEN; Yu-Lin ; et al. | 2012-05-10 |
| Chip Package App 20110298000 - LIU; Tsang-Yu ; et al. | 2011-12-08 |
| Chip Package And Method For Forming The Same App 20110285032 - YEN; Yu-Lin ; et al. | 2011-11-24 |
| Chip Package And Method For Forming The Same App 20110278734 - YEN; Yu-Lin ; et al. | 2011-11-17 |
| Chip Package And Method For Forming The Same App 20110278735 - YEN; Yu-Lin ; et al. | 2011-11-17 |
| Chip Package And Method For Forming The Same App 20110221070 - Yen; Yu-Lin ; et al. | 2011-09-15 |
| Integrated cirucit package and method for fabrication thereof Grant 8,003,442 - Yen , et al. August 23, 2 | 2011-08-23 |
| Chip Package And Method For Forming The Same App 20110193241 - YEN; Yu-Lin ; et al. | 2011-08-11 |
| Chip Package And Method For Fabricating The Same App 20110156074 - LIU; Tsang-Yu ; et al. | 2011-06-30 |
| Integrated Circuit Package And Method For Fabrication Thereof App 20100276774 - YEN; Yu-Lin ; et al. | 2010-11-04 |
| Mask and pattern forming method by using the same Grant 7,781,126 - Yen August 24, 2 | 2010-08-24 |
| Integrated cirucit package and method for fabrication thereof App 20080230860 - Yen; Yu-Lin ; et al. | 2008-09-25 |
| Method of reducing film stress on overlay mark Grant 7,323,393 - Yen , et al. January 29, 2 | 2008-01-29 |
| Methods of forming planarized multilevel metallization in an integrated circuit Grant 7,314,813 - Su , et al. January 1, 2 | 2008-01-01 |
| Method for forming a material layer App 20070218410 - Yen; Yu-Lin | 2007-09-20 |
| Method of reducing film stress on overlay mark App 20070166946 - Yen; Yu-Lin ; et al. | 2007-07-19 |
| Method of reducing film stress on overlay mark Grant 7,196,429 - Yen , et al. March 27, 2 | 2007-03-27 |
| Method of reducing alignment measurement errors between device layers Grant 7,192,845 - Yen , et al. March 20, 2 | 2007-03-20 |
| Mask and pattern forming method by using the same App 20070054197 - Yen; Yu-Lin | 2007-03-08 |
| Rework process of patterned photo-resist layer Grant 7,125,741 - Yen , et al. October 24, 2 | 2006-10-24 |
| Sandwich arc structure for preventing metal to contact from shifting Grant 7,097,921 - Chang , et al. August 29, 2 | 2006-08-29 |
| Methods of forming planarized multilevel metallization in an integrated circuit App 20060094232 - Su; Chin-Ta ; et al. | 2006-05-04 |
| Method of reducing alignment measurement errors between device layers App 20050272221 - Yen, Yu Lin ; et al. | 2005-12-08 |
| Mask with extended mask clear-out window and method of dummy exposure using the same Grant 6,960,411 - Yen , et al. November 1, 2 | 2005-11-01 |
| Method of reducing film stress on overlay mark App 20050236721 - Yen, Yu-Lin ; et al. | 2005-10-27 |
| Rework process of patterned photo-resist layer App 20050009345 - Yen, Yu-Lin ; et al. | 2005-01-13 |
| Sandwich arc structure for preventing metal to contact from shifting App 20040241466 - Chang, Ching-Yu ; et al. | 2004-12-02 |
| Mask with extended mask clear-out window and method of dummy exposure using the same App 20040110070 - Yen, Yu-Lin ; et al. | 2004-06-10 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.
| 