YEH; Sheng-Wei

Patent Applications and Registrations

Patent applications and USPTO patent grants for YEH; Sheng-Wei.The latest application filed is for "semiconductor device having a redistribution line".

Company Profile

9.9.11

YEH; Sheng-Wei - Hsinchu TW
Yeh; Sheng-Wei - Taichung TW
Yeh; Sheng-Wei - Taichung City TW
Yeh; Sheng-Wei - Taoyuan TW
YEH; Sheng-Wei - Taoyuan City TW
Yeh; Sheng-Wei - Taoyuan Hsien TW
YEH; Sheng-Wei - Kuei San TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor Device Having A Redistribution Line App 20220302060 - CHENG; Anhao ; et al.	2022-09-22
Gate structure, method of forming the same, and semiconductor device having the same Grant 11,411,112 - Wang , et al. August 9, 2	2022-08-09
Semiconductor device having a redistribution line Grant 11,373,970 - Cheng , et al. June 28, 2	2022-06-28
Redistribution Layer Metallic Structure and Method App 20210159196 - Bih; Shih Wei ; et al.	2021-05-27
Redistribution layer metallic structure and method Grant 10,916,517 - Bih , et al. February 9, 2	2021-02-09
Gate Structure, Method Of Forming The Same, And Semiconductor Device Having The Same App 20210036147 - Wang; Chun-Chieh ; et al.	2021-02-04
Redistribution layer metallic structure and method Grant 10,658,315 - Bih , et al.	2020-05-19
Semiconductor Device Having A Redistribution Line App 20200152589 - CHENG; Anhao ; et al.	2020-05-14
Redistribution Layer Metallic Structure and Method App 20200144208 - Bih; Shih Wei ; et al.	2020-05-07
Redistribution layer structure and fabrication method therefor Grant 10,541,218 - Cheng , et al. Ja	2020-01-21
Redistribution Layer Metallic Structure and Method App 20190304939 - Bih; Shih Wei ; et al.	2019-10-03
Bonding pad process with protective layer Grant 10,354,965 - Bih , et al. July 16, 2	2019-07-16
Bonding Pad Process with Protective Layer App 20190096834 - BIH; Shih Wei ; et al.	2019-03-28
Method for controlling semiconductor deposition operation Grant 10,113,228 - Cheng , et al. October 30, 2	2018-10-30
Thin fan, electronic system and manufacturing method of thin fan Grant 10,064,286 - Yeh , et al. August 28, 2	2018-08-28
Redistribution Layer Structure And Fabrication Method Therefor App 20180151525 - CHENG; Anhao ; et al.	2018-05-31
Thin Fan, Electronic System And Manufacturing Method Of Thin Fan App 20160192505 - YEH; Sheng-Wei ; et al.	2016-06-30
Thin fan, electronic system and manufacturing method of thin fan Grant 9,316,230 - Yeh , et al. April 19, 2	2016-04-19
Method For Controlling Semiconductor Deposition Operation App 20150371847 - CHENG; CHUNG-LIANG ; et al.	2015-12-24
Thin Fan, Electronic System And Manufacturing Method Of Thin Fan App 20150275906 - YEH; Sheng-Wei ; et al.	2015-10-01

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