Yeh; Shang-Tsang

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yeh; Shang-Tsang.The latest application filed is for "electrical connection defect detection system and method".

Company Profile

0.8.14

Yeh; Shang-Tsang - Jhonghe TW
Yeh; Shang-Tsang - Jhonghe City TW
Yeh; Shang-Tsang - Tu-cheng TW
Yeh; Shang Tsang - Tu-chen TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electrical connection defect detection system and method Grant 8,350,575 - Tsai , et al. January 8, 2	2013-01-08
Electrical connection defect detection device Grant 8,324,908 - Tsai , et al. December 4, 2	2012-12-04
Apparatus for testing printed circuit and method therefor Grant 8,179,143 - Yeh , et al. May 15, 2	2012-05-15
Electrical Connection Defect Detection Device App 20110156718 - TSAI; Su-Wei ; et al.	2011-06-30
Electrical Connection Defect Detection System And Method App 20110156717 - TSAI; Su-Wei ; et al.	2011-06-30
Printed circuit board having vias Grant 7,745,737 - Lin , et al. June 29, 2	2010-06-29
Apparatus For Testing Printed Circuit And Method Therefor App 20100090679 - YEH; Shang-Tsang ; et al.	2010-04-15
Layout configuration of differential signal transmission lines for printed circuit board having offset vias Grant 7,545,233 - Lin , et al. June 9, 2	2009-06-09
Method for improving via's impedance Grant 7,409,668 - Lin , et al. August 5, 2	2008-08-05
Signal Transmission Structure App 20070089072 - LIN; YU-HSU ; et al.	2007-04-19
Method for improving via's impedance App 20070074905 - Lin; Yu-Hsu ; et al.	2007-04-05
Multilayer Printed Circuit Board App 20070045000 - LIN; YU-HSU ; et al.	2007-03-01
Multi-layer printed circuit board App 20070017696 - Lin; Yu-Hsu ; et al.	2007-01-25
Printed circuit board having vias App 20070000691 - Lin; Yu-Hsu ; et al.	2007-01-04
Layout configuration of differential signal transmission lines for printed circuit board App 20060284697 - Lin; Yu-Hsu ; et al.	2006-12-21
Printed circuit board with differential vias arrangement App 20060266549 - Lin; Yu-Hsu ; et al.	2006-11-30
Printed circuit board having reduced parasitic capacitance pad App 20060237228 - Lin; Yu-Hsu ; et al.	2006-10-26
Arrangements of differential pairs in multi-layer printed circuit board for eliminating crosstalk Grant 7,102,455 - Lin , et al. September 5, 2	2006-09-05
Printed circuit board with improved ground plane App 20060144616 - Lin; Yu-Hsu ; et al.	2006-07-06
EMI-attenuating air ventilation panel Grant 6,947,294 - Lin , et al. September 20, 2	2005-09-20
Arrangements of differential pairs in multi-layer printed circuit board for eliminating crosstalk App 20050099240 - Lin, Yu Hsu ; et al.	2005-05-12
EMI-attenuating air ventilation panel App 20040233654 - Lin, Yun Hsu ; et al.	2004-11-25

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