Yeh; Tung-Ti
Patent Applications and Registrations
Patent applications and USPTO patent grants for Yeh; Tung-Ti.The latest application filed is for "soft material wafer bonding and method of bonding".
- Yeh; Tung-Ti - Tainan N/A TW
- YEH; Tung-Ti - Tainan City TW
| Patent | Date |
|---|---|
| Soft material wafer bonding and method of bonding Grant 8,748,885 - Yeh , et al. June 10, 2 | 2014-06-10 |
| Wafer and method of processing wafer Grant 8,592,297 - Yeh , et al. November 26, 2 | 2013-11-26 |
| Soft Material Wafer Bonding And Method Of Bonding App 20130207098 - YEH; Tung-Ti ; et al. | 2013-08-15 |
| Wafer And Method Of Processing Wafer App 20130154060 - YEH; Tung-Ti ; et al. | 2013-06-20 |
| Composite film for phase change memory devices Grant 8,344,343 - Yeh , et al. January 1, 2 | 2013-01-01 |
| Composite Film For Phase Change Memory Devices App 20100252794 - YEH; Tung-Ti ; et al. | 2010-10-07 |
| Treated Chalcogenide Layer for Semiconductor Devices App 20100213431 - Yeh; Tung-Ti ; et al. | 2010-08-26 |
| Phase change optical recording medium App 20050157630 - Yeh, Tung-Ti ; et al. | 2005-07-21 |
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