loadpatents
name:-0.19164299964905
name:-0.032325983047485
name:-0.0011351108551025
Yeh; Tso-Hung Patent Filings

Yeh; Tso-Hung

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yeh; Tso-Hung.The latest application filed is for "laminate circuit board structure".

Company Profile
0.9.18
  • Yeh; Tso-Hung - New Taipei TW
  • Yeh; Tso-Hung - New Taipei City TW
  • Yeh; Tso-Hung - Taoyuan TW
  • YEH; TSO-HUNG - Tayuan TW
  • Yeh; Tso-Hung - Yung-Ho TW
  • Yeh; Tso-Hung - Yung-Ho City TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Laminate circuit board with a multi-layer circuit structure
Grant 8,754,328 - Hsu , et al. June 17, 2
2014-06-17
Laminate Circuit Board Structure
App 20130284500 - Hsu; Jun-Chung ;   et al.
2013-10-31
Method Of Manufacturing A Laminate Circuit Board
App 20130255858 - Hsu; Jun-Chung ;   et al.
2013-10-03
Laminate Circuit Board With A Multi-layer Circuit Structure
App 20130224513 - Hsu; Jun-Chung ;   et al.
2013-08-29
Method Of Manufacturing A Laminate Circuit Board With A Multilayer Circuit Structure
App 20130219713 - Hsu; Jun-Chung ;   et al.
2013-08-29
Cleaning apparatus
Grant 8,332,984 - Yeh , et al. December 18, 2
2012-12-18
Apparatus For Plating Flexible Printed Circuit Board
App 20120175249 - YEH; TSO-HUNG ;   et al.
2012-07-12
Flexible printed circuit boards including carbon nanotube bundles
Grant 8,164,000 - Yeh , et al. April 24, 2
2012-04-24
Plating apparatus
Grant 8,141,512 - Yeh , et al. March 27, 2
2012-03-27
Method for manufacturing printed circuit boards
Grant 8,088,294 - Yeh , et al. January 3, 2
2012-01-03
Flexible base for manufacturing flexible printed circuit boards
Grant 7,989,048 - Yeh , et al. August 2, 2
2011-08-02
Method for plating flexible printed circuit board
Grant 7,897,199 - Yeh , et al. March 1, 2
2011-03-01
Method for manufacturing printed circuit boards using legend printing stencil
Grant 7,854,197 - Yeh , et al. December 21, 2
2010-12-21
Method For Manufacturing Printed Circuit Board
App 20090139086 - YEH; TSO-HUNG ;   et al.
2009-06-04
Method For Manufacturing Printed Circuit Boards
App 20090050600 - YEH; TSO-HUNG ;   et al.
2009-02-26
Method For Plating Flexible Printed Circuit Board
App 20090047421 - Yeh; Tso-Hung ;   et al.
2009-02-19
Method For Manufacturing Electrical Traces Of Printed Circuit Boards
App 20090039053 - YEH; TSO-HUNG ;   et al.
2009-02-12
Flexible Printed Circuit Board Base Film, Flexible Laminates And Flexible Printed Circuit Boards Including Same
App 20090032290 - YEH; TSO-HUNG ;   et al.
2009-02-05
Screen Printing Method For Printing A Printed Circuit Board
App 20090025582 - YEH; TSO-HUNG ;   et al.
2009-01-29
Cleaning Apparatus
App 20090014031 - YEH; TSO-HUNG ;   et al.
2009-01-15
Plating Apparatus
App 20090013929 - YEH; TSO-HUNG ;   et al.
2009-01-15
Flexible Base For Manufacturing Flexible Printed Circuit Boards
App 20090011186 - YEH; TSO-HUNG ;   et al.
2009-01-08
Legend Printing Stencil And Method For Manufacturing Printed Circuit Boards Using The Same
App 20080302257 - YEH; TSO-HUNG ;   et al.
2008-12-11
Method of manufacturing coreless substrate
Grant 7,353,591 - Yeh April 8, 2
2008-04-08
Method Of Manufacturing Coreless Substrate
App 20070245551 - Yeh; Tso-Hung
2007-10-25

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