Yen; Chia-Hsin
Patent Applications and Registrations
Patent applications and USPTO patent grants for Yen; Chia-Hsin.The latest application filed is for "flexible circuit board".
- Yen; Chia-Hsin - Kaohsiung City TW
- Yen; Chia-Hsin - Kaohsiung TW
| Patent | Date |
|---|---|
| Flexible Circuit Board App 20220225496 - Sheu; Gwo-Shyan ; et al. | 2022-07-14 |
| Method of attaching heat sinks to a circuit tape Grant 11,350,518 - Lin , et al. May 31, 2 | 2022-05-31 |
| Method And Device Of Heat Sink Attachment To A Circuit Tape App 20210227679 - Lin; Chia-Sung ; et al. | 2021-07-22 |
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