Yeh; Yun-Hsin

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yeh; Yun-Hsin.The latest application filed is for "integrated antenna package structure and manufacturing method thereof".

Company Profile

5.4.6

Yeh; Yun-Hsin - Hsinchu County TW
Yeh; Yun-Hsin - Hsinchu TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Integrated antenna package structure and manufacturing method thereof Grant 10,944,165 - Yeh , et al. March 9, 2	2021-03-09
Integrated antenna package structure and manufacturing method thereof Grant 10,862,202 - Yeh , et al. December 8, 2	2020-12-08
Integrated Antenna Package Structure And Manufacturing Method Thereof App 20200381811 - Yeh; Yun-Hsin ; et al.	2020-12-03
Integrated Antenna Package Structure And Manufacturing Method Thereof App 20200381812 - Yeh; Yun-Hsin ; et al.	2020-12-03
Stackable semiconductor package and manufacturing method thereof Grant 10,249,585 - Yeh , et al.	2019-04-02
Semiconductor Package And Manufacturing Method Thereof App 20190096866 - Hsu; Ching-Ming ; et al.	2019-03-28
Semiconductor package with Pillar-Top-Interconnection (PTI) configuration and its MIS fabricating method Grant 9,825,005 - Yeh , et al. November 21, 2	2017-11-21
Stackable Semiconductor Package And Manufacturing Method Thereof App 20170317041 - Yeh; Yun-Hsin ; et al.	2017-11-02
Molded Interconnecting Substrate And The Method For Manufacturing The Same App 20170117263 - YEH; Yun-Hsin ; et al.	2017-04-27
Semiconductor Package With Pillar-top-interconnection (pti) Configuration And Its Mis Fabricating Method App 20170053898 - YEH; YUN-HSIN ; et al.	2017-02-23

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