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Patent applications and USPTO patent grants for Yeh; Yu-Cheng.The latest application filed is for "integrated circuit layouts with fill feature shapes".
Patent | Date |
---|---|
Integrated Circuit Layouts with Fill Feature Shapes App 20220277128 - Yeh; Yu-Cheng ;   et al. | 2022-09-01 |
Integrated circuit layouts with fill feature shapes Grant 11,334,703 - Yeh , et al. May 17, 2 | 2022-05-17 |
Cell layout and structure Grant 11,281,835 - Hsieh , et al. March 22, 2 | 2022-03-22 |
Cell Layout and Structure App 20200257842 - Hsieh; Tung-Heng ;   et al. | 2020-08-13 |
Cell layout and structure Grant 10,664,639 - Hsieh , et al. | 2020-05-26 |
Integrated Circuit Layouts with Fill Feature Shapes App 20190005180 - Yeh; Yu-Cheng ;   et al. | 2019-01-03 |
Cell Layout and Structure App 20180253522 - Hsieh; Tung-Heng ;   et al. | 2018-09-06 |
Cell layout and structure Grant 9,984,191 - Hsieh , et al. May 29, 2 | 2018-05-29 |
Cell Layout and Structure App 20160063166 - Hsieh; Tung-Heng ;   et al. | 2016-03-03 |
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