Yeh; Nai Hua

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yeh; Nai Hua.The latest application filed is for "image sensor structure".

Company Profile

0.6.16

Yeh; Nai Hua - Hsinchu Hsien TW
Yeh; Nai Hua - Chupei Hsinchu Hsien TW
Yeh, Nai Hua - Hsinch Hsien TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for manufacturing a package structure of integrated circuits Grant 6,642,137 - Yeh , et al. November 4, 2	2003-11-04
Memory module structure Grant 6,642,554 - Yeh , et al. November 4, 2	2003-11-04
Stacked package structure of image sensor Grant 6,627,983 - Tu , et al. September 30, 2	2003-09-30
Image sensor structure App 20030116817 - Yeh, Nai Hua ; et al.	2003-06-26
Stacked structure of a ball grid array (BGA) integrated circuit package App 20030116846 - Yeh, Nai Hua ; et al.	2003-06-26
Memory module structure App 20030094628 - Yeh, Nai Hua ; et al.	2003-05-22
Stacked package structure of image sensor Grant 6,559,539 - Tu , et al. May 6, 2	2003-05-06
Module Card And A Method For Manufacturing The Same App 20030071129 - Ho, Mon Nan ; et al.	2003-04-17
Stacked structure for memory chips Grant 6,472,736 - Yeh , et al. October 29, 2	2002-10-29
Stacked semiconductor package structure having films and method for manufacturing the films App 20020151102 - Wu, Jichen ; et al.	2002-10-17
Method for manufacturing a package structure of integrated circuits App 20020130391 - Yeh, Nai Hua ; et al.	2002-09-19
Stacked package structure of image sensor App 20020096729 - Tu, Hsiu Wen ; et al.	2002-07-25
Structure of stacked integrated circuits and method for manufacturing the same App 20020096762 - Chen, Wen Chuan ; et al.	2002-07-25
Stacked package structure of image sensor App 20020096753 - Tu, Hsiu Wen ; et al.	2002-07-25
Stacked structure of integrated circuits App 20020096754 - Chen, Wen Chuan ; et al.	2002-07-25
Package structure of an integrated circuit App 20020096747 - Yeh, Nai Hua ; et al.	2002-07-25
Integrated circuit structure having an adhesive agent and method for manufacturing the same App 20020096751 - Chen, Wen Chuan ; et al.	2002-07-25
Structure Of Stacked Integrated Circuits And Method For Manufacturing The Same App 20020096761 - Chen, Wen Chuan ; et al.	2002-07-25
Stacked package structure of image sensor App 20020096730 - Tu, Hsiu Wen ; et al.	2002-07-25
Package structure of integrated circuits and method for packaging the same App 20020096766 - Chen, Wen Chuan ; et al.	2002-07-25
Stacked structure of semiconductor means and method for manufacturing the same Grant 6,400,007 - Wu , et al. June 4, 2	2002-06-04
Stackable integrated circuit App 20020043709 - Yeh, Nai Hua ; et al.	2002-04-18

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