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Patent applications and USPTO patent grants for Yeh; Jia-Fong.The latest application filed is for "method for fabricating package structure".
Patent | Date |
---|---|
Method for fabricating package structure having encapsulate sensing chip Grant 11,404,361 - Tang , et al. August 2, 2 | 2022-08-02 |
Method For Fabricating Package Structure App 20210066173 - Tang; Shao-Tzu ;   et al. | 2021-03-04 |
Package structure and method for fabricating the same Grant 10872847 - | 2020-12-22 |
Package Structure And Method For Fabricating The Same App 20180342446 - Tang; Shao-Tzu ;   et al. | 2018-11-29 |
Package structure and method for fabricating the same Grant 9,978,673 - Tang , et al. May 22, 2 | 2018-05-22 |
Package Structure And Method For Fabricating The Same App 20180061747 - Tang; Shao-Tzu ;   et al. | 2018-03-01 |
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