| Patent | Date |
|---|
Substrate Structure, Package Structure And Method For Manufacturing Electronic Package Structure
App 20220310410 - YEN; You-Lung ; et al. | 2022-09-29 |
Semiconductor Device Package And Method Of Manufacturing The Same
App 20220302004 - YEN; You-Lung ; et al. | 2022-09-22 |
Substrate Structure, Semiconductor Package Structure And Method For Manufacturing Semiconductor Package Structure
App 20220301989 - YEN; You-Lung ; et al. | 2022-09-22 |
Semiconductor Device Package
App 20220302008 - YEN; You-Lung ; et al. | 2022-09-22 |
Semiconductor substrate and method for manufacturing the same
Grant 11,398,421 - Lee , et al. July 26, 2 | 2022-07-26 |
Semiconductor device including metal holder and method of manufacturing the same
Grant 11,322,468 - Yen , et al. May 3, 2 | 2022-05-03 |
Semiconductor device package and method of manufacturing the same
Grant 11,322,428 - Yen , et al. May 3, 2 | 2022-05-03 |
Semiconductor device packages and method of manufacturing the same
Grant 11,322,454 - Yen , et al. May 3, 2 | 2022-05-03 |
Substrate Structure, Semiconductor Package Structure And Method For Manufacturing A Substrate Structure
App 20220115288 - YEN; You-Lung ; et al. | 2022-04-14 |
Electronic Package And Method For Manufacturing The Same
App 20220115310 - YEN; You-Lung ; et al. | 2022-04-14 |
Electronic Package And Method For Manufacturing The Same
App 20220115328 - YEN; You-Lung ; et al. | 2022-04-14 |
Semiconductor package and method of manufacturing the same
Grant 11,282,777 - Yen , et al. March 22, 2 | 2022-03-22 |
Semiconductor Device Package And Method For Manufacturing The Same
App 20220037290 - YEN; You-Lung ; et al. | 2022-02-03 |
Semiconductor Device And Method Of Manufacturing The Same
App 20210335742 - YEN; You-Lung ; et al. | 2021-10-28 |
Package Structure And Method For Manufacturing The Same
App 20210327841 - YEN; You-Lung ; et al. | 2021-10-21 |
Semiconductor device package and method for manufacturing the same
Grant 11,145,624 - Yen , et al. October 12, 2 | 2021-10-12 |
Package Substrate And Method For Manufacturing The Same
App 20210296219 - YEN; You-Lung | 2021-09-23 |
Package Substrate And Method For Manufacturing The Same
App 20210296259 - YEN; You-Lung ; et al. | 2021-09-23 |
Semiconductor Package And Manufacturing Process
App 20210225746 - APPELT; Bernd Karl ; et al. | 2021-07-22 |
Semiconductor Package And Method Of Manufacturing The Same
App 20210202362 - YEN; You-Lung ; et al. | 2021-07-01 |
Semiconductor Device Packages And Method Of Manufacturing The Same
App 20210183787 - YEN; You-Lung ; et al. | 2021-06-17 |
Semiconductor Device Package And Method Of Manufacturing The Same
App 20210166993 - YEN; You-Lung ; et al. | 2021-06-03 |
Semiconductor Device Package And Method Of Manufacturing The Same
App 20210118775 - YEN; You-Lung ; et al. | 2021-04-22 |
Semiconductor device package and method of manufacturing the same
Grant 10,978,312 - Yen , et al. April 13, 2 | 2021-04-13 |
Semiconductor Device Package And Method For Manufacturing The Same
App 20210028150 - YEN; You-Lung ; et al. | 2021-01-28 |
Semiconductor Device Package And Method Of Manufacturing The Same
App 20200350180 - YEN; You-Lung ; et al. | 2020-11-05 |
Semiconductor package structure and semiconductor substrate
Grant 10,755,994 - Yen A | 2020-08-25 |
Semiconductor package and method of manufacturing the same
Grant 10,643,863 - Yen , et al. | 2020-05-05 |
Semiconductor Package And Method Of Manufacturing The Same
App 20200135604 - YEN; You-Lung | 2020-04-30 |
Semiconductor Package And Manufacturing Process
App 20190363039 - APPELT; Bernd Karl ; et al. | 2019-11-28 |
Semiconductor Package Structure And Method Of Manufacturing The Same
App 20190279924 - APPELT; Bernd Karl ; et al. | 2019-09-12 |
Semiconductor Substrate And Method For Manufacturing The Same
App 20190148280 - Lee; Chun-Che ; et al. | 2019-05-16 |
Semiconductor Package And Method Of Manufacturing The Same
App 20190067036 - YEN; You-Lung ; et al. | 2019-02-28 |
Semiconductor package and semiconductor process
Grant 10,217,728 - Appelt , et al. Feb | 2019-02-26 |
Semiconductor substrate mitigating bridging
Grant 10,181,438 - Lee , et al. Ja | 2019-01-15 |
Double side via last method for double embedded patterned substrate
Grant 10,128,198 - Yen , et al. November 13, 2 | 2018-11-13 |
Semiconductor package including dielectric layers defining via holes extending to component pads
Grant 10,079,156 - Lee , et al. September 18, 2 | 2018-09-18 |
Semiconductor Package And Semiconductor Process
App 20180145060 - APPELT; Bernd Karl ; et al. | 2018-05-24 |
Double Side Via Last Method For Double Embedded Patterned Substrate
App 20170229402 - YEN; You-Lung ; et al. | 2017-08-10 |
Double side via last method for double embedded patterned substrate
Grant 9,659,853 - Yen , et al. May 23, 2 | 2017-05-23 |
Semiconductor substrate, semiconductor package structure and method of making the same
Grant 9,583,427 - Lee , et al. February 28, 2 | 2017-02-28 |
Double Side Via Last Method For Double Embedded Patterned Substrate
App 20160315041 - YEN; You-Lung ; et al. | 2016-10-27 |
Semiconductor Substrate, Semiconductor Package Structure And Method Of Making The Same
App 20160240469 - LEE; Chih-Cheng ; et al. | 2016-08-18 |
Semiconductor substrate, semiconductor package structure and method of making the same
Grant 9,373,601 - Lee , et al. June 21, 2 | 2016-06-21 |
Semiconductor Package Including Embedded Components And Method Of Making The Same
App 20160133562 - LEE; Chih-Cheng ; et al. | 2016-05-12 |
Semiconductor Substrate, Semiconductor Package Structure And Method Of Making The Same
App 20150348931 - LEE; Chih-Cheng ; et al. | 2015-12-03 |
Multi-layered Substrate
App 20120073871 - Appelt; Bernd Karl ; et al. | 2012-03-29 |
Method of fabricating multi-layered substrate
Grant 8,104,171 - Appelt , et al. January 31, 2 | 2012-01-31 |
Method Of Fabricating Multi-layered Substrate And The Substrate Thereof
App 20100055392 - Appelt; Bernd Karl ; et al. | 2010-03-04 |
| 