| Patent | Date |
|---|
Semiconductor device package and method of manufacturing the same
Grant 11,437,415 - Chen , et al. September 6, 2 | 2022-09-06 |
Semiconductor Device Package And Method Of Manufacturing The Same
App 20220141971 - CHEN; Ming-Hung ; et al. | 2022-05-05 |
Semiconductor Device Package And Method Of Manufacturing The Same
App 20220102453 - CHEN; Ming-Hung ; et al. | 2022-03-31 |
Semiconductor device package and method of manufacturing the same
Grant 11,224,132 - Chen , et al. January 11, 2 | 2022-01-11 |
Semiconductor device package and method of manufacturing the same
Grant 11,201,200 - Chen , et al. December 14, 2 | 2021-12-14 |
Semiconductor package and method for manufacturing the same
Grant 11,139,252 - Fang , et al. October 5, 2 | 2021-10-05 |
Semiconductor device package and method of manufacturing the same
Grant 11,081,473 - Chen , et al. August 3, 2 | 2021-08-03 |
Package Structure And Method For Manufacturing The Same
App 20210159188 - FANG; Hsu-Nan ; et al. | 2021-05-27 |
Semiconductor Device Package And Method Of Manufacturing The Same
App 20210076510 - CHEN; Ming-Hung ; et al. | 2021-03-11 |
Semiconductor Device Package And Method Of Manufacturing The Same
App 20210066354 - CHEN; Ming-Hung ; et al. | 2021-03-04 |
Semiconductor Device Package And Method Of Manufacturing The Same
App 20210057572 - CHEN; Ming-Hung ; et al. | 2021-02-25 |
Semiconductor Device Package And Method Of Manufacturing The Same
App 20210057398 - CHEN; Ming-Hung ; et al. | 2021-02-25 |
Semiconductor device package and method of manufacturing the same
Grant 10,797,022 - Fang , et al. October 6, 2 | 2020-10-06 |
Semiconductor Package And Method For Manufacturing The Same
App 20200194383 - FANG; Hsu-Nan ; et al. | 2020-06-18 |
Semiconductor package and method for manufacturing the same
Grant 10,593,630 - Fang , et al. | 2020-03-17 |
Semiconductor Device Package
App 20200083132 - HUANG; Yen-Chi ; et al. | 2020-03-12 |
Semiconductor Package And Method For Manufacturing The Same
App 20190348371 - FANG; Hsu-Nan ; et al. | 2019-11-14 |
Semiconductor Device Package And Method Of Manufacturing The Same
App 20190109117 - Fang; Hsu-Nan ; et al. | 2019-04-11 |
Semiconductor packages with thermal-enhanced conformal shielding and related methods
Grant 9,984,983 - Chung , et al. May 29, 2 | 2018-05-29 |
Semiconductor Device Package And Method For Forming The Same
App 20180122761 - HUANG; Chun-Chin ; et al. | 2018-05-03 |
Semiconductor device package and method for forming the same
Grant 9,960,137 - Huang , et al. May 1, 2 | 2018-05-01 |
Semiconductor Packages With Thermal-enhanced Conformal Shielding And Related Methods
App 20170012007 - Chung; Chi-Sheng ; et al. | 2017-01-12 |
Semiconductor packages with thermal-enhanced conformal shielding and related methods
Grant 9,484,313 - Chung , et al. November 1, 2 | 2016-11-01 |
Semiconductor Packages With Thermal-enhanced Conformal Shielding And Related Methods
App 20140239464 - Chung; Chi-Sheng ; et al. | 2014-08-28 |
Semiconductor package integrated with conformal shield and antenna
Grant 8,786,060 - Yen , et al. July 22, 2 | 2014-07-22 |
Semiconductor Package Integrated With Conformal Shield And Antenna
App 20130292808 - Yen; Han-Chee ; et al. | 2013-11-07 |
Method of forming bumps
Grant 7,375,020 - Wu , et al. May 20, 2 | 2008-05-20 |
Lead-bond type chip package and manufacturing method thereof
Grant 7,061,084 - Chen , et al. June 13, 2 | 2006-06-13 |
Solder mask and structure of a substrate
Grant 6,960,822 - Ding , et al. November 1, 2 | 2005-11-01 |
Method of forming bumps
Grant 6,916,732 - Wu , et al. July 12, 2 | 2005-07-12 |
Method Of Forming Bumps
App 20050085061 - Wu, Tsung-Hua ; et al. | 2005-04-21 |
[method Of Forming Bumps]
App 20040185651 - Wu, Tsung-Hua ; et al. | 2004-09-23 |
System for providing IC bonding diagram via network
Grant 6,795,746 - Chuang , et al. September 21, 2 | 2004-09-21 |
Cavity down MCM package
App 20040150099 - Ding, Yi-Chuan ; et al. | 2004-08-05 |
[method Of Fabricating A Solder Mask And Structure Of A Substrate]
App 20040137659 - Ding, Yi-Chuan ; et al. | 2004-07-15 |
Thermal data automatic service system
Grant 6,751,781 - Lin , et al. June 15, 2 | 2004-06-15 |
Lead-bond type chip package and manufacturing method thereof
App 20040051169 - Chen, Kun-Ching ; et al. | 2004-03-18 |
Lead-bond type chip package and manufacturing method thereof
Grant 6,642,612 - Chen , et al. November 4, 2 | 2003-11-04 |
Thermal data automatic service system
App 20030140321 - Lin, I-Liang ; et al. | 2003-07-24 |
Thermal enhanced ball grid array package
Grant 6,528,882 - Ding , et al. March 4, 2 | 2003-03-04 |
System for providing IC bonding diagram via network
App 20020188371 - Chuang, Chun-Min ; et al. | 2002-12-12 |
Lead-bond type chip package and manufacturing method thereof
App 20020182770 - Chen, Kun-Ching ; et al. | 2002-12-05 |
Ball grid array semiconductor package and substrate therefor
Grant 6,489,682 - Yeh , et al. December 3, 2 | 2002-12-03 |
Ball grid array semiconductor package structure to avoid high frequency interference
App 20020125570 - Wu, Yu-Chun ; et al. | 2002-09-12 |
Lead-bond type chip package and manufacturing method thereof
Grant 6,423,622 - Chen , et al. July 23, 2 | 2002-07-23 |
Flip chip process
App 20020081771 - Ding, Yi-Chuan ; et al. | 2002-06-27 |
Thermal enhanced ball grid array package
App 20020038908 - Ding, Yi-Chuan ; et al. | 2002-04-04 |
Reinforced Flexible Substrates And Method Therefor
App 20010048999 - KUN-CHING, CHEN ; et al. | 2001-12-06 |
Wire structure of substrate for layout detection
Grant 6,313,413 - Chen , et al. November 6, 2 | 2001-11-06 |
Ball grid array package
Grant 6,291,898 - Yeh , et al. September 18, 2 | 2001-09-18 |
Semiconductor packaging device
Grant 5,982,625 - Chen , et al. November 9, 1 | 1999-11-09 |
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