Patent | Date |
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Polysilicon Design for Replacement Gate Technology App 20210288163 - Chuang; Harry-Hak-Lay ;   et al. | 2021-09-16 |
Package With Metal-insulator-metal Capacitor And Method Of Manufacturing The Same App 20210217691 - Chen; Shuo-Mao ;   et al. | 2021-07-15 |
Interconnect structure for package-on-package devices Grant 11,037,861 - Hung , et al. June 15, 2 | 2021-06-15 |
Polysilicon design for replacement gate technology Grant 11,018,241 - Chuang , et al. May 25, 2 | 2021-05-25 |
Package with metal-insulator-metal capacitor and method of manufacturing the same Grant 10,971,441 - Chen , et al. April 6, 2 | 2021-04-06 |
Polysilicon Design for Replacement Gate Technology App 20200279935 - Chuang; Harry-Hak-Lay ;   et al. | 2020-09-03 |
Polysilicon design for replacement gate technology Grant 10,658,492 - Chuang , et al. | 2020-05-19 |
Interconnect Structure for Package-on-Package Devices App 20200083145 - Hung; Jui-Pin ;   et al. | 2020-03-12 |
Package With Metal-insulator-metal Capacitor And Method Of Manufacturing The Same App 20200020623 - Chen; Shuo-Mao ;   et al. | 2020-01-16 |
Interconnect structure for package-on-package devices Grant 10,515,875 - Hung , et al. Dec | 2019-12-24 |
Polysilicon Design for Replacement Gate Technology App 20190386116 - Chuang; Harry-Hak-Lay ;   et al. | 2019-12-19 |
Package with metal-insulator-metal capacitor and method of manufacturing the same Grant 10,475,731 - Chen , et al. Nov | 2019-11-12 |
Polysilicon design for replacement gate technology Grant 10,403,736 - Chuang , et al. Sep | 2019-09-03 |
Interconnect Structure for Package-on-Package Devices and a Method of Fabricating App 20190252296 - Hung; Jui-Pin ;   et al. | 2019-08-15 |
Package With Metal-insulator-metal Capacitor And Method Of Manufacturing The Same App 20190229048 - Chen; Shuo-Mao ;   et al. | 2019-07-25 |
Package with metal-insulator-metal capacitor and method of manufacturing the same Grant 10,276,484 - Chen , et al. | 2019-04-30 |
Interconnect structure for package-on-package devices Grant 10,269,685 - Hung , et al. | 2019-04-23 |
Polysilicon Design for Replacement Gate Technology App 20190035914 - Chuang; Harry-Hak-Lay ;   et al. | 2019-01-31 |
Package with metal-insulator-metal capacitor and method of manufacturing the same Grant 10,153,205 - Yu , et al. Dec | 2018-12-11 |
Polysilicon design for replacement gate technology Grant 10,084,061 - Chuang , et al. September 25, 2 | 2018-09-25 |
Interconnect Structure for Package-on-Package Devices and a Method of Fabricating App 20180211901 - Hung; Jui-Pin ;   et al. | 2018-07-26 |
Polysilicon Design for Replacement Gate Technology App 20180212036 - Chuang; Harry-Hak-Lay ;   et al. | 2018-07-26 |
Package With Metal-insulator-metal Capacitor And Method Of Manufacturing The Same App 20180211908 - Chen; Shuo-Mao ;   et al. | 2018-07-26 |
Package with metal-insulator-metal capacitor and method of manufacturing the same Grant 9,960,106 - Chen , et al. May 1, 2 | 2018-05-01 |
Polysilicon design for replacement gate technology Grant 9,929,251 - Chuang , et al. March 27, 2 | 2018-03-27 |
Interconnect structure for package-on-package devices and a method of fabricating Grant 9,922,903 - Hung , et al. March 20, 2 | 2018-03-20 |
Polysilicon Design for Replacement Gate Technology App 20170278948 - Chuang; Harry-Hak-Lay ;   et al. | 2017-09-28 |
Polysilicon design for replacement gate technology Grant 9,679,988 - Chuang , et al. June 13, 2 | 2017-06-13 |
Interconnect Structure for Package-on-Package Devices and a Method of Fabricating App 20170025397 - Hung; Jui-Pin ;   et al. | 2017-01-26 |
Interconnect structure for package-on-package devices and a method of fabricating Grant 9,460,987 - Hung , et al. October 4, 2 | 2016-10-04 |
Integrated circuit metal gate structure having tapered profile Grant 9,455,344 - Chuang , et al. September 27, 2 | 2016-09-27 |
Package With Metal-insulator-metal Capacitor And Method Of Manufacturing The Same App 20160118301 - Yu; Chen-Hua ;   et al. | 2016-04-28 |
Package with metal-insulator-metal capacitor and method of manufacturing the same Grant 9,263,511 - Yu , et al. February 16, 2 | 2016-02-16 |
Photo alignment mark for a gate last process Grant 9,263,396 - Shen , et al. February 16, 2 | 2016-02-16 |
Interconnect Structure for Package-on-Package Devices App 20150255447 - Hung; Jui-Pin ;   et al. | 2015-09-10 |
Method of fabricating interconnect structure for package-on-package devices Grant 9,048,222 - Hung , et al. June 2, 2 | 2015-06-02 |
Packages with passive devices and methods of forming the same Grant 9,040,381 - Yu , et al. May 26, 2 | 2015-05-26 |
Polysilicon Design For Replacement Gate Technology App 20150132902 - Chuang; Harry-Hak-Lay ;   et al. | 2015-05-14 |
Dishing-free gap-filling with multiple CMPs Grant 8,932,951 - Wu , et al. January 13, 2 | 2015-01-13 |
Polysilicon design for replacement gate technology Grant 8,890,260 - Chuang , et al. November 18, 2 | 2014-11-18 |
Interconnect Structure for Package-on-Package Devices App 20140252646 - Hung; Jui-Pin ;   et al. | 2014-09-11 |
Integrated Circuit Metal Gate Structure Having Tapered Profile App 20140246712 - CHUANG; Harry-Hak-Lay ;   et al. | 2014-09-04 |
Package With Metal-insulator-metal Capacitor And Method Of Manufacturing The Same App 20140225222 - YU; Chen-Hua ;   et al. | 2014-08-14 |
Integrated circuit metal gate structure and method of fabrication Grant 8,735,235 - Chuang , et al. May 27, 2 | 2014-05-27 |
Photo Alignment Mark for a Gate Last Process App 20140131814 - Shen; Chun-Liang ;   et al. | 2014-05-15 |
Packages with passive devices and methods of forming the same Grant 8,680,647 - Yu , et al. March 25, 2 | 2014-03-25 |
Packages with Passive Devices and Methods of Forming the Same App 20140073091 - Yu; Chen-Hua ;   et al. | 2014-03-13 |
Integrating a first contact structure in a gate last process Grant 8,669,153 - Yeh , et al. March 11, 2 | 2014-03-11 |
Dishing-Free Gap-Filling with Multiple CMPs App 20140030888 - Wu; Ming-Yuan ;   et al. | 2014-01-30 |
Photo alignment mark for a gate last process Grant 8,598,630 - Shen , et al. December 3, 2 | 2013-12-03 |
Package With Metal-insulator-metal Capacitor And Method Of Manufacturing The Same App 20130307119 - CHEN; Shuo-Mao ;   et al. | 2013-11-21 |
Dishing-free gap-filling with multiple CMPs Grant 8,552,522 - Wu , et al. October 8, 2 | 2013-10-08 |
Method of fabricating a dummy gate structure in a gate last process Grant 8,530,326 - Lai , et al. September 10, 2 | 2013-09-10 |
Integrating a First Contact Structure in a Gate Last Process App 20130196496 - Yeh; Chiung-Han ;   et al. | 2013-08-01 |
Packages with Passive Devices and Methods of Forming the Same App 20130168805 - Yu; Chen-Hua ;   et al. | 2013-07-04 |
Gate stack for high-K/metal gate last process Grant 8,476,126 - Chuang , et al. July 2, 2 | 2013-07-02 |
Spacer shape engineering for void-free gap-filling process Grant 8,461,654 - Wu , et al. June 11, 2 | 2013-06-11 |
Integrating a first contact structure in a gate last process Grant 8,394,692 - Yeh , et al. March 12, 2 | 2013-03-12 |
Method Of Fabricating A Dummy Gate Structure In A Gate Last Process App 20120270379 - Lai; Su-Chen ;   et al. | 2012-10-25 |
Dummy gate structure for gate last process Grant 8,237,227 - Lai , et al. August 7, 2 | 2012-08-07 |
Device layout for gate last process Grant 8,125,051 - Chuang , et al. February 28, 2 | 2012-02-28 |
Integrating A First Contact Structure In A Gate Last Process App 20120045889 - Yeh; Chiung-Han ;   et al. | 2012-02-23 |
Spacer Shape Engineering for Void-Free Gap-Filling Process App 20120025329 - Wu; Ming-Yuah ;   et al. | 2012-02-02 |
Method for tuning a work function of high-K metal gate devices Grant 8,105,891 - Yeh , et al. January 31, 2 | 2012-01-31 |
Integrating a first contact structure in a gate last process Grant 8,093,120 - Yeh , et al. January 10, 2 | 2012-01-10 |
Spacer shape engineering for void-free gap-filling process Grant 8,048,752 - Wu , et al. November 1, 2 | 2011-11-01 |
Photoresist etch back method for gate last process Grant 8,039,381 - Yeh , et al. October 18, 2 | 2011-10-18 |
Integrating a first contact structure in a gate last process Grant 8,035,165 - Yeh , et al. October 11, 2 | 2011-10-11 |
Gate Stack For High-k/metal Gate Last Process App 20110195549 - Chuang; Harry Hak-Lay ;   et al. | 2011-08-11 |
Method for tuning a work function of high-k metal gate devices Grant 7,927,943 - Yeh , et al. April 19, 2 | 2011-04-19 |
Polysilicon Design For Replacement Gate Technology App 20110057267 - Chuang; Harry Hak-Lay ;   et al. | 2011-03-10 |
Method For Tuning A Work Function Of High-k Metal Gate Devices App 20110059601 - Yeh; Chiung-Han ;   et al. | 2011-03-10 |
Integrating A First Contact Structure In A Gate Last Process App 20100285658 - Yeh; Chiung-Han ;   et al. | 2010-11-11 |
Photo Alignment Mark For A Gate Last Process App 20100084715 - Shen; Gary ;   et al. | 2010-04-08 |
Method For Tuning A Work Function Of High-k Metal Gate Devices App 20100068877 - Yeh; Chiung-Han ;   et al. | 2010-03-18 |
Photoresist Etch Back Method For Gate Last Process App 20100065926 - Yeh; Chiung-Han ;   et al. | 2010-03-18 |
Dummy gate structure for gate last process App 20100052060 - Lai; Su-Chen ;   et al. | 2010-03-04 |
Integrating A First Contact Structure In A Gate Last Process App 20100052075 - Yeh; Chiung-Han ;   et al. | 2010-03-04 |
Integrated Circuit Metal Gate Structure And Method Of Fabrication App 20100044783 - Chuang; Harry ;   et al. | 2010-02-25 |
Spacer Shape Engineering for Void-Free Gap-Filling Process App 20100022061 - Wu; Ming-Yuan ;   et al. | 2010-01-28 |
Device Layout For Gate Last Process App 20100001369 - Chuang; Harry ;   et al. | 2010-01-07 |
Dishing-free gap-filling with multiple CMPs App 20090286384 - Wu; Ming-Yuan ;   et al. | 2009-11-19 |