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Patent applications and USPTO patent grants for Yen; Ming-Huei.The latest application filed is for "copper plating structure and package structure including the same".
Patent | Date |
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Electrochemical processing device and method for operating electrochemical processing device Grant 11,414,776 - Lin , et al. August 16, 2 | 2022-08-16 |
Copper Plating Structure And Package Structure Including The Same App 20220130751 - Yen; Ming-Huei ;   et al. | 2022-04-28 |
Metallization structure and manufacturing method thereof Grant 10,750,619 - Yen A | 2020-08-18 |
Method For Forming Metallization Structure App 20200260591 - A1 | 2020-08-13 |
Electrochemical Processing Device And Method For Operating Electrochemical Processing Device App 20200181794 - LIN; Shih-Ming ;   et al. | 2020-06-11 |
Metallization Structure And Manufacturing Method Thereof App 20190200459 - Yen; Ming-Huei | 2019-06-27 |
Method for forming polymer-clay nanocomposite latex and its application on sealing and semi-conductive materials App 20080287587 - Lin; King-Fu ;   et al. | 2008-11-20 |
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