YEH; SHING

Patent Applications and Registrations

Patent applications and USPTO patent grants for YEH; SHING.The latest application filed is for "system and method of forming a mechanical support for an electronic component attached to a circuit board".

Company Profile

0.12.7

YEH; SHING - KOKOMO IN
Yeh; Shing - Buffalo Grove IL

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
System And Method Of Forming A Mechanical Support For An Electronic Component Attached To A Circuit Board App 20120168208 - SOZANSKY; WAYNE A. ; et al.	2012-07-05
Liquid metal rotary connector apparatus for a vehicle steering wheel and column Grant 7,726,972 - Brandenburg , et al. June 1, 2	2010-06-01
Compression connection for vertical IC packages Grant 7,447,041 - Brandenburg , et al. November 4, 2	2008-11-04
Compression connection for vertical IC packages App 20080212296 - Brandenburg; Scott D. ; et al.	2008-09-04
Electronic assembly and manufacturing method having a reduced need for wire bonds App 20080012099 - Yeh; Shing ; et al.	2008-01-17
Electronic assembly with controlled solder joint thickness App 20060255476 - Kuhlman; Frederick F. ; et al.	2006-11-16
Lead-based solder alloys containing copper Grant 6,811,892 - Yeh , et al. November 2, 2	2004-11-02
Lead-free solder alloy and solder reflow process Grant 6,767,411 - Yeh , et al. July 27, 2	2004-07-27
Lead-based solder alloys containing copper App 20040035909 - Yeh, Shing ; et al.	2004-02-26
Leach-resistant solder alloys for silver-based thick-film conductors Grant 6,630,251 - Carter , et al. October 7, 2	2003-10-07
Lead-free solder alloy and solder reflow process App 20030175146 - Yeh, Shing ; et al.	2003-09-18
Solder process and solder alloy therefor Grant 6,619,536 - Yeh , et al. September 16, 2	2003-09-16
Solder Process And Solder Alloy Therefor App 20030155402 - Yeh, Shing ; et al.	2003-08-21
Solder process and solder alloy therefor Grant 6,570,260 - Yeh , et al. May 27, 2	2003-05-27
Method of solder bumping a circuit component Grant 6,281,106 - Higdon , et al. August 28, 2	2001-08-28
Surface mount circuit device and solder bumping method therefor Grant 6,251,501 - Higdon , et al. June 26, 2	2001-06-26
Process for bonding micromachined wafers using solder Grant 6,062,461 - Sparks , et al. May 16, 2	2000-05-16
Composite solder paste for flip chip bumping Grant 5,803,340 - Yeh , et al. September 8, 1	1998-09-08
Solder bump transfer device for flip chip integrated circuit devices Grant 5,607,099 - Yeh , et al. March 4, 1	1997-03-04

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