| Patent | Date |
|---|
Semiconductor Device And Manufacturing Method Thereof
App 20220310502 - Chen; Chien-Hung ; et al. | 2022-09-29 |
Package Structure And Methods Of Manufacturing The Same
App 20220310532 - Yeh; Shu-Shen ; et al. | 2022-09-29 |
Semiconductor Package
App 20220310501 - Wang; Chin-Hua ; et al. | 2022-09-29 |
Metallization Structure And Package Structure
App 20220310503 - Hsu; Chia-Kuei ; et al. | 2022-09-29 |
Semiconductor Device And Manufacturing Method Thereof
App 20220310474 - Yeh; Shu-Shen ; et al. | 2022-09-29 |
Package Structure And Method Of Fabricating The Same
App 20220302011 - Lin; Yu-Sheng ; et al. | 2022-09-22 |
Package Structure And Method Of Fabricating The Same
App 20220301971 - Lin; Yu-Sheng ; et al. | 2022-09-22 |
Semiconductor package
Grant 11,450,622 - Wang , et al. September 20, 2 | 2022-09-20 |
Package Structure With Buffer Layer Embedded In Lid Layer
App 20220278015 - Yeh; Shu-Shen ; et al. | 2022-09-01 |
Semiconductor Device And Manufacturing Method Thereof
App 20220270949 - Yeh; Shu-Shen ; et al. | 2022-08-25 |
Chip Package Structure And Method For Forming The Same
App 20220270893 - LIN; Yu-Sheng ; et al. | 2022-08-25 |
Chip package with lid
Grant 11,410,939 - Yeh , et al. August 9, 2 | 2022-08-09 |
Semiconductor Device and Method of Manufacture
App 20220246490 - Yeh; Shu-Shen ; et al. | 2022-08-04 |
Semiconductor Package
App 20220230970 - Wang; Chin-Hua ; et al. | 2022-07-21 |
Semiconductor Packages
App 20220230990 - Yew; Ming-Chih ; et al. | 2022-07-21 |
Package Structure And Method Of Fabricating The Same
App 20220230969 - Yeh; Shu-Shen ; et al. | 2022-07-21 |
Semiconductor Device And Method
App 20220181298 - Hsu; Chia-Kuei ; et al. | 2022-06-09 |
Semiconductor Device Package Having Dummy Dies And Method Of Forming The Same
App 20220157777 - Yang; Che-Chia ; et al. | 2022-05-19 |
Semiconductor Package And Method Of Manufacturing The Same
App 20220148979 - Ching; Kai-Ming ; et al. | 2022-05-12 |
Semiconductor device and method of manufacture
Grant 11,328,971 - Yeh , et al. May 10, 2 | 2022-05-10 |
Organic Interposer Including Intra-die Structural Reinforcement Structures And Methods Of Forming The Same
App 20220139816 - LIAO; Li-Ling ; et al. | 2022-05-05 |
Embedded Stress Absorber in Package
App 20220102313 - Jeng; Shin-Puu ; et al. | 2022-03-31 |
Chip bonded to a redistribution structure with curved conductive lines
Grant 11,264,359 - Hsu , et al. March 1, 2 | 2022-03-01 |
Package Structure And Method
App 20220037243 - Yeh; Shu-Shen ; et al. | 2022-02-03 |
Semiconductor Package and Method of Manufacture
App 20220037247 - Hsu; Chia-Kuei ; et al. | 2022-02-03 |
Stacking Via Structures for Stress Reduction
App 20220020700 - Yeh; Shu-Shen ; et al. | 2022-01-20 |
Eccentric Via Structures for Stress Reduction
App 20220020693 - Yeh; Shu-Shen ; et al. | 2022-01-20 |
Semiconductor Device and Method
App 20210335753 - Hsu; Chia-Kuei ; et al. | 2021-10-28 |
Method For Forming Semiconductor Package
App 20210272869 - WANG; Chin-Hua ; et al. | 2021-09-02 |
Chip Package Structure With Ring Structure And Method For Forming The Same
App 20210217676 - YEH; Shu-Shen ; et al. | 2021-07-15 |
Semiconductor package and method for forming the same
Grant 11,011,447 - Wang , et al. May 18, 2 | 2021-05-18 |
Chip Package With Lid
App 20210013160 - YEH; Shu-Shen ; et al. | 2021-01-14 |
Semiconductor Device and Method of Manufacture
App 20200357714 - Yeh; Shu-Shen ; et al. | 2020-11-12 |
Structure and formation method of chip package with lid
Grant 10,797,006 - Yeh , et al. October 6, 2 | 2020-10-06 |
Method Of Forming Semicondcutor Device Package
App 20200286878 - Lin; Po-Yao ; et al. | 2020-09-10 |
Semiconductor device and method of manufacture
Grant 10,727,147 - Yeh , et al. | 2020-07-28 |
Method of forming semicondcutor device package
Grant 10,714,463 - Lin , et al. | 2020-07-14 |
Method Of Forming Semicondcutor Device Package
App 20200098739 - Lin; Po-Yao ; et al. | 2020-03-26 |
Semiconductor Package And Method For Forming The Same
App 20200058571 - WANG; Chin-Hua ; et al. | 2020-02-20 |
Method of forming semicondcutor device package
Grant 10,504,880 - Lin , et al. Dec | 2019-12-10 |
Method Of Forming Semicondcutor Device Package
App 20190252363 - Lin; Po-Yao ; et al. | 2019-08-15 |
Semiconductor device package and method of forming semiconductor device package
Grant 10,276,551 - Lin , et al. | 2019-04-30 |
Structure And Formation Method Of Chip Package With Lid
App 20190096826 - YEH; Shu-Shen ; et al. | 2019-03-28 |
Semiconductor Device and Method of Manufacture
App 20190057916 - Yeh; Shu-Shen ; et al. | 2019-02-21 |
Semicondcutor Device Package And Method Of Forming Semicondcutor Device Package
App 20190006341 - Lin; Po-Yao ; et al. | 2019-01-03 |
Structure and formation method of chip package with lid
Grant 10,163,816 - Yeh , et al. Dec | 2018-12-25 |
Semiconductor device and method of manufacture
Grant 10,109,547 - Yeh , et al. October 23, 2 | 2018-10-23 |
Chip Package With Thermal Dissipation Structure And Method For Forming The Same
App 20180019183 - WANG; Chin-Hua ; et al. | 2018-01-18 |
Chip package with thermal dissipation structure and method for forming the same
Grant 9,870,975 - Wang , et al. January 16, 2 | 2018-01-16 |
Structure And Formation Method Of Chip Package With Lid
App 20170358542 - YEH; Shu-Shen ; et al. | 2017-12-14 |
Semiconductor package assembly, semiconductor package and forming method thereof
Grant 9,748,156 - Yeh , et al. August 29, 2 | 2017-08-29 |
Semiconductor Device and Method of Manufacture
App 20170221788 - Yeh; Shu-Shen ; et al. | 2017-08-03 |
Three dimensional integrated circuit (3DIC) having a thermally enhanced heat spreader embedded in a substrate
Grant 9,721,868 - Lin , et al. August 1, 2 | 2017-08-01 |
| 