YEH; Ya-Wen
Patent Applications and Registrations
Patent applications and USPTO patent grants for YEH; Ya-Wen.The latest application filed is for "fine line patterning methods".
- YEH; Ya-Wen - Taipei City TW
- Yeh; Ya-Wen - Taipei TW
| Patent | Date |
|---|---|
| Fine Line Patterning Methods App 20220157605 - HUANG; Shih-Chun ; et al. | 2022-05-19 |
| Directional processing to remove a layer or a material formed over a substrate Grant 11,289,332 - Huang , et al. March 29, 2 | 2022-03-29 |
| Fine line patterning methods Grant 11,239,078 - Huang , et al. February 1, 2 | 2022-02-01 |
| Method Of Manufacturing Semiconductor Devices Using Directional Process App 20210375639 - YEH; Ya-Wen ; et al. | 2021-12-02 |
| Directional Deposition for Semiconductor Fabrication App 20210358752 - Huang; Shih-Chun ; et al. | 2021-11-18 |
| Method OF FORMING METAL FEATURES App 20210272807 - Chang; Po-Chin ; et al. | 2021-09-02 |
| Method of manufacturing semiconductor devices using directional process Grant 11,094,556 - Yeh , et al. August 17, 2 | 2021-08-17 |
| Directional deposition for semiconductor fabrication Grant 11,075,079 - Huang , et al. July 27, 2 | 2021-07-27 |
| Directional patterning method Grant 11,043,381 - Chang , et al. June 22, 2 | 2021-06-22 |
| Pattern Fidelity Enhancement App 20210118674 - Shen; Yu-Tien ; et al. | 2021-04-22 |
| Method Of Manufacturing Semiconductor Devices App 20210096473 - LIU; Ru-Gun ; et al. | 2021-04-01 |
| Pattern fidelity enhancement Grant 10,861,698 - Shen , et al. December 8, 2 | 2020-12-08 |
| Fine Line Patterning Methods App 20200335340 - HUANG; Shih-Chun ; et al. | 2020-10-22 |
| Directional Patterning Method App 20200243336 - Chang; Po-Chin ; et al. | 2020-07-30 |
| Fine line patterning methods Grant 10,707,081 - Huang , et al. | 2020-07-07 |
| Method Of Manufacturing Semiconductor Devices Using Directional Process App 20200006085 - YEH; Ya-Wen ; et al. | 2020-01-02 |
| Directional Processing To Remove A Layer Or A Material Formed Over A Substrate App 20190341254 - HUANG; Shih-Chun ; et al. | 2019-11-07 |
| Directional processing to remove a layer or a material formed over a substrate Grant 10,354,874 - Huang , et al. July 16, 2 | 2019-07-16 |
| Directional Deposition for Semiconductor Fabrication App 20190157084 - Huang; Shih-Chun ; et al. | 2019-05-23 |
| Directional Processing To Remove A Layer Or A Material Formed Over A Substrate App 20190148145 - Huang; Shih-Chun ; et al. | 2019-05-16 |
| Fine Line Patterning Methods App 20190148147 - Huang; Shih-Chun ; et al. | 2019-05-16 |
| Pattern Fidelity Enhancement App 20190067000 - Shen; Yu-Tien ; et al. | 2019-02-28 |
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