Patent | Date |
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Trench power semiconductor and method of making the same Grant 10,680,076 - Hsu , et al. | 2020-06-09 |
Trench Power Semiconductor And Method Of Making The Same App 20200075739 - HSU; HSIU-WEN ;   et al. | 2020-03-05 |
Manufacturing method of a trench power semiconductor device Grant 10,559,674 - Hsu , et al. Feb | 2020-02-11 |
Trench power semiconductor and method of making the same Grant 10,516,027 - Hsu , et al. Dec | 2019-12-24 |
Trench power semiconductor component and method of manufacturing the same Grant 10,497,782 - Hsu , et al. De | 2019-12-03 |
Semiconductor Device And Method For Manufacturing The Same App 20190019869 - HSU; Hsiu-Wen ;   et al. | 2019-01-17 |
Trench Power Semiconductor And Method Of Making The Same App 20190006479 - HSU; HSIU-WEN ;   et al. | 2019-01-03 |
Manufacturing Method Of A Trench Power Semiconductor Device App 20190006489 - HSU; HSIU-WEN ;   et al. | 2019-01-03 |
Trench Power Semiconductor Component And Method Of Manufacturing The Same App 20180337236 - HSU; HSIU-WEN ;   et al. | 2018-11-22 |
Semiconductor device and method for manufacturing the same Grant 9,755,028 - Lee , et al. September 5, 2 | 2017-09-05 |
Method for manufacturing termination structure of semiconductor device Grant 9,722,035 - Yeh , et al. August 1, 2 | 2017-08-01 |
Method For Manufacturing Termination Structure Of Semiconductor Device App 20160380061 - YEH; Chun-Ying ;   et al. | 2016-12-29 |
Super Junction Device And Method Of Manufacturing The Same App 20160336440 - HSU; Hsiu-Wen ;   et al. | 2016-11-17 |
Termination structure of semiconductor device and method for manufacturing the same Grant 9,490,134 - Yeh , et al. November 8, 2 | 2016-11-08 |
Semiconductor Device And Method For Manufacturing The Same App 20160163805 - LEE; Yuan-Ming ;   et al. | 2016-06-09 |
Package structure and packaging method of wafer level chip scale package Grant 9,299,592 - Hsieh , et al. March 29, 2 | 2016-03-29 |
Trenched power MOSFET with enhanced breakdown voltage and fabrication method thereof Grant 9,214,531 - Yeh December 15, 2 | 2015-12-15 |
Termination Structure Of Semiconductor Device And Method For Manufacturing The Same App 20150333132 - YEH; Chun-Ying ;   et al. | 2015-11-19 |
Package Structure And Packaging Method Of Wafer Level Chip Scale Package App 20150262843 - Hsieh; Chih-Cheng ;   et al. | 2015-09-17 |
Trench power MOSFET structure fabrication method Grant 9,035,378 - Hsu , et al. May 19, 2 | 2015-05-19 |
Power transistor having a top-side drain and forming method thereof Grant 8,981,485 - Hsu , et al. March 17, 2 | 2015-03-17 |
Trenched power MOSFET with enhanced breakdown voltage and fabrication method thereof Grant 8,975,691 - Yeh March 10, 2 | 2015-03-10 |
Power Transistor Having A Top-side Drain And Forming Method Thereof App 20140361362 - HSU; HSIU-WEN ;   et al. | 2014-12-11 |
Trench Power Mosfet Structure Fabrication Method App 20140349456 - HSU; Hsiu-Wen ;   et al. | 2014-11-27 |
Trench power MOSFET structure and fabrication method thereof Grant 8,872,266 - Hsu , et al. October 28, 2 | 2014-10-28 |
Trench power MOSFET and fabrication method thereof Grant 8,872,265 - Yeh , et al. October 28, 2 | 2014-10-28 |
Fabrication method of trenched power semiconductor device with source trench Grant 8,846,469 - Yeh , et al. September 30, 2 | 2014-09-30 |
Trenched Power Mosfet With Enhanced Breakdown Voltage And Fabrication Method Thereof App 20140120670 - YEH; CHUN-YING | 2014-05-01 |
Trenched Power Mosfet With Enhanced Breakdown Voltage And Fabrication Method Thereof App 20140042534 - YEH; Chun-Ying | 2014-02-13 |
Trench Power Mosfet And Fabrication Method Thereof App 20130292761 - YEH; CHUN YING ;   et al. | 2013-11-07 |
Power semiconductor structure with schottky diode Grant 8,525,256 - Hsu , et al. September 3, 2 | 2013-09-03 |
Fabrication method of a power semicondutor structure with schottky diode Grant 8,354,315 - Hsu , et al. January 15, 2 | 2013-01-15 |
Fabrication Method Of Trenched Power Semiconductor Device With Source Trench App 20120322217 - YEH; CHUN YING ;   et al. | 2012-12-20 |
Power Semiconductor Structure With Schottky Diode And Fabrication Method Thereof App 20120267713 - HSU; HSIU WEN ;   et al. | 2012-10-25 |
Fabrication method of self-aligned trenched power semiconductor structure Grant 8,283,230 - Yeh October 9, 2 | 2012-10-09 |
Fabrication method of trenched metal-oxide-semiconductor device Grant 8,088,662 - Yeh January 3, 2 | 2012-01-03 |
Power Semiconductor Structure With Schottky Diode And Fabrication Method Thereof App 20110316077 - HSU; HSIU WEN ;   et al. | 2011-12-29 |
Fabrication Method Of Self-aligned Trenched Power Semiconductor Structure App 20110306194 - YEH; Chun Ying | 2011-12-15 |
Fabrication Method Of Trenched Metal-oxide-semiconductor Device App 20110230025 - YEH; CHUN YING | 2011-09-22 |
Trenched power semiconductor structure with schottky diode and fabrication method thereof Grant 7,994,001 - Hsu , et al. August 9, 2 | 2011-08-09 |
Fabrication method of trenched metal-oxide-semiconductor device Grant 7,977,192 - Yeh July 12, 2 | 2011-07-12 |
Fabrication Method Of Trenched Metal-oxide-semiconductor Device App 20100151642 - YEH; CHUN YING | 2010-06-17 |
Semiconductor device and complementary metal-oxide-semiconductor field effect transistor Grant 7,538,396 - Ma , et al. May 26, 2 | 2009-05-26 |
Complementary metal-oxide-semiconductor transistor for avoiding a latch-up problem Grant 7,514,754 - Ma , et al. April 7, 2 | 2009-04-07 |
Complementary metal-oxide-semiconductor field effect transistor Grant 7,411,271 - Ma , et al. August 12, 2 | 2008-08-12 |
Complementary Metal-oxide-semiconductor Field Effect Transistor App 20080173949 - Ma; Shih-Kuei ;   et al. | 2008-07-24 |
Semiconductor Device And Complementary Metal-oxide-semiconductor Field Effect Transistor App 20080173948 - Ma; Shih-Kuei ;   et al. | 2008-07-24 |
Semiconductor Device And Complementary Metal-oxide-semiconductor Transistor App 20080173951 - Ma; Shih-Kuei ;   et al. | 2008-07-24 |